KR20170076698A - 집적 회로의 모듈용 가요성 상호 연결부 및 이의 제조 및 사용 방법 - Google Patents

집적 회로의 모듈용 가요성 상호 연결부 및 이의 제조 및 사용 방법 Download PDF

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KR20170076698A
KR20170076698A KR1020177012260A KR20177012260A KR20170076698A KR 20170076698 A KR20170076698 A KR 20170076698A KR 1020177012260 A KR1020177012260 A KR 1020177012260A KR 20177012260 A KR20177012260 A KR 20177012260A KR 20170076698 A KR20170076698 A KR 20170076698A
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flexible
layer
package
conductive
polymer substrate
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Korean (ko)
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미툴 달랄
산제이 굽타
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엠씨10, 인크
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    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

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