SG11201610546VA - Composite sheet for forming protective film - Google Patents

Composite sheet for forming protective film

Info

Publication number
SG11201610546VA
SG11201610546VA SG11201610546VA SG11201610546VA SG11201610546VA SG 11201610546V A SG11201610546V A SG 11201610546VA SG 11201610546V A SG11201610546V A SG 11201610546VA SG 11201610546V A SG11201610546V A SG 11201610546VA SG 11201610546V A SG11201610546V A SG 11201610546VA
Authority
SG
Singapore
Prior art keywords
protective film
composite sheet
forming protective
forming
composite
Prior art date
Application number
SG11201610546VA
Inventor
Naoya Saiki
Hiroyuki Yoneyama
Daisuke Yamamoto
Rikiya Kobashi
Youichi Inao
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014138087A external-priority patent/JP6391329B2/en
Priority claimed from JP2015127417A external-priority patent/JP2017008255A/en
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201610546VA publication Critical patent/SG11201610546VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
SG11201610546VA 2014-07-03 2015-09-03 Composite sheet for forming protective film SG11201610546VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014138087A JP6391329B2 (en) 2014-07-03 2014-07-03 Composite sheet for protective film formation
JP2015127417A JP2017008255A (en) 2015-06-25 2015-06-25 Composite sheet for forming protective film, tip with protective film and manufacturing method of tip with protective film
PCT/JP2015/075100 WO2016002975A1 (en) 2014-07-03 2015-09-03 Composite sheet for forming protective film

Publications (1)

Publication Number Publication Date
SG11201610546VA true SG11201610546VA (en) 2018-01-30

Family

ID=55019495

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610546VA SG11201610546VA (en) 2014-07-03 2015-09-03 Composite sheet for forming protective film

Country Status (3)

Country Link
PH (1) PH12016502492A1 (en)
SG (1) SG11201610546VA (en)
WO (1) WO2016002975A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020110548A1 (en) * 2018-11-26 2020-06-04 リンテック株式会社 Dicing sheet for plasma dicing
WO2020116281A1 (en) * 2018-12-05 2020-06-11 リンテック株式会社 Composite sheet for forming protective film and method for manufacturing semiconductor chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003138228A (en) * 2001-11-02 2003-05-14 Nitto Denko Corp Pressure-sensitive adhesive sheet for protecting semiconductor wafer
JP2005203749A (en) * 2003-12-15 2005-07-28 Furukawa Electric Co Ltd:The Tape for wafer processing and manufacturing method thereof
JP5457703B2 (en) * 2008-03-31 2014-04-02 三井化学株式会社 Dicing film
JP5865045B2 (en) * 2011-12-07 2016-02-17 リンテック株式会社 Dicing sheet with protective film forming layer and chip manufacturing method

Also Published As

Publication number Publication date
WO2016002975A8 (en) 2016-03-31
WO2016002975A1 (en) 2016-01-07
PH12016502492A1 (en) 2017-03-22

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