SG11201507903PA - Composite sheet for forming protective film - Google Patents
Composite sheet for forming protective filmInfo
- Publication number
- SG11201507903PA SG11201507903PA SG11201507903PA SG11201507903PA SG11201507903PA SG 11201507903P A SG11201507903P A SG 11201507903PA SG 11201507903P A SG11201507903P A SG 11201507903PA SG 11201507903P A SG11201507903P A SG 11201507903PA SG 11201507903P A SG11201507903P A SG 11201507903PA
- Authority
- SG
- Singapore
- Prior art keywords
- protective film
- composite sheet
- forming protective
- forming
- composite
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013066682 | 2013-03-27 | ||
| PCT/JP2014/058699 WO2014157426A1 (en) | 2013-03-27 | 2014-03-26 | Composite sheet for forming protective film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201507903PA true SG11201507903PA (en) | 2015-10-29 |
Family
ID=51624389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201507903PA SG11201507903PA (en) | 2013-03-27 | 2014-03-26 | Composite sheet for forming protective film |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10030174B2 (en) |
| EP (1) | EP2980835B1 (en) |
| JP (1) | JP5774799B2 (en) |
| KR (1) | KR101570959B1 (en) |
| CN (1) | CN105074878B (en) |
| PT (1) | PT2980835T (en) |
| SG (1) | SG11201507903PA (en) |
| TW (1) | TWI542659B (en) |
| WO (1) | WO2014157426A1 (en) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102215668B1 (en) * | 2013-03-28 | 2021-02-15 | 린텍 가부시키가이샤 | Protective film formation composite sheet, protective film-equipped chip, and method for fabricating protective film-equipped chip |
| KR20160001169A (en) * | 2014-06-26 | 2016-01-06 | 삼성전자주식회사 | semiconductor package including marking layer |
| JP6356054B2 (en) * | 2014-12-03 | 2018-07-11 | リンテック株式会社 | Laminated film and pressure-sensitive adhesive sheet using the same |
| JP6362526B2 (en) * | 2014-12-04 | 2018-07-25 | 古河電気工業株式会社 | Wafer processing tape |
| WO2016098697A1 (en) * | 2014-12-19 | 2016-06-23 | リンテック株式会社 | Sheet laminate for forming resin film |
| SG11201707264VA (en) | 2015-03-12 | 2017-10-30 | Lintec Corp | Film for forming protection film |
| JP2016213236A (en) * | 2015-04-30 | 2016-12-15 | 日東電工株式会社 | Film for semiconductor device, and manufacturing method for semiconductor device |
| CN107615454B (en) * | 2015-06-05 | 2020-12-18 | 琳得科株式会社 | Composite sheet for forming protective film |
| TWI704996B (en) * | 2015-11-04 | 2020-09-21 | 日商琳得科股份有限公司 | Sheet for forming first protective film |
| CN107431004B (en) | 2015-11-09 | 2021-11-19 | 古河电气工业株式会社 | Mask-integrated surface protection tape |
| JP6577341B2 (en) * | 2015-11-13 | 2019-09-18 | 日東電工株式会社 | LAMINATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| US11774166B2 (en) | 2015-11-25 | 2023-10-03 | Riken Technos Corporation | Door body |
| CN107406731A (en) * | 2016-01-06 | 2017-11-28 | 日东电工株式会社 | Graphite adhesive tape with release liner |
| EP3418342A4 (en) * | 2016-02-19 | 2019-11-13 | Riken Technos Corporation | Pressure-sensitive adhesive and articles including same |
| JP6805230B2 (en) * | 2016-03-04 | 2020-12-23 | リンテック株式会社 | Composite sheet for forming a protective film |
| JP6791647B2 (en) * | 2016-03-29 | 2020-11-25 | リンテック株式会社 | Laminate and protective film |
| CN105802221A (en) * | 2016-04-06 | 2016-07-27 | 汤卓群 | Nano polymer film for surface modification of biological material and preparation method of nano polymer film |
| TWI770021B (en) * | 2016-04-28 | 2022-07-11 | 日商琳得科股份有限公司 | Composite sheet for forming protective film |
| WO2017188199A1 (en) * | 2016-04-28 | 2017-11-02 | リンテック株式会社 | Film for forming protective coating and composite sheet for forming protective coating |
| WO2017188203A1 (en) * | 2016-04-28 | 2017-11-02 | リンテック株式会社 | Method for producing semiconductor chip equipped with protective film, and method for producing semiconductor device |
| JP6723644B2 (en) * | 2016-05-16 | 2020-07-15 | 株式会社ディスコ | Expandable seat |
| JP2017123488A (en) * | 2017-03-17 | 2017-07-13 | 日東電工株式会社 | Film for semiconductor device, and manufacturing method for semiconductor device |
| JP6582013B2 (en) * | 2017-03-31 | 2019-09-25 | 古河電気工業株式会社 | Mask protection surface protection tape with release liner |
| KR102524205B1 (en) * | 2018-03-30 | 2023-04-20 | 린텍 가부시키가이샤 | Composite sheet for forming protective film and manufacturing method thereof |
| JP2018148218A (en) * | 2018-04-18 | 2018-09-20 | 日東電工株式会社 | Film for semiconductor device, and manufacturing method for semiconductor device |
| JP2021082768A (en) | 2019-11-21 | 2021-05-27 | リンテック株式会社 | Kit, and method for manufacturing third laminate by use thereof |
| JP2021082767A (en) | 2019-11-21 | 2021-05-27 | リンテック株式会社 | Kit, and method for manufacturing third laminate by use thereof |
| WO2021138038A1 (en) * | 2019-12-30 | 2021-07-08 | Saint-Gobain Performance Plastics Corporation | Multilayer protective film |
| CN114507486B (en) * | 2020-11-16 | 2024-02-20 | 象山激智新材料有限公司 | High-temperature-resistant protective film and preparation method thereof |
| JP2022092286A (en) | 2020-12-10 | 2022-06-22 | リンテック株式会社 | Manufacturing method of workpiece with protective film and manufacturing method of workpiece with protective film-forming film |
| KR20230162674A (en) * | 2021-03-31 | 2023-11-28 | 닛산 가가쿠 가부시키가이샤 | Method for producing laminates, release agent compositions, and processed semiconductor substrates |
| JP2023102570A (en) * | 2022-01-12 | 2023-07-25 | 株式会社レゾナック | Individualized body forming laminate film and manufacturing method therefor, and semiconductor device manufacturing method |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1123919C (en) | 1999-02-13 | 2003-10-08 | 长兴化学工业股份有限公司 | Pressure-sensitive adhesive belt for making semiconductor crystal wafer |
| JP4776189B2 (en) | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | Wafer processing tape |
| JPWO2008132852A1 (en) * | 2007-04-19 | 2010-07-22 | 積水化学工業株式会社 | Dicing die bonding tape and semiconductor chip manufacturing method |
| JP2009130320A (en) | 2007-11-28 | 2009-06-11 | Furukawa Electric Co Ltd:The | Film for chip protection |
| JP5144433B2 (en) | 2008-08-28 | 2013-02-13 | 古河電気工業株式会社 | Chip protection film |
| JP5143196B2 (en) * | 2009-09-28 | 2013-02-13 | 日東電工株式会社 | Film for semiconductor devices |
| JP2011151362A (en) | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface |
| JP2011187571A (en) | 2010-03-05 | 2011-09-22 | Nitto Denko Corp | Dicing die-bonding film |
| JP5439264B2 (en) | 2010-04-19 | 2014-03-12 | 日東電工株式会社 | Dicing tape integrated semiconductor backside film |
| JP5681374B2 (en) | 2010-04-19 | 2015-03-04 | 日東電工株式会社 | Dicing tape integrated semiconductor backside film |
| JP5744434B2 (en) * | 2010-07-29 | 2015-07-08 | 日東電工株式会社 | Heat release sheet-integrated film for semiconductor back surface, semiconductor element recovery method, and semiconductor device manufacturing method |
| JP2012033637A (en) | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
| JP4904432B1 (en) * | 2011-03-01 | 2012-03-28 | 古河電気工業株式会社 | Wafer processing tape |
| JP5727835B2 (en) * | 2011-03-30 | 2015-06-03 | リンテック株式会社 | Protective film forming film, protective film forming sheet and semiconductor chip manufacturing method |
| JP2013021270A (en) * | 2011-07-14 | 2013-01-31 | Nitto Denko Corp | Film for manufacturing semiconductor device |
-
2014
- 2014-03-26 CN CN201480017872.7A patent/CN105074878B/en active Active
- 2014-03-26 PT PT147735583T patent/PT2980835T/en unknown
- 2014-03-26 EP EP14773558.3A patent/EP2980835B1/en active Active
- 2014-03-26 US US14/778,802 patent/US10030174B2/en active Active
- 2014-03-26 KR KR1020157024747A patent/KR101570959B1/en active IP Right Grant
- 2014-03-26 WO PCT/JP2014/058699 patent/WO2014157426A1/en active Application Filing
- 2014-03-26 SG SG11201507903PA patent/SG11201507903PA/en unknown
- 2014-03-26 JP JP2015508641A patent/JP5774799B2/en active Active
- 2014-03-27 TW TW103111371A patent/TWI542659B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014157426A1 (en) | 2014-10-02 |
| CN105074878B (en) | 2017-08-04 |
| TW201444945A (en) | 2014-12-01 |
| US20160046840A1 (en) | 2016-02-18 |
| KR20150119899A (en) | 2015-10-26 |
| KR101570959B1 (en) | 2015-11-20 |
| CN105074878A (en) | 2015-11-18 |
| EP2980835B1 (en) | 2020-12-02 |
| PT2980835T (en) | 2021-01-27 |
| TWI542659B (en) | 2016-07-21 |
| EP2980835A1 (en) | 2016-02-03 |
| EP2980835A4 (en) | 2016-11-16 |
| US10030174B2 (en) | 2018-07-24 |
| JP5774799B2 (en) | 2015-09-09 |
| JPWO2014157426A1 (en) | 2017-02-16 |
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