SG11201600516UA - Protective film formation-use composite sheet - Google Patents
Protective film formation-use composite sheetInfo
- Publication number
- SG11201600516UA SG11201600516UA SG11201600516UA SG11201600516UA SG11201600516UA SG 11201600516U A SG11201600516U A SG 11201600516UA SG 11201600516U A SG11201600516U A SG 11201600516UA SG 11201600516U A SG11201600516U A SG 11201600516UA SG 11201600516U A SG11201600516U A SG 11201600516UA
- Authority
- SG
- Singapore
- Prior art keywords
- protective film
- film formation
- composite sheet
- use composite
- sheet
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013160384 | 2013-08-01 | ||
PCT/JP2014/068894 WO2015016064A1 (en) | 2013-08-01 | 2014-07-16 | Protective film formation-use composite sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201600516UA true SG11201600516UA (en) | 2016-02-26 |
Family
ID=52431604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600516UA SG11201600516UA (en) | 2013-08-01 | 2014-07-16 | Protective film formation-use composite sheet |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160176169A1 (en) |
JP (1) | JP6557912B2 (en) |
KR (1) | KR102291700B1 (en) |
CN (1) | CN105408105B (en) |
SG (1) | SG11201600516UA (en) |
TW (1) | TWI643928B (en) |
WO (1) | WO2015016064A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI721158B (en) * | 2016-04-28 | 2021-03-11 | 日商琳得科股份有限公司 | Protective film forming film and composite sheet for forming protective film |
JP6854811B2 (en) * | 2016-04-28 | 2021-04-07 | リンテック株式会社 | Method for manufacturing protective film forming film, protective film forming composite sheet, and semiconductor chip |
CN109287125B (en) * | 2016-04-28 | 2023-07-18 | 琳得科株式会社 | Method for manufacturing semiconductor chip with protective film and method for manufacturing semiconductor device |
KR102456771B1 (en) * | 2016-04-28 | 2022-10-20 | 린텍 가부시키가이샤 | A film for forming a protective film and a composite sheet for forming a protective film |
DE102017208405B4 (en) * | 2017-05-18 | 2024-05-02 | Disco Corporation | Method for processing a wafer and protective film |
JP7203087B2 (en) * | 2018-03-30 | 2023-01-12 | リンテック株式会社 | COMPOSITE SHEET FOR PROTECTIVE FILM FORMATION AND METHOD FOR MANUFACTURING SAME |
JP7190483B2 (en) * | 2018-03-30 | 2022-12-15 | リンテック株式会社 | Composite sheet for protective film formation |
JP7115510B2 (en) * | 2019-06-06 | 2022-08-09 | Agc株式会社 | Laminated substrate and package |
KR102242438B1 (en) * | 2019-08-12 | 2021-04-20 | 에스케이씨 주식회사 | Seed attachment method |
CN112778929A (en) * | 2021-01-28 | 2021-05-11 | 深圳市康成泰实业有限公司 | Composite photo-curing protective film and film pasting method and application thereof |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2601956B2 (en) * | 1991-07-31 | 1997-04-23 | リンテック株式会社 | Removable adhesive polymer |
JP3188537B2 (en) * | 1992-10-30 | 2001-07-16 | トーワ株式会社 | Mold for resin sealing molding of electronic parts, molding method and resin molded product |
US7163739B2 (en) * | 2001-03-15 | 2007-01-16 | Mitsui Chemicals, Inc. | Laminate and display apparatus using the same |
JP2003221564A (en) * | 2002-02-01 | 2003-08-08 | Gunze Ltd | Adhesive tape base film for fixing semiconductor wafer |
JP4341343B2 (en) * | 2002-10-04 | 2009-10-07 | 日立化成工業株式会社 | Surface protective film and manufacturing method thereof |
JP4364508B2 (en) * | 2002-12-27 | 2009-11-18 | リンテック株式会社 | Protective film forming sheet for chip back surface and manufacturing method of chip with protective film |
JP4642436B2 (en) | 2004-11-12 | 2011-03-02 | リンテック株式会社 | Marking method and protective film forming and dicing sheet |
JP2007100064A (en) * | 2005-09-07 | 2007-04-19 | Furukawa Electric Co Ltd:The | Pressure-sensitive adhesive tape for dicing |
US20110039065A1 (en) * | 2008-03-26 | 2011-02-17 | Lintec Corporation | Pressure-sensitive adhesive sheet |
JP2009275060A (en) * | 2008-05-12 | 2009-11-26 | Nitto Denko Corp | Adhesive sheet, method for processing adherend using the adhesive sheet, and adhesive sheet-peeling device |
JP5180762B2 (en) * | 2008-09-30 | 2013-04-10 | パナソニック株式会社 | Method for forming protective film on wafer |
JP5805367B2 (en) * | 2009-01-30 | 2015-11-04 | 日東電工株式会社 | Dicing tape integrated wafer back surface protection film |
JP5456440B2 (en) * | 2009-01-30 | 2014-03-26 | 日東電工株式会社 | Dicing tape integrated wafer back surface protection film |
JP5456441B2 (en) * | 2009-01-30 | 2014-03-26 | 日東電工株式会社 | Dicing tape integrated wafer back surface protection film |
JP2011151362A (en) | 2009-12-24 | 2011-08-04 | Nitto Denko Corp | Dicing tape-integrated film for semiconductor back surface |
JP2011187571A (en) * | 2010-03-05 | 2011-09-22 | Nitto Denko Corp | Dicing die-bonding film |
JP2012033637A (en) | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
JP5751615B2 (en) * | 2011-02-14 | 2015-07-22 | リンテック株式会社 | Wafer processing adhesive sheet, marking method using the sheet, and marking chip manufacturing method |
JP5363662B2 (en) * | 2011-09-30 | 2013-12-11 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
JP6034019B2 (en) * | 2011-12-21 | 2016-11-30 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
JP5544052B2 (en) * | 2011-12-26 | 2014-07-09 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
-
2014
- 2014-07-16 JP JP2015529507A patent/JP6557912B2/en active Active
- 2014-07-16 CN CN201480041620.8A patent/CN105408105B/en active Active
- 2014-07-16 WO PCT/JP2014/068894 patent/WO2015016064A1/en active Application Filing
- 2014-07-16 US US14/907,538 patent/US20160176169A1/en not_active Abandoned
- 2014-07-16 SG SG11201600516UA patent/SG11201600516UA/en unknown
- 2014-07-16 KR KR1020167002774A patent/KR102291700B1/en active IP Right Grant
- 2014-07-30 TW TW103125962A patent/TWI643928B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2015016064A1 (en) | 2015-02-05 |
KR20160037177A (en) | 2016-04-05 |
US20160176169A1 (en) | 2016-06-23 |
CN105408105A (en) | 2016-03-16 |
JPWO2015016064A1 (en) | 2017-03-02 |
JP6557912B2 (en) | 2019-08-14 |
CN105408105B (en) | 2017-08-25 |
TWI643928B (en) | 2018-12-11 |
KR102291700B1 (en) | 2021-08-19 |
TW201518463A (en) | 2015-05-16 |
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