JP2017008255A - 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法 - Google Patents

保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法 Download PDF

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Publication number
JP2017008255A
JP2017008255A JP2015127417A JP2015127417A JP2017008255A JP 2017008255 A JP2017008255 A JP 2017008255A JP 2015127417 A JP2015127417 A JP 2015127417A JP 2015127417 A JP2015127417 A JP 2015127417A JP 2017008255 A JP2017008255 A JP 2017008255A
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JP
Japan
Prior art keywords
protective film
forming
film
composite sheet
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015127417A
Other languages
English (en)
Japanese (ja)
Inventor
洋一 稲男
Yoichi Inao
洋一 稲男
尚哉 佐伯
Naoya Saeki
尚哉 佐伯
山本　大輔
Daisuke Yamamoto
大輔 山本
裕之 米山
Hiroyuki Yoneyama
裕之 米山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2015127417A priority Critical patent/JP2017008255A/ja
Priority to PCT/JP2015/075100 priority patent/WO2016002975A1/ja
Priority to SG11201610546VA priority patent/SG11201610546VA/en
Priority to CN201580032859.3A priority patent/CN106489189B/zh
Priority to KR1020167034823A priority patent/KR102398753B1/ko
Priority to PH12016502492A priority patent/PH12016502492A1/en
Publication of JP2017008255A publication Critical patent/JP2017008255A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2015127417A 2014-07-03 2015-06-25 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法 Pending JP2017008255A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2015127417A JP2017008255A (ja) 2015-06-25 2015-06-25 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
PCT/JP2015/075100 WO2016002975A1 (ja) 2014-07-03 2015-09-03 保護膜形成用複合シート
SG11201610546VA SG11201610546VA (en) 2014-07-03 2015-09-03 Composite sheet for forming protective film
CN201580032859.3A CN106489189B (zh) 2015-06-25 2015-09-03 保护膜形成用复合片
KR1020167034823A KR102398753B1 (ko) 2015-06-25 2015-09-03 보호막 형성용 복합 시트
PH12016502492A PH12016502492A1 (en) 2014-07-03 2016-12-14 Composite sheet for forming protective film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015127417A JP2017008255A (ja) 2015-06-25 2015-06-25 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法

Publications (1)

Publication Number Publication Date
JP2017008255A true JP2017008255A (ja) 2017-01-12

Family

ID=57760935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015127417A Pending JP2017008255A (ja) 2014-07-03 2015-06-25 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法

Country Status (3)

Country Link
JP (1) JP2017008255A (ko)
KR (1) KR102398753B1 (ko)
CN (1) CN106489189B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6989272B2 (ja) * 2017-03-17 2022-01-05 日東電工株式会社 造型マット
JP6360586B1 (ja) * 2017-04-13 2018-07-18 三菱電線工業株式会社 Ｃｍｐ装置のウエハ保持用の弾性膜
CN111417513B (zh) * 2018-03-09 2022-06-03 琳得科株式会社 保护膜形成用复合片及带保护膜的半导体芯片的制造方法
CN111406308B (zh) 2018-03-12 2024-02-13 株式会社力森诺科 半导体密封成形用临时保护膜、带有该膜的引线框和密封成形体、及制造半导体装置的方法
WO2020116281A1 (ja) * 2018-12-05 2020-06-11 リンテック株式会社 保護膜形成用複合シート、及び半導体チップの製造方法
JP7333211B2 (ja) * 2019-06-21 2023-08-24 リンテック株式会社 保護膜形成用複合シート、及び保護膜付き半導体チップの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015016053A1 (ja) * 2013-07-29 2015-02-05 リンテック株式会社 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
WO2015046341A1 (ja) * 2013-09-27 2015-04-02 リンテック株式会社 粘着シート
WO2015046529A1 (ja) * 2013-09-30 2015-04-02 リンテック株式会社 樹脂膜形成用複合シート

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003138228A (ja) * 2001-11-02 2003-05-14 Nitto Denko Corp 半導体ウエハ保護用粘着シート
JP2005203749A (ja) 2003-12-15 2005-07-28 Furukawa Electric Co Ltd:The ウェハ加工用テープおよびその製造方法
KR100885099B1 (ko) * 2003-12-15 2009-02-20 후루카와 덴키 고교 가부시키가이샤 웨이퍼 가공용 테이프 및 그 제조방법
JP4642436B2 (ja) 2004-11-12 2011-03-02 リンテック株式会社 マーキング方法および保護膜形成兼ダイシング用シート
EP1916284A4 (en) * 2005-08-01 2009-03-11 Lintec Corp ADHESIVE SHEET
JP4803721B2 (ja) * 2005-12-22 2011-10-26 株式会社ジェイエスピー ポリエチレン系樹脂積層発泡体
JP5506011B2 (ja) * 2007-03-02 2014-05-28 日東電工株式会社 粘着剤層付き透明導電性フィルムおよびその製造方法
JP5457703B2 (ja) * 2008-03-31 2014-04-02 三井化学株式会社 ダイシングフィルム
TW201134911A (en) * 2010-03-03 2011-10-16 Nitto Denko Corp Protective sheet and use thereof
JP5592811B2 (ja) 2011-01-27 2014-09-17 日東電工株式会社 半導体装置の製造方法
CN103797567B (zh) 2011-09-30 2018-05-11 琳得科株式会社 具有保护膜形成层的切割膜片和芯片的制造方法
JP5865045B2 (ja) 2011-12-07 2016-02-17 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
JP5583725B2 (ja) 2012-09-20 2014-09-03 リンテック株式会社 レーザーダイシングシート−剥離シート積層体、レーザーダイシングシートおよびチップ体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015016053A1 (ja) * 2013-07-29 2015-02-05 リンテック株式会社 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
WO2015046341A1 (ja) * 2013-09-27 2015-04-02 リンテック株式会社 粘着シート
WO2015046529A1 (ja) * 2013-09-30 2015-04-02 リンテック株式会社 樹脂膜形成用複合シート

Also Published As

Publication number Publication date
KR102398753B1 (ko) 2022-05-16
KR20180022532A (ko) 2018-03-06
CN106489189A (zh) 2017-03-08
CN106489189B (zh) 2019-10-25

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