PH12016502492A1 - Composite sheet for forming protective film - Google Patents

Composite sheet for forming protective film

Info

Publication number
PH12016502492A1
PH12016502492A1 PH12016502492A PH12016502492A PH12016502492A1 PH 12016502492 A1 PH12016502492 A1 PH 12016502492A1 PH 12016502492 A PH12016502492 A PH 12016502492A PH 12016502492 A PH12016502492 A PH 12016502492A PH 12016502492 A1 PH12016502492 A1 PH 12016502492A1
Authority
PH
Philippines
Prior art keywords
substrate
protective film
composite sheet
forming protective
adhesive layer
Prior art date
Application number
PH12016502492A
Inventor
Saiki Naoya
Yoneyama Hiroyuki
Yamamoto Daisuke
Kobashi Rikiya
Inao Youichi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2014138087A external-priority patent/JP6391329B2/en
Priority claimed from JP2015127417A external-priority patent/JP2017008255A/en
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12016502492A1 publication Critical patent/PH12016502492A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)

Abstract

Provided is a composite sheet for forming a protective film, comprising an adhesive sheet obtained by laminating an adhesive layer on one surface side of a substrate, and a film for protective film formation which is laminated on the adhesive layer side of the adhesive sheet, wherein the degrees of expansion/shrinkage of the substrate in the MD direction and the CD direction after heating compared to before heating, with a load of 0.1g/mm being applied to the substrate, the substrate being heated at 130oC for two hours and then cooled to 23oC, are 95-103 pcnt , and the tensile moduli of elasticity of the substrate in the MD direction and CD direction at 23oC are both 100-700MPa.
PH12016502492A 2014-07-03 2016-12-14 Composite sheet for forming protective film PH12016502492A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014138087A JP6391329B2 (en) 2014-07-03 2014-07-03 Composite sheet for protective film formation
JP2015127417A JP2017008255A (en) 2015-06-25 2015-06-25 Composite sheet for forming protective film, tip with protective film and manufacturing method of tip with protective film
PCT/JP2015/075100 WO2016002975A1 (en) 2014-07-03 2015-09-03 Composite sheet for forming protective film

Publications (1)

Publication Number Publication Date
PH12016502492A1 true PH12016502492A1 (en) 2017-03-22

Family

ID=55019495

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12016502492A PH12016502492A1 (en) 2014-07-03 2016-12-14 Composite sheet for forming protective film

Country Status (3)

Country Link
PH (1) PH12016502492A1 (en)
SG (1) SG11201610546VA (en)
WO (1) WO2016002975A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6719694B1 (en) * 2018-11-26 2020-07-08 リンテック株式会社 Dicing sheet for plasma dicing
JPWO2020116281A1 (en) * 2018-12-05 2021-10-21 リンテック株式会社 Manufacturing method of composite sheet for forming protective film and semiconductor chip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003138228A (en) * 2001-11-02 2003-05-14 Nitto Denko Corp Pressure-sensitive adhesive sheet for protecting semiconductor wafer
JP2005203749A (en) * 2003-12-15 2005-07-28 Furukawa Electric Co Ltd:The Tape for wafer processing and manufacturing method thereof
JP5457703B2 (en) * 2008-03-31 2014-04-02 三井化学株式会社 Dicing film
JP5865045B2 (en) * 2011-12-07 2016-02-17 リンテック株式会社 Dicing sheet with protective film forming layer and chip manufacturing method

Also Published As

Publication number Publication date
WO2016002975A1 (en) 2016-01-07
SG11201610546VA (en) 2018-01-30
WO2016002975A8 (en) 2016-03-31

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