JP2017120819A - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP2017120819A JP2017120819A JP2015256351A JP2015256351A JP2017120819A JP 2017120819 A JP2017120819 A JP 2017120819A JP 2015256351 A JP2015256351 A JP 2015256351A JP 2015256351 A JP2015256351 A JP 2015256351A JP 2017120819 A JP2017120819 A JP 2017120819A
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- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 abstract description 34
- 230000002040 relaxant effect Effects 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 18
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
Abstract
Description
L4>L3>L2>L1
Δ2>Δ1
5.0×Δ1≧Δ2≧1.1×Δ1
L4>L2>L3>L1
Δ2>Δ1
5.0×Δ1≧Δ2≧1.1×Δ1
Claims (5)
- 直方体形状を呈し、互いに対向する一対の端面と、前記端面同士を連結する側面と、を有し、内部導体が前記一対の端面に露出している素体と、
前記一対の端面が対向する第一方向で互いに離間すると共に、前記内部導体に接続された一対の端子電極と、を備え、
前記端子電極は、
前記端面と前記側面とに配置された焼結金属層と、
前記焼結金属層をすべて覆うように配置された導電性樹脂層と、を有し、
前記側面の前記第一方向に直交する第二方向の端部における前記焼結金属層の前記第一方向での長さである第一長さは、前記側面の前記第二方向の中央部における前記焼結金属層の前記第一方向の長さである第二長さよりも短く、
前記端部における前記導電性樹脂層の前記第一方向での長さである第三長さは、前記中央部における前記導電性樹脂層の前記第一方向の長さである第四長さよりも短く、
前記第四長さと前記第三長さとの差は、前記第二長さと前記第一長さとの差よりも大きい、電子部品。 - 前記側面における前記導電性樹脂層の前記第一方向での長さと、前記側面における前記焼結金属層の前記第一方向での長さとの差は、前記第四長さと前記第二長さとの差を最大値とするとともに、前記第三長さと前記第一長さとの差を最小値として、徐々に変化する、請求項1に記載の電子部品。
- 前記第三長さは、前記第二長さよりも長い、請求項1又は2に記載の電子部品。
- 前記第四長さと前記第三長さとの差が、前記第二長さと前記第一長さとの差の1.1倍以上5.0倍以下である、請求項1〜3のいずれか一項に記載の電子部品。
- 前記第三長さは、前記第二長さよりも短い、請求項1又は2に記載の電子部品。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015256351A JP6693125B2 (ja) | 2015-12-28 | 2015-12-28 | 電子部品 |
US15/389,181 US10032559B2 (en) | 2015-12-28 | 2016-12-22 | Electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015256351A JP6693125B2 (ja) | 2015-12-28 | 2015-12-28 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017120819A true JP2017120819A (ja) | 2017-07-06 |
JP6693125B2 JP6693125B2 (ja) | 2020-05-13 |
Family
ID=59088419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015256351A Active JP6693125B2 (ja) | 2015-12-28 | 2015-12-28 | 電子部品 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10032559B2 (ja) |
JP (1) | JP6693125B2 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190093150A (ko) * | 2018-01-31 | 2019-08-08 | 티디케이가부시기가이샤 | 전자 부품 |
KR20190093148A (ko) * | 2018-01-31 | 2019-08-08 | 티디케이가부시기가이샤 | 전자 부품 |
KR20190093149A (ko) * | 2018-01-31 | 2019-08-08 | 티디케이가부시기가이샤 | 전자 부품 |
KR20190121218A (ko) * | 2018-11-16 | 2019-10-25 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR20190121216A (ko) * | 2018-11-13 | 2019-10-25 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
JP2020161517A (ja) * | 2019-03-25 | 2020-10-01 | Tdk株式会社 | 電子部品 |
JP2020161518A (ja) * | 2019-03-25 | 2020-10-01 | Tdk株式会社 | 電子部品 |
KR20200115211A (ko) * | 2019-03-25 | 2020-10-07 | 티디케이가부시기가이샤 | 전자 부품 |
JP2021028938A (ja) * | 2019-08-09 | 2021-02-25 | Tdk株式会社 | 電子部品 |
JP2021028939A (ja) * | 2019-08-09 | 2021-02-25 | Tdk株式会社 | 電子部品 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6943142B2 (ja) * | 2017-10-30 | 2021-09-29 | Tdk株式会社 | 電子部品及び電子部品装置 |
JP6939895B2 (ja) * | 2017-11-02 | 2021-09-22 | 株式会社村田製作所 | サーミスタ素子およびその製造方法 |
JP7139677B2 (ja) * | 2018-05-08 | 2022-09-21 | Tdk株式会社 | 電子部品 |
JP7371328B2 (ja) * | 2019-01-23 | 2023-10-31 | Tdk株式会社 | 積層コイル部品 |
KR20190116186A (ko) | 2019-09-23 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR20210106689A (ko) | 2020-02-21 | 2021-08-31 | 삼성전기주식회사 | 적층형 전자 부품 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011018874A (ja) * | 2009-07-09 | 2011-01-27 | Samsung Electro-Mechanics Co Ltd | セラミックス電子部品 |
JP2013165181A (ja) * | 2012-02-10 | 2013-08-22 | Tdk Corp | 積層電子部品 |
US20130242457A1 (en) * | 2012-03-13 | 2013-09-19 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component |
JP2015053495A (ja) * | 2014-10-07 | 2015-03-19 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05144665A (ja) | 1991-11-18 | 1993-06-11 | Toshiba Corp | 積層セラミツクコンデンサ |
KR101753420B1 (ko) * | 2012-03-13 | 2017-07-03 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
KR101514504B1 (ko) * | 2012-12-31 | 2015-04-22 | 삼성전기주식회사 | 전자부품 및 전자부품 제조방법 |
-
2015
- 2015-12-28 JP JP2015256351A patent/JP6693125B2/ja active Active
-
2016
- 2016-12-22 US US15/389,181 patent/US10032559B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011018874A (ja) * | 2009-07-09 | 2011-01-27 | Samsung Electro-Mechanics Co Ltd | セラミックス電子部品 |
JP2013165181A (ja) * | 2012-02-10 | 2013-08-22 | Tdk Corp | 積層電子部品 |
US20130242457A1 (en) * | 2012-03-13 | 2013-09-19 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component |
JP2013191832A (ja) * | 2012-03-13 | 2013-09-26 | Samsung Electro-Mechanics Co Ltd | 積層セラミック電子部品 |
JP2015053495A (ja) * | 2014-10-07 | 2015-03-19 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
US20160099106A1 (en) * | 2014-10-07 | 2016-04-07 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
Cited By (33)
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US11094465B2 (en) | 2018-01-31 | 2021-08-17 | Tdk Corporation | Electronic component with external electrodes including conductive resin layer |
KR20190093148A (ko) * | 2018-01-31 | 2019-08-08 | 티디케이가부시기가이샤 | 전자 부품 |
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KR102260649B1 (ko) * | 2018-01-31 | 2021-06-07 | 티디케이가부시기가이샤 | 전자 부품 |
US11011310B2 (en) | 2018-01-31 | 2021-05-18 | Tdk Corporation | Electronic component with external electrode including sintered layer and conductive resin layer on the sintered layer |
KR102448667B1 (ko) * | 2018-01-31 | 2022-09-29 | 티디케이가부시기가이샤 | 전자 부품 |
KR102420683B1 (ko) * | 2018-01-31 | 2022-07-15 | 티디케이가부시기가이샤 | 전자 부품 |
US10971306B2 (en) | 2018-01-31 | 2021-04-06 | Tdk Corporation | Electronic component having an external electrode with a conductive resin layer |
KR20190093150A (ko) * | 2018-01-31 | 2019-08-08 | 티디케이가부시기가이샤 | 전자 부품 |
KR20190121216A (ko) * | 2018-11-13 | 2019-10-25 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR102271041B1 (ko) * | 2018-11-13 | 2021-07-01 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR20210080330A (ko) * | 2018-11-13 | 2021-06-30 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR102409107B1 (ko) * | 2018-11-13 | 2022-06-15 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
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Also Published As
Publication number | Publication date |
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US20170186538A1 (en) | 2017-06-29 |
JP6693125B2 (ja) | 2020-05-13 |
US10032559B2 (en) | 2018-07-24 |
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