JP2017516295A5 - - Google Patents

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JP2017516295A5
JP2017516295A5 JP2016558572A JP2016558572A JP2017516295A5 JP 2017516295 A5 JP2017516295 A5 JP 2017516295A5 JP 2016558572 A JP2016558572 A JP 2016558572A JP 2016558572 A JP2016558572 A JP 2016558572A JP 2017516295 A5 JP2017516295 A5 JP 2017516295A5
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layer
dispensing
pattern element
pattern
sintering
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JP2016558572A
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JP2017516295A (ja
JP6573903B2 (ja
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Priority claimed from PCT/IL2015/050316 external-priority patent/WO2015145439A1/en
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JP2016558572A 2014-03-25 2015-03-25 層交差パターンを製作する方法及びシステム Active JP6573903B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461969900P 2014-03-25 2014-03-25
US61/969,900 2014-03-25
PCT/IL2015/050316 WO2015145439A1 (en) 2014-03-25 2015-03-25 Method and system for fabricating cross-layer pattern

Related Child Applications (1)

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JP2019148754A Division JP2019196019A (ja) 2014-03-25 2019-08-14 層交差パターンを製作する方法及びシステム

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JP2017516295A JP2017516295A (ja) 2017-06-15
JP2017516295A5 true JP2017516295A5 (enExample) 2018-02-22
JP6573903B2 JP6573903B2 (ja) 2019-09-11

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JP2016558572A Active JP6573903B2 (ja) 2014-03-25 2015-03-25 層交差パターンを製作する方法及びシステム
JP2019148754A Pending JP2019196019A (ja) 2014-03-25 2019-08-14 層交差パターンを製作する方法及びシステム

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US (2) US11090858B2 (enExample)
EP (1) EP3123843B1 (enExample)
JP (2) JP6573903B2 (enExample)
KR (1) KR20160138156A (enExample)
CN (1) CN106538074B (enExample)
IL (1) IL248023B (enExample)
WO (1) WO2015145439A1 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6573903B2 (ja) 2014-03-25 2019-09-11 ストラタシス リミテッド 層交差パターンを製作する方法及びシステム
CN107614265A (zh) * 2015-03-25 2018-01-19 斯特拉塔西斯公司 导电油墨原位烧结的方法和系统
JPWO2016189577A1 (ja) * 2015-05-22 2018-03-15 富士機械製造株式会社 配線形成方法
US10394202B2 (en) * 2015-08-21 2019-08-27 Voxel8, Inc. 3D printer calibration and control
JP2017142316A (ja) * 2016-02-09 2017-08-17 三菱電機株式会社 液晶パネルの製造方法
US11613070B2 (en) * 2016-02-23 2023-03-28 Xerox Corporation System and method for building three-dimensional printed objects with materials having different properties
CN106273485B (zh) * 2016-08-17 2018-06-12 苏州秉创科技有限公司 一种基于嵌入式的面曝光3d打印机多屏异显方法
WO2018164672A1 (en) * 2017-03-07 2018-09-13 Nano-Dimension Technologies, Ltd. Composite component fabrication using inkjet printing
CN110831735B (zh) * 2017-06-28 2021-12-14 3M创新有限公司 用于粘合剂和粘合剂制品的增材制造方法
US11229953B2 (en) * 2017-11-29 2022-01-25 Lincoln Global, Inc. Methods and systems for additive manufacturing
WO2019130310A1 (en) 2017-12-28 2019-07-04 Stratasys Ltd. Additive manufacturing employing polyimide-containing formulations
WO2019130312A2 (en) 2017-12-28 2019-07-04 Stratasys Ltd. Additive manufacturing employing solvent-free polyimide-containing formulations
CN111670104B (zh) * 2017-12-28 2023-05-12 斯特拉塔西斯公司 可剥离的牺牲结构的增材制造的方法及系统
WO2020012626A1 (ja) * 2018-07-13 2020-01-16 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置
US11203156B2 (en) 2018-08-20 2021-12-21 NEXA3D Inc. Methods and systems for photo-curing photo-sensitive material for printing and other applications
JP7159777B2 (ja) * 2018-10-15 2022-10-25 セイコーエプソン株式会社 三次元造形物の製造方法
WO2020095340A1 (ja) * 2018-11-05 2020-05-14 株式会社Ｆｕｊｉ 回路形成方法
EP3877151B1 (en) 2018-11-09 2023-02-15 Nexa3D Inc. Three-dimensional printing system
FR3089054A1 (fr) * 2018-11-28 2020-05-29 Commissariat A L'energie Atomique Et Aux Energies Alternatives Fabrication additive de circuits imprimes en 3d
EP3705035A1 (en) * 2019-03-07 2020-09-09 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Manufacturing of skin-compatible electrodes
AU2020241100B2 (en) 2019-03-18 2022-12-01 NEXA3D Inc. Method and system for additive manufacture
US12208566B2 (en) * 2019-03-31 2025-01-28 Stratasys Ltd. Method and system for leveling a layer in freeform fabrication
US10967573B2 (en) 2019-04-02 2021-04-06 NEXA3D Inc. Tank assembly and components thereof for a 3D printing system
US20200388508A1 (en) * 2019-06-04 2020-12-10 Texas Instruments Incorporated Repassivation application for wafer-level chip-scale package
US20220227043A1 (en) * 2019-06-14 2022-07-21 Fuji Corporation Shaping method and shaping device
WO2021013750A1 (en) * 2019-07-19 2021-01-28 Vito Nv A method and system for manufacturing three-dimensional porous structure
JP7250964B2 (ja) * 2020-02-10 2023-04-03 株式会社Fuji 回路形成装置、および回路形成方法
JP7358614B2 (ja) * 2020-03-02 2023-10-10 株式会社Fuji 配線形成方法
PL3925786T3 (pl) * 2020-06-18 2024-03-25 Heraeus Electronics Gmbh & Co. Kg Sposób drukowania przyrostowego do drukowania wzoru funkcjonalnego nadruku na powierzchni obiektu trójwymiarowego, powiązany program komputerowy i nośnik odczytywany komputerowo
JP7543432B2 (ja) * 2020-11-20 2024-09-02 株式会社Fuji ３次元造形物の製造方法、及び製造装置
KR102481641B1 (ko) * 2021-01-20 2022-12-27 한양대학교 산학협력단 복합체 제조방법 및 이에 의해 제조된 복합체
JPWO2023058111A1 (enExample) * 2021-10-05 2023-04-13
JPWO2023079607A1 (enExample) * 2021-11-04 2023-05-11

Family Cites Families (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1050726A (en) 1973-04-14 1979-03-20 Ciba-Geigy Ag Method of making a foundry mould or core with an anaerobically cured adhesive
US4196033A (en) 1977-03-08 1980-04-01 Dai Nippon Insatsu Kabushiki Kaisha Process for producing decorative sheets
US4542165A (en) 1983-09-08 1985-09-17 Sanyo Chemical Industries, Ltd. Polyurethane based on epoxy-containing polymer polyol and process for making the same
JPH0625204B2 (ja) 1985-08-28 1994-04-06 住友化学工業株式会社 ビニル系単量体の重合成形方法
JP2773366B2 (ja) 1990-03-19 1998-07-09 富士通株式会社 多層配線基板の形成方法
US6175422B1 (en) * 1991-01-31 2001-01-16 Texas Instruments Incorporated Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data
JPH04296542A (ja) 1991-03-27 1992-10-20 Hitachi Chem Co Ltd 積層板の製造方法
DE4420012A1 (de) 1994-06-08 1995-12-14 Basf Ag Verfahren zur Herstellung von strahlungshärtbaren Acrylaten
US5614602A (en) 1996-07-09 1997-03-25 Betzdearborn Inc. Process for the preparation of aqueous dispersion polymers
US6541709B1 (en) 1996-11-01 2003-04-01 International Business Machines Corporation Inherently robust repair process for thin film circuitry using uv laser
AU6036199A (en) 1998-09-18 2000-04-10 Jean-Pierre Durand Microwave polymerization system for dentistry
US6259962B1 (en) 1999-03-01 2001-07-10 Objet Geometries Ltd. Apparatus and method for three dimensional model printing
US6096469A (en) 1999-05-18 2000-08-01 3M Innovative Properties Company Ink receptor media suitable for inkjet printing
US6658314B1 (en) 1999-10-06 2003-12-02 Objet Geometries Ltd. System and method for three dimensional model printing
JP2001144217A (ja) 1999-11-17 2001-05-25 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
US6850334B1 (en) 2000-01-18 2005-02-01 Objet Geometries Ltd System and method for three dimensional model printing
US20050104241A1 (en) 2000-01-18 2005-05-19 Objet Geometried Ltd. Apparatus and method for three dimensional model printing
US6569373B2 (en) 2000-03-13 2003-05-27 Object Geometries Ltd. Compositions and methods for use in three dimensional model printing
US20030207959A1 (en) 2000-03-13 2003-11-06 Eduardo Napadensky Compositions and methods for use in three dimensional model printing
US7300619B2 (en) 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
US6673143B2 (en) 2000-03-23 2004-01-06 Shin-Etsu Chemical Co., Ltd. Aqueous slurry of rare earth hydroxide particles
JP3805266B2 (ja) 2002-02-27 2006-08-02 Ｕｈｔ株式会社 セラミック積層体の製造装置
US6467897B1 (en) 2001-01-08 2002-10-22 3M Innovative Properties Company Energy curable inks and other compositions incorporating surface modified, nanometer-sized particles
JP2005509001A (ja) 2001-10-29 2005-04-07 セリクス， インコーポレイテッド 投薬形態の三次元懸濁液プリンティング
US20030151167A1 (en) 2002-01-03 2003-08-14 Kritchman Eliahu M. Device, system and method for accurate printing of three dimensional objects
US6881691B2 (en) 2002-05-07 2005-04-19 Uop Llc Use of zeolites in preparing low temperature ceramics
JP2004055965A (ja) 2002-07-23 2004-02-19 Seiko Epson Corp 配線基板及び半導体装置並びにこれらの製造方法、回路基板並びに電子機器
EP2295227A3 (en) 2002-12-03 2018-04-04 Stratasys Ltd. Apparatus and method for printing of three-dimensional objects
CN103358550B (zh) 2003-05-01 2016-03-30 斯特拉特西斯有限公司 快速成型装置
GB0403510D0 (en) 2004-02-18 2004-03-24 Mantra Internat Ltd Bioadhesive compositions and their use in medical electrodes
DE102004033153B4 (de) 2004-06-11 2007-03-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Glühkerze und Verfahren zu ihrer Herstellung
JP2006024768A (ja) * 2004-07-08 2006-01-26 Seiko Epson Corp 配線基板、配線基板の製造方法および電子機器
JP4207860B2 (ja) 2004-07-14 2009-01-14 セイコーエプソン株式会社 層形成方法、配線基板、電気光学装置、および電子機器
JP4096962B2 (ja) 2004-08-20 2008-06-04 セイコーエプソン株式会社 多層構造形成方法、配線基板および電子機器の製造方法
JP4059260B2 (ja) * 2004-09-27 2008-03-12 セイコーエプソン株式会社 多層構造形成方法、配線基板の製造方法、および電子機器の製造方法
JP4850487B2 (ja) 2005-11-07 2012-01-11 富士フイルム株式会社 プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
US20070165075A1 (en) 2006-01-19 2007-07-19 3M Innovative Properties Company Flexible circuits having ink-resistant covercoats
WO2007114895A2 (en) 2006-04-06 2007-10-11 Z Corporation Production of three-dimensional objects by use of electromagnetic radiation
WO2008018601A1 (fr) 2006-08-11 2008-02-14 Tosoh Corporation Composition de catalyseur pour la production d'une résine de polyuréthane et procédé de production de la résine de polyuréthane
US7576000B2 (en) 2006-12-22 2009-08-18 Palo Alto Research Center Incorporated Molded dielectric layer in print-patterned electronic circuits
EP2109528B1 (en) 2007-01-10 2017-03-15 3D Systems Incorporated Three-dimensional printing material system with improved color, article performance, and ease of use and method using it
US7968626B2 (en) 2007-02-22 2011-06-28 Z Corporation Three dimensional printing material system and method using plasticizer-assisted sintering
TWI425899B (zh) * 2007-02-23 2014-02-01 因發瑪塔系統有限公司 功能性印刷電路板快速製造方法及裝置
JP2009021552A (ja) 2007-06-14 2009-01-29 Seiko Epson Corp コンタクトホール形成方法、導電ポスト形成方法、配線パターン形成方法、多層配線基板の製造方法、及び電子機器製造方法
JP5213375B2 (ja) 2007-07-13 2013-06-19 富士フイルム株式会社 顔料分散液、硬化性組成物、それを用いるカラーフィルタ及び固体撮像素子
EP2664443B1 (en) 2007-07-25 2021-08-25 Stratasys Ltd. Solid freeform fabrication using a plurality of modeling materials
US8534787B2 (en) 2007-10-11 2013-09-17 Camtek Ltd. Method and system for printing on a printed circuit board
US20090107546A1 (en) 2007-10-29 2009-04-30 Palo Alto Research Center Incorporated Co-extruded compositions for high aspect ratio structures
JP4483929B2 (ja) 2007-10-30 2010-06-16 セイコーエプソン株式会社 導体パターン形成用インク、導体パターンおよび配線基板
US8693079B2 (en) 2008-01-31 2014-04-08 Ajjer, Llc Sealants and conductive busbars for chromogenic devices
US20100000762A1 (en) 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
US7988903B2 (en) 2008-07-02 2011-08-02 Zeon Chemicals L.P. Fast curing vulcanizable multi-part elastomer composition, and process for blending, injection molding and curing of elastomer composition
EP2411560A1 (en) 2009-03-24 2012-02-01 Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd. Process for sintering nanoparticles at low temperatures
JP5453924B2 (ja) * 2009-05-22 2014-03-26 コニカミノルタ株式会社 導電膜パターン及び導電膜パターンの形成方法
US7973195B2 (en) 2009-07-22 2011-07-05 Kemira Oyj Process for unsaturated quaternary ammonium salt
JP2011031591A (ja) 2009-08-06 2011-02-17 Mitsubishi Rayon Co Ltd ナノ物質含有成形体及びその製造方法
JP2011054620A (ja) 2009-08-31 2011-03-17 Murata Mfg Co Ltd 多層配線基板の製造方法
US8906818B2 (en) 2009-10-13 2014-12-09 Recapping, Inc. High energy density ionic dielectric materials and devices
GB0921951D0 (en) 2009-12-16 2010-02-03 Fujifilm Mfg Europe Bv Curable compositions and membranes
CN103119109B (zh) 2010-09-22 2015-12-09 积水化学工业株式会社 喷墨用固化性组合物及电子部件的制造方法
JP5409575B2 (ja) 2010-09-29 2014-02-05 富士フイルム株式会社 金属膜材料の製造方法、及びそれを用いた金属膜材料
ES2777174T3 (es) 2011-04-17 2020-08-04 Stratasys Ltd Sistema y método para la fabricación aditiva de un objeto
WO2012168941A1 (en) 2011-06-09 2012-12-13 Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd. Flexible transparent conductive coatings by direct room temperature evaporative lithography
JP5971250B2 (ja) 2011-08-03 2016-08-17 日立化成株式会社 組成物セット、導電性基板及びその製造方法並びに導電性接着材組成物
US20140314966A1 (en) 2011-10-05 2014-10-23 Applied Nanotech Holdings, Inc. Sintering Metallic Inks on Low Melting Point Substrates
JP2013203570A (ja) 2012-03-27 2013-10-07 Seiko Epson Corp 透光性アルミナおよび透光性アルミナの製造方法
GB201206415D0 (en) 2012-04-12 2012-05-23 Fujifilm Mfg Europe Bv Curable compositions and membranes
CN104303238B (zh) 2012-04-26 2016-11-09 国立大学法人大阪大学 透明导电性墨以及透明导电图案形成方法
JP5275498B1 (ja) 2012-07-03 2013-08-28 石原薬品株式会社 導電膜形成方法及び焼結進行剤
WO2014050688A1 (ja) 2012-09-27 2014-04-03 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
CN105027690A (zh) 2013-01-31 2015-11-04 耶路撒冷希伯来大学伊森姆研究发展有限公司 三维导电性图案和用于制造三维导电性图案的油墨
JP5700864B2 (ja) 2013-05-15 2015-04-15 石原ケミカル株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
SG11201510615SA (en) 2013-06-24 2016-01-28 Harvard College Printed three-dimensional (3d) functional part and method of making
WO2015014824A1 (en) 2013-07-31 2015-02-05 Basf Se Reverse-phase polymerisation process
US20150104562A1 (en) 2013-10-10 2015-04-16 Omega Optics, Inc. Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems
RU2712267C2 (ru) 2014-01-10 2020-01-28 Джонсон энд Джонсон Консьюмер Инк. Способ изготовления таблеток с использованием радиочастотного излучения и частиц с поглощающим покрытием
US9487443B2 (en) 2014-03-14 2016-11-08 Ricoh Company, Ltd. Layer stack formation powder material, powder layer stack formation hardening liquid, layer stack formation material set, and layer stack object formation method
JP6573903B2 (ja) 2014-03-25 2019-09-11 ストラタシス リミテッド 層交差パターンを製作する方法及びシステム
US10676399B2 (en) 2014-06-23 2020-06-09 Applied Cavitation, Inc. Systems and methods for additive manufacturing using ceramic materials
CN107614265A (zh) 2015-03-25 2018-01-19 斯特拉塔西斯公司 导电油墨原位烧结的方法和系统
WO2017146741A1 (en) 2016-02-26 2017-08-31 Hewlett-Packard Development Company, L.P. Color printing and three-dimensional (3d) printing

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