PL3925786T3 - Sposób drukowania przyrostowego do drukowania wzoru funkcjonalnego nadruku na powierzchni obiektu trójwymiarowego, powiązany program komputerowy i nośnik odczytywany komputerowo - Google Patents
Sposób drukowania przyrostowego do drukowania wzoru funkcjonalnego nadruku na powierzchni obiektu trójwymiarowego, powiązany program komputerowy i nośnik odczytywany komputerowoInfo
- Publication number
- PL3925786T3 PL3925786T3 PL20180763.3T PL20180763T PL3925786T3 PL 3925786 T3 PL3925786 T3 PL 3925786T3 PL 20180763 T PL20180763 T PL 20180763T PL 3925786 T3 PL3925786 T3 PL 3925786T3
- Authority
- PL
- Poland
- Prior art keywords
- printing
- readable medium
- dimensional object
- print pattern
- computer program
- Prior art date
Links
- 239000000654 additive Substances 0.000 title 1
- 230000000996 additive effect Effects 0.000 title 1
- 238000004590 computer program Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
- B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J25/00—Actions or mechanisms not otherwise provided for
- B41J25/24—Case-shift mechanisms; Fount-change arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/49—Nc machine tool, till multiple
- G05B2219/49007—Making, forming 3-D object, model, surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ink Jet (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Dot-Matrix Printers And Others (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20180763.3A EP3925786B1 (en) | 2020-06-18 | 2020-06-18 | Additive printing method for printing a functional print pattern on a surface of a three-dimensional object, associated computer program and computer-readable medium |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3925786T3 true PL3925786T3 (pl) | 2024-03-25 |
Family
ID=71108460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL20180763.3T PL3925786T3 (pl) | 2020-06-18 | 2020-06-18 | Sposób drukowania przyrostowego do drukowania wzoru funkcjonalnego nadruku na powierzchni obiektu trójwymiarowego, powiązany program komputerowy i nośnik odczytywany komputerowo |
Country Status (7)
Country | Link |
---|---|
US (1) | US11878473B2 (pl) |
EP (1) | EP3925786B1 (pl) |
JP (1) | JP7194777B2 (pl) |
KR (1) | KR102478345B1 (pl) |
CN (1) | CN113815319B (pl) |
PL (1) | PL3925786T3 (pl) |
TW (1) | TWI788881B (pl) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022127793A (ja) * | 2021-02-22 | 2022-09-01 | セイコーエプソン株式会社 | 立体物印刷装置 |
Family Cites Families (36)
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CA1319295C (en) * | 1988-03-18 | 1993-06-22 | Akio Yano | Printing head of wire-dot impact printer |
DE19839902C1 (de) * | 1998-09-02 | 2000-05-25 | Laserline Ges Fuer Entwicklung | Optische Anordnung zur Verwendung bei einer Laserdiodenanordnung sowie Diodenlaser |
JP2001010032A (ja) * | 1999-06-30 | 2001-01-16 | Canon Inc | 立体面印刷装置、接触型印刷ヘッド、立体面印刷装置の印刷方法 |
JP2001260329A (ja) | 2000-03-22 | 2001-09-25 | Minolta Co Ltd | 立体物印刷装置および立体物印刷方法 |
JP2002067171A (ja) * | 2000-08-25 | 2002-03-05 | Canon Inc | 目的物生成装置、目的物生成方法、及び記憶媒体 |
KR20030069916A (ko) * | 2003-06-20 | 2003-08-27 | 정종숙 | 3차원 물체의 표면에 직접 인쇄할 수 있는 잉크젯 방식의인쇄장치 |
US7360853B2 (en) * | 2004-03-04 | 2008-04-22 | Fujifilm Dimatix, Inc. | Morphology-corrected printing |
JP2008263094A (ja) | 2007-04-13 | 2008-10-30 | Taiyosha Electric Co Ltd | チップ抵抗器の製造方法 |
WO2009123624A1 (en) | 2008-04-01 | 2009-10-08 | Hewlett-Packard Development Company, L.P. | Method and system for coating an article |
EP2433716A1 (en) * | 2010-09-22 | 2012-03-28 | Hexagon Technology Center GmbH | Surface spraying device with a nozzle control mechanism and a corresponding method |
US9061521B2 (en) | 2010-09-22 | 2015-06-23 | 3Dphotoworks Llc | Method and apparatus for three-dimensional digital printing |
PL2632696T3 (pl) * | 2010-10-27 | 2021-03-08 | Rize Inc. | Sposób i urządzenie do wytwarzania obiektów trójwymiarowych |
CN102490496B (zh) * | 2011-12-07 | 2014-02-26 | 东莞市盛雄激光设备有限公司 | 激光打标桶枕形失真补偿值确定方法和装置,激光打标方法和装置 |
US10556417B2 (en) | 2012-05-07 | 2020-02-11 | Luxexcel Holding B.V. | Method for printing a three-dimensional structure, method for controlling a print head and a printed article |
KR101390391B1 (ko) | 2012-05-21 | 2014-05-27 | 엔젯 주식회사 | 정전기력을 이용하는 3차원 형상 표면 인쇄장치 |
US20130342592A1 (en) | 2012-06-26 | 2013-12-26 | Apple Inc. | Inkjet printer for printing on a three-dimensional object and related apparatus and method |
US20150029262A1 (en) | 2012-10-18 | 2015-01-29 | Durst Phototechnik Digital Technlogy GmbH | Two-dimensional method for inkjet printing with printhead alignment |
JP6260353B2 (ja) | 2013-04-23 | 2018-01-17 | 株式会社リコー | 情報処理装置、情報処理方法及び制御プログラム |
WO2015145439A1 (en) * | 2014-03-25 | 2015-10-01 | Stratasys Ltd. | Method and system for fabricating cross-layer pattern |
JP6441955B2 (ja) | 2014-11-14 | 2018-12-19 | 株式会社Fuji | 配線基板作製方法および配線基板作製装置 |
WO2016123740A1 (zh) * | 2015-02-02 | 2016-08-11 | 浙江大学 | 一种可计算的三维彩色印刷方法 |
JP6797814B2 (ja) | 2015-04-24 | 2020-12-09 | キャノン プロダクション プリンティング ネザーランド ビーブイ | プリンタのフラットベッド面上の媒体の位置を確立するための方法 |
DE102016225967A1 (de) * | 2016-02-17 | 2017-08-17 | Heidelberger Druckmaschinen Ag | Verfahren zum Tintenstrahl-Bedrucken wenigstens eines gekrümmten Bereichs der Oberfläche eines Objekts |
EP3429823B1 (en) * | 2016-05-12 | 2021-04-07 | Hewlett-Packard Development Company, L.P. | Method of controlling an additive manufacturing apparatus comprising selecting a task , apparatus and machine readable storage medium |
EP3254828A1 (en) * | 2016-06-10 | 2017-12-13 | OCE Holding B.V. | Printing system and method for printing an object with a pattern on a surface of the object |
JP6440877B2 (ja) | 2017-04-28 | 2018-12-19 | 株式会社ウィルビイ | 立体物印刷システムおよび立体物印刷方法 |
DE102017114280B4 (de) | 2017-06-26 | 2024-04-11 | Jörg R. Bauer | Verfahren zum Bedrucken einer gekrümmten Oberfläche sowie Vorrichtung zum Bedrucken dreidimensionaler Oberflächen |
US10293601B2 (en) * | 2017-07-11 | 2019-05-21 | The Boeing Company | Automated controls for contoured surface inkjet printing |
JP7024412B2 (ja) | 2018-01-09 | 2022-02-24 | 株式会社リコー | 液体吐出装置、液体吐出方法、液体吐出プログラム及び画像形成装置 |
FR3078194B1 (fr) * | 2018-02-21 | 2020-02-07 | Natural Grass | Procede pour reproduire un motif a marquer sur une zone engazonnee |
CN110920070A (zh) | 2018-09-04 | 2020-03-27 | 三纬国际立体列印科技股份有限公司 | 3d实体模型的自动上色方法 |
US10828889B2 (en) * | 2018-10-05 | 2020-11-10 | Southwest Research Institute | Printing using an externally generated reference |
CN109572228B (zh) | 2018-12-19 | 2020-01-31 | 中山大学 | 喷墨打印机、印刷控制方法及装置、印刷工艺方法 |
JP6828795B2 (ja) | 2019-12-05 | 2021-02-10 | オムロン株式会社 | 電子装置およびその製造方法 |
CN111002734B (zh) * | 2019-12-27 | 2022-04-12 | 蒋聘 | 一种多曲面产品的图案喷印方法 |
CN111267488B (zh) * | 2020-03-04 | 2021-06-15 | 深圳市汉森软件有限公司 | 控制喷墨打印机制备幕布折光层的方法、装置、设备及介质 |
-
2020
- 2020-06-18 EP EP20180763.3A patent/EP3925786B1/en active Active
- 2020-06-18 PL PL20180763.3T patent/PL3925786T3/pl unknown
-
2021
- 2021-06-10 KR KR1020210075364A patent/KR102478345B1/ko active IP Right Grant
- 2021-06-15 US US17/347,927 patent/US11878473B2/en active Active
- 2021-06-17 JP JP2021100732A patent/JP7194777B2/ja active Active
- 2021-06-17 CN CN202110671583.0A patent/CN113815319B/zh active Active
- 2021-06-17 TW TW110122052A patent/TWI788881B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP3925786A1 (en) | 2021-12-22 |
CN113815319B (zh) | 2023-11-10 |
TWI788881B (zh) | 2023-01-01 |
JP7194777B2 (ja) | 2022-12-22 |
CN113815319A (zh) | 2021-12-21 |
KR102478345B1 (ko) | 2022-12-15 |
US20210394455A1 (en) | 2021-12-23 |
KR20210157331A (ko) | 2021-12-28 |
US11878473B2 (en) | 2024-01-23 |
EP3925786B1 (en) | 2024-01-10 |
TW202222599A (zh) | 2022-06-16 |
EP3925786C0 (en) | 2024-01-10 |
JP2022000341A (ja) | 2022-01-04 |
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