JP6719694B1 - Dicing sheet for plasma dicing - Google Patents

Abstract

A dicing sheet for plasma dicing, comprising a base material and an adhesive layer laminated on one side of the base material, the dicing sheet for plasma dicing being under an environment of atmospheric pressure 0.1 MPa and temperature 25° C. for 60 minutes. A dicing sheet for plasma dicing, wherein a mass reduction rate of the dicing sheet for plasma dicing when it is left to stand is 0.4% or less. According to such a dicing sheet for plasma dicing, peeling of the dicing sheet from the support base can be suppressed during plasma dicing.

Description

The present invention relates to a dicing sheet that can be suitably used for plasma dicing.

Semiconductor wafers such as silicon and gallium arsenide, and various packages (hereinafter, these may be collectively referred to as “workpieces”) are manufactured in a large diameter state, and these are small element pieces (hereinafter, “chips”). It may be described as "."), and is separated (picked up) and then separated (picked up), and then moved to the next mounting step.

In the dicing step of dicing a work, the work is attached to a dicing sheet including a base material and a pressure-sensitive adhesive layer, a predetermined position on the work is cut on the dicing sheet, and cut into individual chips. Conventionally, as a cutting method at this time, a rotating blade or a laser beam has been often used, but in recent years, cutting using plasma has also been performed.

Plasma dicing using such plasma, compared with blade dicing using a conventional blade, etc., the dicing width can be made narrower, the processing time can be shortened because batch dicing can be performed, and cutting pieces are less likely to occur. Since it is hard to give a shock to the work, there is an advantage that damage to the work and the chip can be suppressed.

Patent Document 1 discloses an example of a plasma dicing method. In particular, Patent Document 1 discloses a method of performing plasma dicing while holding a work by electrostatic attraction. Patent Document 2 discloses a dicing sheet for use in plasma dicing.

JP, 2014-60366, A JP, 2016-171261, A

In plasma dicing, unlike blade dicing or laser dicing using laser light, it is necessary to place a laminate of a work and a dicing sheet under vacuum conditions (low pressure conditions) in order to generate plasma. Due to this, in the plasma dicing, the dicing sheet may be peeled off from the supporting base holding the dicing sheet, and as a result, proper dicing may not be performed.

The present invention has been made in view of such an actual situation, and an object of the present invention is to provide a dicing sheet for plasma dicing that can suppress peeling of the dicing sheet from the support during plasma dicing. ..

In order to achieve the above-mentioned object, firstly, the present invention is a dicing sheet for plasma dicing, comprising a base material and a pressure-sensitive adhesive layer laminated on one side of the base material, the dicing sheet for plasma dicing. The dicing sheet for plasma dicing is characterized in that the mass reduction rate of the dicing sheet for plasma dicing is 0.4% or less when the sample is allowed to stand for 60 minutes in an environment with an atmospheric pressure of 0.1 MPa and a temperature of 25°C. (Invention 1).

In the dicing sheet for plasma dicing according to the above invention (Invention 1), since the above-mentioned mass reduction rate is in the above range, even when the dicing sheet is placed under vacuum conditions, volatility from the dicing sheet is high. The release of components is suppressed. This can prevent unintended peeling of the dicing sheet from the support base due to the accumulation of volatile components at the interface between the dicing sheet and the support base.

In the said invention (invention 1), it is preferable that the surface resistivity measured from the said base material side surface in the said dicing sheet for plasma dicing is 1.0*10< ¹⁵ >(ohm/sq) or more (invention 2).

In the said invention (invention 1 and 2), it is preferable that the thickness of the said base material is 50 micrometers or more and 200 micrometers or less (invention 3).

In the said invention (invention 1-3), it is preferable that the thickness of the said adhesive layer is 1 micrometer or more and 50 micrometers or less (invention 4).

In the said invention (invention 1-4), it is preferable that the said adhesive layer is comprised from the adhesive which does not have active energy ray curability (invention 5).

In the above inventions (Inventions 1 to 4), the pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive having an active energy ray-curing property, and the pressure-sensitive adhesive has a functional group having an active energy ray-curing property introduced into a side chain. It is preferable to include an acrylic copolymer (Invention 6).

The dicing sheet for plasma dicing according to the present invention can suppress peeling of the dicing sheet from the support during plasma dicing.

Hereinafter, embodiments of the present invention will be described.
The dicing sheet for plasma dicing according to the present embodiment (hereinafter sometimes simply referred to as “dicing sheet”) includes a base material and an adhesive layer laminated on one side of the base material.

1. Physical Properties of Dicing Sheet (1) Mass Reduction Rate In the dicing sheet according to the present embodiment, the mass reduction rate of the dicing sheet when the dicing sheet is left standing for 60 minutes in an environment of atmospheric pressure 0.1 MPa and temperature 25° C. Is 0.4% or less, preferably 0.39% or less, and particularly preferably 0.38% or less.

When the mass reduction rate exceeds 0.4%, the volatile component is excessively released from the dicing sheet when the dicing sheet is placed under a vacuum condition for plasma dicing. As a result, the volatile component accumulates at the interface between the dicing sheet and the supporting base, and the dicing sheet is peeled off from the supporting base. As a result, plasma dicing cannot be performed well.

The lower limit of the mass reduction rate is preferably 0%, that is, no volatile component is released at all, but when it is difficult, for example, 0.01% or more. Good. The details of the method for measuring the mass reduction rate described above are as described in the test examples described later.

(2) Surface resistivity In the dicing sheet according to the present embodiment, the surface resistivity measured from the surface on the base material side is preferably 1.0×10 ¹⁵ Ω/sq or more, and particularly 1.2× It is preferably 10 ¹⁵ Ω/sq or more, and more preferably 1.3×10 ¹⁵ Ω/sq or more. When performing plasma dicing, an electrostatic chuck table may be used as a support. In this case, the surface of the dicing sheet on the base material side is brought into contact with the electrostatic chuck table, and the surface is electrostatically adsorbed to hold the dicing sheet. Here, when the surface resistivity is 1.0×10 ¹⁵ Ω/sq or more, the dicing sheet can be easily held well on the electrostatic chuck table.

On the other hand, the surface resistivity is preferably 1.0×10 ¹⁶ Ω/sq or less. Thereby, when the obtained chip is separated from the dicing sheet, excessive peeling charge is less likely to occur, and as a result, the problem of dielectric breakdown of the chip can be suppressed. The details of the method for measuring the surface resistivity described above are as described in the test examples described later.

2. Component Member of Dicing Sheet (1) Substrate The substrate in the present embodiment is not particularly limited as long as it can achieve the above-described mass reduction rate and has desired performance for performing plasma dicing. In addition, when the pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive having an active energy ray-curable property, as described below, the base material is exposed to active energy rays irradiated for curing the pressure-sensitive adhesive layer. It is preferable that it has good transparency.

The substrate is preferably a resin film containing a resin-based material as a main material, and specific examples of such materials include polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, and ethylene-norbornene copolymer, Polyolefin resins such as norbornene resins; propylene copolymers such as ethylene-polypropylene random copolymers; ethylene-(meth)acrylic acid copolymers, ethylene-(meth)acrylic acid methyl copolymers, other ethylene- Ethylene copolymers such as (meth)acrylic acid ester copolymers; polyester resins such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate; ethylene-vinyl acetate copolymers; polyvinyl chloride, vinyl chloride copolymers And other polyvinyl chloride resins; (meth)acrylic acid ester copolymers; polyurethanes; polyimides; polystyrenes; polycarbonates; fluororesins and the like. Also, a material obtained by crosslinking these or an ionomer of these may be used as a material. In addition, in this specification, "(meth)acrylic acid" means both acrylic acid and methacrylic acid. The same applies to other similar terms.

Among the above-mentioned materials, it is preferable to use at least one of a polyolefin-based resin, a propylene-based copolymer, an ethylene-based copolymer, and a polyester-based resin from the viewpoint of easily achieving the above-mentioned mass reduction rate.

The base material may be a film made of one of the above-mentioned materials, or may be a film made of a plurality of the above-mentioned materials. Further, the base material may be a laminated film formed by laminating a plurality of such films. In this laminated film, the material forming each layer may be the same or different.

Further, the base material is a film made of the above-mentioned propylene-based copolymer and ethylene-based copolymer, from the viewpoint of easily achieving the above-mentioned mass reduction rate and easily achieving excellent expandability. Is preferable, and a film made of an ethylene-polypropylene random copolymer and an ethylene-(meth)acrylic acid copolymer is particularly preferable. In this case, the ratio of the propylene-based copolymer and the ethylene-based copolymer is preferably 0.1 part by mass or more of the propylene-based copolymer with respect to 100 parts by mass of the ethylene-based copolymer. It is particularly preferable that the amount is 1 part by mass or more. Further, the amount of the propylene-based copolymer is preferably less than 5 parts by weight, and particularly preferably 4.5 parts by weight or less, relative to 100 parts by weight of the ethylene-based copolymer.

Further, the base material is a film made of an ethylene-based copolymer as opposed to a film made of the propylene-based copolymer and the ethylene-based copolymer as described above, from the viewpoint that it is easy to achieve more excellent expandability. In particular, it is preferable that a film made of an ethylene-(meth)acrylic acid copolymer as a material is laminated. In addition, in the base material having this laminated structure, a layer formed of a film made of a propylene-based copolymer and an ethylene-based copolymer is referred to as a “first layer” for convenience, and the ethylene-based copolymer is used as a material. For convenience sake, the layer formed of the film will be referred to as "second layer". The first layer and the second layer may include components other than those described above as materials.

In addition, the base material is a film made of an ethylene-(meth)acrylic acid copolymer and an epoxy compound, from the viewpoint of easily achieving the above-mentioned mass reduction rate and easily achieving excellent heat resistance. Good. The film may contain a component other than the ethylene-(meth)acrylic acid copolymer and the epoxy compound as a material.

The epoxy compound may be a compound having an epoxy group in the molecule, preferably a compound having one or more epoxy groups, more preferably a compound having two or more epoxy groups, and particularly preferably two epoxy groups. Compounds are preferred.

When the base material is a film made of an ethylene-(meth)acrylic acid copolymer and an epoxy compound, the ratio of the ethylene-(meth)acrylic acid copolymer and the epoxy compound is ethylene-(meth). The amount of the epoxy compound is preferably 0.05 parts by mass or more with respect to 100 parts by mass of the acrylic acid copolymer. Further, it is preferable that the epoxy compound is less than 0.3 parts by mass with respect to 100 parts by mass of the ethylene-(meth)acrylic acid copolymer.

Further, the base material may contain various additives such as a flame retardant, a plasticizer, an antistatic agent, a lubricant, an antioxidant, a colorant, an infrared absorber, an ultraviolet absorber and an ion scavenger. The content of these additives is not particularly limited, but is preferably within the range in which the base material exhibits a desired function.

The method for producing the substrate in the present embodiment is not particularly limited, and examples thereof include melt extrusion methods such as T-die method and round die method; calendar method; solution method such as dry method and wet method. Above all, it is preferable to employ the melt extrusion method or the calender method from the viewpoint of efficiently producing the substrate. When a single-layer substrate is produced by a melt extrusion method, the materials of the substrate are kneaded, and the obtained kneaded product is directly produced, or pellets are once produced, and then a film is formed using a known extruder. Good. Further, when a base material consisting of a plurality of layers is produced by a melt extrusion method, the components constituting each layer are respectively kneaded, and the obtained kneaded product is directly produced or once pellets are produced, using a known extruder. A plurality of layers may be simultaneously extruded to form a film.

The surface of the base material on which the pressure-sensitive adhesive layer is laminated may be subjected to a surface treatment such as a primer treatment, a corona treatment, or a plasma treatment in order to enhance the adhesion with the pressure-sensitive adhesive layer.

The thickness of the substrate is preferably 50 μm or more, particularly preferably 60 μm or more, and further preferably 70 μm or more. Further, the thickness of the base material is preferably 200 μm or less, particularly preferably 180 μm or less, and further preferably 150 μm or less. When the thickness of the base material is 50 μm or more, the dicing sheet tends to have appropriate strength, and breakage during use can be effectively suppressed. On the other hand, when the thickness of the base material is 200 μm or less, it becomes easy to effectively suppress the release of the volatile component derived from the base material when the dicing sheet is placed under a vacuum condition.

(2) Pressure-sensitive adhesive layer The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer in the present embodiment is not particularly limited as long as it can achieve the above-described mass reduction rate and has desired performance for performing plasma dicing. The pressure-sensitive adhesive may be a pressure-sensitive adhesive having no active energy ray curability (active energy ray-curable pressure-sensitive adhesive), or an active energy ray-curable pressure-sensitive adhesive (active energy ray-curable pressure-sensitive adhesive). It may be. In the dicing sheet according to the present embodiment, the content of the low molecular weight component in the pressure-sensitive adhesive layer is preferably relatively small from the viewpoint of easily achieving the above-described mass reduction rate. From this viewpoint, the pressure-sensitive adhesive layer is preferably an active energy ray non-curable pressure-sensitive adhesive.

(2-1) Active energy ray non-curable pressure-sensitive adhesive As the active energy ray non-curable pressure-sensitive adhesive, those having desired adhesive strength and removability are preferable, and examples thereof include acrylic pressure-sensitive adhesive, rubber pressure-sensitive adhesive, Silicone-based adhesives, urethane-based adhesives, polyester-based adhesives, polyvinyl ether-based adhesives and the like can be used. Among these, it is preferable to use an acrylic pressure-sensitive adhesive from the viewpoint of easily achieving a desired pressure-sensitive adhesive force.

The acrylic pressure-sensitive adhesive as the active energy ray non-curable pressure-sensitive adhesive is preferably composed of the acrylic copolymer (a1) and the crosslinking agent (E). The acrylic copolymer (a1) preferably contains a structural unit derived from a functional group-containing monomer and a structural unit derived from a (meth)acrylic acid ester monomer or a derivative thereof.

The functional group-containing monomer as a constitutional unit of the acrylic copolymer (a1) has a polymerizable double bond and a functional group such as a hydroxy group, a carboxy group, an amino group, a substituted amino group or an epoxy group in the molecule. It is preferable that the monomer has

Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, Examples thereof include 3-hydroxybutyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate, and these may be used alone or in combination of two or more kinds.

Examples of the carboxy group-containing monomer include ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid and citraconic acid. These may be used alone or in combination of two or more.

Examples of the amino group-containing monomer or the substituted amino group-containing monomer include aminoethyl (meth)acrylate and n-butylaminoethyl (meth)acrylate. These may be used alone or in combination of two or more.

The acrylic copolymer (a1) preferably contains a structural unit derived from the functional group-containing monomer in an amount of 1% by mass or more, particularly preferably 5% by mass or more, and more preferably 10% by mass or more. Preferably. The acrylic copolymer (a1) preferably contains the structural unit derived from the functional group-containing monomer in an amount of 35% by mass or less, and particularly preferably in an amount of 30% by mass or less.

Examples of the (meth)acrylic acid ester monomer constituting the acrylic copolymer (a1) include (meth)acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms, (meth)acrylic acid cycloalkyl ester, ( For example, benzyl meth)acrylate is used. Among these, particularly preferred are alkyl (meth)acrylates having an alkyl group having 1 to 18 carbon atoms, such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, (meth ) N-butyl acrylate, 2-ethylhexyl (meth)acrylate and the like are used.

The acrylic copolymer (a1) preferably contains the structural unit derived from the (meth)acrylic acid ester monomer in an amount of 50% by mass or more, particularly preferably 60% by mass or more, and further 70% by mass. % Or more is preferable. Further, the acrylic copolymer (a1) preferably contains the structural unit derived from the (meth)acrylic acid ester monomer in an amount of 99% by mass or less, and particularly preferably in an amount of 95% by mass or less.

The acrylic copolymer (a1) can be obtained by copolymerizing a functional group-containing monomer as described above and a (meth)acrylic acid ester monomer or a derivative thereof by a conventional method. Dimethyl acrylamide, vinyl formate, vinyl acetate, styrene, etc. may be copolymerized.

The weight average molecular weight (Mw) of the acrylic copolymer (a1) is preferably 10,000 or more, particularly preferably 150,000 or more, and further preferably 200,000 or more. The weight average molecular weight (Mw) is preferably 1.5 million or less, and particularly preferably 1 million or less. In addition, the weight average molecular weight (Mw) in this specification is the value of standard polystyrene conversion measured by the gel permeation chromatography method (GPC method).

As the cross-linking agent (E), a polyfunctional compound having reactivity with the functional group of the acrylic copolymer (a1) can be used. Examples of such polyfunctional compounds include isocyanate compounds, epoxy compounds, amine compounds, melamine compounds, aziridine compounds, hydrazine compounds, aldehyde compounds, oxazoline compounds, metal alkoxide compounds, metal chelate compounds, metal salts, ammonium salts, Examples thereof include reactive phenol resins.

The amount of the cross-linking agent (E) compounded is preferably 0.01 parts by mass or more, and particularly preferably 3 parts by mass or more, relative to 100 parts by mass of the acrylic copolymer (a1). Further, the amount of the cross-linking agent (E) compounded is preferably 20 parts by mass or less, and particularly preferably 17 parts by mass or less, relative to 100 parts by mass of the acrylic copolymer (a1).

(2-2) Active energy ray-curable pressure-sensitive adhesive The active energy ray-curable pressure-sensitive adhesive may be mainly composed of a polymer having an active energy ray-curable property, or may not be an active energy ray-curable polymer. The main component may be a mixture of (a polymer having no active energy ray curability) and a monomer and/or oligomer having at least one or more active energy ray curable groups.

When the pressure-sensitive adhesive layer in the present embodiment is composed of an active energy ray-curable pressure-sensitive adhesive, the pressure-sensitive adhesive layer is cured by irradiation with active energy rays to reduce the adhesive strength of the dicing sheet to the adherend. be able to. This makes it possible to easily separate the obtained chip from the dicing sheet after the plasma dicing is completed.

The content of the low-molecular weight component in the pressure-sensitive adhesive layer is set to be relatively small, which makes it easy to achieve the above-described mass reduction rate, and thus the active energy ray-curable pressure-sensitive adhesive that constitutes the pressure-sensitive adhesive layer. However, it is preferable that the main component is a polymer having active energy ray curability.

First, the case where the active energy ray-curable pressure-sensitive adhesive contains a polymer having active energy ray-curability as a main component will be described below.

The polymer having active energy ray curability is a (meth)acrylic acid ester (co)polymer (A) (hereinafter referred to as a (meth)acrylic acid ester (co)polymer in which a functional group having active energy ray curability (active energy ray curable group) is introduced into a side chain. It may be referred to as “active energy ray-curable polymer (A)”). This active energy ray-curable polymer (A) comprises an acrylic copolymer (a1) having a functional group-containing monomer unit and an unsaturated group-containing compound (a2) having a functional group bonded to the functional group. It is preferably obtained by reaction.

The acrylic copolymer (a1) having the functional group-containing monomer unit is a functional group-containing functional group as a constituent unit in the acrylic copolymer (a1) described above as a material for the active energy ray non-curable pressure-sensitive adhesive. Those containing a monomer can be used.

The functional group contained in the unsaturated group-containing compound (a2) can be appropriately selected according to the kind of the functional group of the functional group-containing monomer unit contained in the acrylic copolymer (a1). For example, when the functional group of the acrylic copolymer (a1) is a hydroxy group, an amino group or a substituted amino group, the functional group of the unsaturated group-containing compound (a2) is preferably an isocyanate group or an epoxy group. When the functional group contained in the copolymer (a1) is an epoxy group, the functional group contained in the unsaturated group-containing compound (a2) is preferably an amino group, a carboxy group or an aziridinyl group.

The unsaturated group-containing compound (a2) contains at least one active energy ray-polymerizable carbon-carbon double bond in one molecule, particularly 1 to 6, more preferably 1 to 4 carbon atoms. Is preferred. Specific examples of the unsaturated group-containing compound (a2) include, for example, 2-methacryloyloxyethyl isocyanate, meta-isopropenyl-α,α-dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, 1,1-( Bisacryloyloxymethyl)ethyl isocyanate; acryloyl monoisocyanate compound obtained by reaction of diisocyanate compound or polyisocyanate compound and hydroxyethyl (meth)acrylate; diisocyanate compound or polyisocyanate compound, polyol compound, (meth)acrylic Acryloyl monoisocyanate compound obtained by reaction with hydroxyethyl acid ester; glycidyl (meth)acrylate; (meth)acrylic acid, 2-(1-aziridinyl)ethyl (meth)acrylate, 2-vinyl-2-oxazoline, 2 -Isopropenyl-2-oxazoline and the like.

The unsaturated group-containing compound (a2) is preferably 50 mol% or more, particularly preferably 60 mol% or more, and further preferably, based on the number of moles of the functional group-containing monomer of the acrylic copolymer (a1). It is used in a proportion of 70 mol% or more. The unsaturated group-containing compound (a2) is preferably 95 mol% or less, particularly preferably 93 mol% or less, based on the number of moles of the functional group-containing monomer of the acrylic copolymer (a1). It is preferably used in a proportion of 90 mol% or less.

In the reaction between the acrylic copolymer (a1) and the unsaturated group-containing compound (a2), the functional group of the acrylic copolymer (a1) and the functional group of the unsaturated group-containing compound (a2) Depending on the combination, the reaction temperature, pressure, solvent, time, presence or absence of catalyst, and type of catalyst can be appropriately selected. As a result, the functional group present in the acrylic copolymer (a1) reacts with the functional group in the unsaturated group-containing compound (a2), and the unsaturated group is replaced by the functional group in the acrylic copolymer (a1). It is introduced into a side chain to obtain an active energy ray-curable polymer (A).

The weight average molecular weight (Mw) of the active energy ray-curable polymer (A) thus obtained is preferably 10,000 or more, particularly preferably 150,000 or more, and further preferably 200,000 or more. Preferably. The weight average molecular weight (Mw) is preferably 1.5 million or less, and particularly preferably 1 million or less.

Even when the active energy ray-curable pressure-sensitive adhesive has a polymer having an active energy ray-curable property such as an active energy ray-curable polymer (A) as a main component, the active energy ray-curable pressure-sensitive adhesive is It may further contain a line-curable monomer and/or oligomer (B).

As the active energy ray-curable monomer and/or oligomer (B), for example, an ester of a polyhydric alcohol and (meth)acrylic acid or the like can be used.

Examples of the active energy ray-curable monomer and/or oligomer (B) include, for example, monofunctional acrylic acid esters such as cyclohexyl (meth)acrylate and isobornyl (meth)acrylate, trimethylolpropane tri(meth)acrylate, Pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, polyethylene Examples thereof include polyfunctional acrylic acid esters such as glycol di(meth)acrylate and dimethylol tricyclodecane di(meth)acrylate, polyester oligo(meth)acrylate, polyurethane oligo(meth)acrylate.

When the active energy ray-curable polymer (A) is mixed with the active energy ray-curable monomer and/or oligomer (B), the active energy ray-curable monomer and/or Alternatively, the content of the oligomer (B) is preferably more than 0 parts by mass, and particularly preferably 60 parts by mass or more based on 100 parts by mass of the active energy ray-curable polymer (A). Further, the content is preferably 250 parts by mass or less, and particularly preferably 200 parts by mass or less with respect to 100 parts by mass of the active energy ray-curable polymer (A).

Here, when ultraviolet rays are used as active energy rays for curing the active energy ray-curable pressure-sensitive adhesive, it is preferable to add a photopolymerization initiator (C), and use of this photopolymerization initiator (C) Thereby, the polymerization and curing time and the light irradiation amount can be reduced.

Specific examples of the photopolymerization initiator (C) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal, 2, 4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, β-chloranthraquinone, (2,4,6- Trimethylbenzyldiphenyl)phosphine oxide, 2-benzothiazole-N,N-diethyldithiocarbamate, oligo{2-hydroxy-2-methyl-1-[4-(1-propenyl)phenyl]propanone}, 2,2- Examples thereof include dimethoxy-1,2-diphenylethan-1-one. These may be used alone or in combination of two or more.

The photopolymerization initiator (C) is an active energy ray-curable polymer (A) (in the case of incorporating an active energy ray-curable monomer and/or oligomer (B), the active energy ray-curable polymer (A). ) And the total amount of the active energy ray-curable monomer and/or oligomer (B) 100 parts by mass) 0.1 parts by mass or more, particularly 0.5 parts by mass or more per 100 parts by mass. preferable. Further, the photopolymerization initiator (C) is an active energy ray-curable polymer (A) (in the case of incorporating an active energy ray-curable monomer and/or oligomer (B), an active energy ray-curable polymer). The total amount of (A) and the active energy ray-curable monomer and/or oligomer (B) is 100 parts by mass) It is preferably used in an amount of 10 parts by mass or less, particularly 6 parts by mass or less, relative to 100 parts by mass.

The active energy ray-curable pressure-sensitive adhesive may appropriately contain other components in addition to the above components. Examples of the other component include an active energy ray non-curable polymer component or oligomer component (D) and a cross-linking agent (E).

Examples of the active energy ray non-curable polymer component or oligomer component (D) include polyacrylic acid esters, polyesters, polyurethanes, polycarbonates, polyolefins, etc., and polymers having a weight average molecular weight (Mw) of 3,000 to 2,500,000 or Oligomers are preferred. By blending the component (D) with the active energy ray-curable pressure-sensitive adhesive, the tackiness and peelability before curing, the strength after curing, the adhesiveness with other layers, the storage stability, etc. can be improved. The blending amount of the component (D) is not particularly limited and is appropriately determined within the range of more than 0 parts by mass and 50 parts by mass or less with respect to 100 parts by mass of the active energy ray-curable polymer (A).

As the cross-linking agent (E), the above-mentioned materials for the active energy ray non-curable pressure-sensitive adhesive can be used. In addition, when the pressure-sensitive adhesive layer is composed of an active energy ray-curable pressure-sensitive adhesive, and the active energy ray-curable pressure-sensitive adhesive has a polymer having active energy ray-curability as a main component, the compounding amount of the crosslinking agent (E) The amount is preferably 0.01 parts by mass or more, and particularly preferably 3 parts by mass or more, relative to 100 parts by mass of the active energy ray-curable polymer (A). Further, the amount of the above-mentioned compounding is preferably 20 parts by mass or less, and particularly preferably 17 parts by mass or less, with respect to 100 parts by mass of the active energy ray-curable polymer (A).

Next, regarding the case where the active energy ray-curable pressure-sensitive adhesive contains a mixture of an active energy ray-non-curable polymer component and a monomer and/or oligomer having at least one or more active energy ray-curable groups as main components, This will be described below.

As the active energy ray non-curable polymer component, for example, the same component as the above-mentioned acrylic copolymer (a1) can be used.

As the monomer and/or oligomer having at least one or more active energy ray-curable groups, the same ones as the above-mentioned component (B) can be selected. The compounding ratio of the active energy ray non-curable polymer component and the monomer and/or oligomer having at least one active energy ray curable group is at least 1 with respect to 100 parts by mass of the active energy ray non-curable polymer component. The amount of the monomer and/or oligomer having one or more active energy ray-curable groups is preferably 1 part by mass or more, more preferably 60 parts by mass or more. Further, the compounding ratio is preferably 200 parts by mass or less of a monomer and/or oligomer having at least one or more active energy ray-curable groups with respect to 100 parts by mass of the active energy ray non-curable polymer component, In particular, it is preferably 160 parts by mass or less.

Also in this case, the photopolymerization initiator (C) and the cross-linking agent (E) can be appropriately blended in the same manner as above.

(2-3) Thickness of pressure-sensitive adhesive layer The thickness of the pressure-sensitive adhesive layer is preferably 1 μm or more, particularly preferably 3 μm or more, and further preferably 5 μm or more. Moreover, the thickness of the pressure-sensitive adhesive layer is preferably 50 μm or less, particularly preferably 40 μm or less, and further preferably 30 μm or less. When the thickness of the pressure-sensitive adhesive layer is 1 μm or more, the dicing sheet can easily exhibit a desired pressure-sensitive adhesive force to the adherend. Moreover, when the thickness of the pressure-sensitive adhesive layer is 50 μm or less, it becomes easy to effectively suppress the release of the volatile component derived from the pressure-sensitive adhesive layer when the dicing sheet is placed under vacuum conditions. .. As a result, it is possible to effectively prevent unintentional peeling of the work from the dicing sheet during plasma dicing.

(3) Release Sheet In the dicing sheet according to the present embodiment, the surface of the pressure-sensitive adhesive layer opposite to the base material (hereinafter, may be referred to as “adhesive surface”) is attached to the work until the surface is attached. A release sheet may be laminated on the surface for the purpose of protecting the. The configuration of the release sheet is arbitrary, and examples include those obtained by subjecting a plastic film to a release treatment with a release agent or the like. Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene. As the release agent, a silicone-based agent, a fluorine-based agent, a long-chain alkyl-based agent, or the like can be used, and among these, a silicone-based agent that is inexpensive and can obtain stable performance is preferable. The thickness of the release sheet is not particularly limited, but is usually 20 μm or more and 250 μm or less.

(4) Other members In the dicing sheet according to the present embodiment, the adhesive layer may be laminated on the adhesive surface of the adhesive layer. In this case, the dicing sheet according to the present embodiment can be used as a dicing/die bonding sheet by including the adhesive layer as described above. In such a dicing sheet, a work is attached to the surface of the adhesive layer opposite to the pressure-sensitive adhesive layer, and the adhesive layer is diced together with the work, whereby the individualized adhesive layers are laminated. You can get chips. The chip can be easily fixed to an object on which the chip is mounted by the individualized adhesive layer. As a material for forming the above-mentioned adhesive layer, a material containing a thermoplastic resin and a low molecular weight thermosetting adhesive component, a material containing a B-stage (semi-cured) thermosetting adhesive component, or the like is used. It is preferable to use.

Further, in the dicing sheet according to this embodiment, a protective film forming layer may be laminated on the adhesive surface of the adhesive layer. In this case, the dicing sheet according to this embodiment can be used as a protective film-forming/dicing sheet. In such a sheet, a work is attached to the surface of the protective film forming layer opposite to the pressure-sensitive adhesive layer, and the protective film forming layer is diced together with the work, so that the individual protective film forming layers are laminated. Can be obtained. As the work, it is preferable to use a work having a circuit formed on one surface thereof. In this case, usually, a protective film forming layer is laminated on the surface opposite to the surface on which the circuit is formed. By hardening the individualized protective film forming layer at a predetermined timing, a protective film having sufficient durability can be formed on the chip. The protective film forming layer preferably comprises an uncured curable adhesive.

3. Method for Manufacturing Dicing Sheet The method for manufacturing the dicing sheet according to the present embodiment is not particularly limited, and is preferably manufactured by laminating an adhesive layer on one side of the base material. The pressure-sensitive adhesive layer can be laminated on one side of the substrate by a known method. For example, it is preferable to transfer the pressure-sensitive adhesive layer formed on the release sheet to one side of the substrate. In this case, a pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer and, if desired, a coating liquid further containing a solvent or a dispersion medium are prepared, and the release-treated surface of the release sheet (hereinafter sometimes referred to as “release surface”). .) is coated with the coating liquid using a die coater, a curtain coater, a spray coater, a slit coater, a knife coater, etc. to form a coating film, and the coating film is dried to form an adhesive layer. be able to. The property of the coating liquid is not particularly limited as long as it can be applied, and it may contain a component for forming the pressure-sensitive adhesive layer as a solute or a dispersoid. The release sheet in this laminate may be released as a process material, or may be used to protect the adhesive surface of the adhesive layer until the dicing sheet is attached to the work.

When the coating liquid for forming the pressure-sensitive adhesive layer contains a cross-linking agent, by changing the above drying conditions (temperature, time, etc.) or by separately providing heat treatment, The cross-linking reaction may proceed to form a cross-linked structure in the pressure-sensitive adhesive layer at a desired density. In order to allow the crosslinking reaction to proceed sufficiently, after the pressure-sensitive adhesive layer is laminated on the substrate by the above method or the like, the obtained dicing sheet is allowed to stand for several days in an environment of 23° C. and 50% relative humidity. You may carry out such a cure.

Instead of transferring the pressure-sensitive adhesive layer formed on the release sheet to one side of the substrate as described above, the pressure-sensitive adhesive layer may be directly formed on the substrate. In this case, the pressure-sensitive adhesive layer is formed by applying the coating liquid for forming the pressure-sensitive adhesive layer to one side of the substrate to form a coating film, and drying the coating film.

4. Method of Using Dicing Sheet The dicing sheet according to this embodiment can be used for plasma dicing. The method of plasma dicing here is not particularly limited, and can be used for known plasma dicing.

For example, first, a resist is laminated on a work to be diced by a general method to form a mask having a dicing line. Then, the surface of the dicing sheet according to the present embodiment on the pressure-sensitive adhesive layer side is attached to the surface of the work opposite to the resist. The dicing sheet may be attached to the work before the resist is laminated to the work. Subsequently, the laminated body of the resist, the work, and the dicing sheet thus obtained is placed on a support table in a vacuum chamber of a plasma dicing apparatus. Then, plasma is generated in the vacuum chamber and the work is treated with the plasma through the resist, whereby the work is singulated along the above-mentioned dicing line.

As the gas species for generating the plasma described above, known ones can be used, but for example, SF ₆ gas is preferably used. Further, the etching rate is preferably 0.05 μm/s or more, and particularly preferably 0.08 μm/s or more. Further, the etching rate is preferably 0.5 μm/s or less, and particularly preferably 0.4 μm/s or less. As a vacuum condition for generating plasma, the atmospheric pressure is preferably 0.1 MPa or less, and particularly preferably 0.05 MPa or less. Furthermore, the table temperature is preferably 15° C. or higher, and particularly preferably 20° C. or higher. The table temperature is preferably 60°C or lower, and particularly preferably 50°C or lower.

After dividing the work into individual pieces, the resist is removed by, for example, plasma treatment using O ₂ gas. Then, after a plurality of chips obtained by dividing the work into pieces are taken out from the vacuum chamber together with the dicing sheet, the chips are individually picked up from the dicing sheet and mounted on a predetermined substrate or the like.

As the work targeted by the dicing sheet according to the present embodiment, a general work to be diced by plasma dicing can be used. For example, a semiconductor wafer, a semiconductor member such as a semiconductor package, or a glass plate. And other glass members.

The dicing sheet according to the present embodiment can suppress the release of volatile components from the dicing sheet even when the dicing sheet is placed under the above-described vacuum conditions during plasma dicing. As a result, it is possible to suppress the accumulation of volatile components at the interface between the dicing sheet and the support, and as a result, it is possible to prevent unintended peeling of the dicing sheet from the support. Therefore, by using the dicing sheet according to this embodiment, plasma dicing can be favorably performed.

Further, when the dicing sheet according to the present embodiment satisfies the above-mentioned surface resistivity, it becomes easy to favorably hold the dicing sheet on the electrostatic chuck table. Therefore, in this case, it is preferable to use the dicing sheet for plasma dicing in which an electrostatic chuck table is used as a support.

Further, when the pressure-sensitive adhesive layer in the dicing sheet according to the present embodiment is composed of the active energy ray-curable pressure-sensitive adhesive as described above, the obtained chips are diced into sheets after completion of singulation of the work. It is preferable to irradiate the pressure-sensitive adhesive layer in the dicing sheet with active energy rays before separating from the above. As a result, the pressure-sensitive adhesive layer is cured, and the adhesive force of the dicing sheet to the chip can be reduced, which facilitates separation of the chip from the dicing sheet.

As the above-mentioned active energy ray, for example, an electromagnetic wave or a charged particle beam having an energy quantum can be used, and specifically, an ultraviolet ray, an electron beam or the like can be used. Particularly, ultraviolet rays, which are easy to handle, are preferable. Irradiation of ultraviolet rays, a high-pressure mercury lamp, can be performed by a xenon lamp, LED, etc., the dose of ultraviolet ray is illuminance 50 mW / cm ² or more, and preferably 1000 mW / cm ² or less. Further, the light amount is preferably at 50 mJ / cm ² or more, particularly preferably at 80 mJ / cm ² or more, and further preferably not 200 mJ / cm ² or more. Further, the light amount is preferably at 10000 mJ / cm ² or less, particularly preferably at 5000 mJ / cm ² or less, and further preferably not 2000 mJ / cm ² or less. On the other hand, the electron beam irradiation can be performed by an electron beam accelerator or the like, and the electron beam irradiation amount is preferably 10 krad or more and 1000 krad or less.

The embodiments described above are described to facilitate the understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above-described embodiment is intended to include all design changes and equivalents within the technical scope of the present invention.

For example, another layer may be provided between the base material and the pressure-sensitive adhesive layer, or on the surface of the base material opposite to the pressure-sensitive adhesive layer.

Hereinafter, the present invention will be described more specifically with reference to Examples and the like, but the scope of the present invention is not limited to these Examples and the like.

[Example 1]
(1) Preparation of adhesive composition 90 parts by mass of 2-ethylhexyl acrylate and 10 parts by mass of 2-hydroxyethyl acrylate were copolymerized by a solution polymerization method to prepare a (meth)acrylic acid ester polymer. .. When the molecular weight of this polymer was measured using gel permeation chromatography (GPC) described later, the weight average molecular weight (Mw) was 600,000.

100 parts by mass of the obtained (meth)acrylic acid ester polymer (solid content conversion value; the same applies hereinafter), and trimethylolpropane-modified tolylene diisocyanate as an isocyanate-based cross-linking agent (Tosoh Corp., product name "Coronate L") 5 By mixing with 10 parts by mass and diluting with ethyl acetate, a coating solution of the adhesive composition was prepared.

(2) Preparation of base material An ethylene-methacrylic acid copolymer (manufactured by Mitsui DuPont Polychemical Co., Ltd., product name "Nucrel N0908C", ratio of constituent units derived from methacrylic acid: 9% by mass) was mixed with a twin-screw kneader (Toyo Seiki). The raw material for extrusion was obtained by melt-kneading at 210° C. with a product name “Laboplast Mill” manufactured by Seisakusho.

The obtained raw material for extrusion was extrusion-molded by a small-sized T-die extruder (manufactured by Toyo Seiki Seisakusho, product name “Labo Plastomill”) to obtain a base material having a thickness of 100 μm.

(3) Preparation of dicing sheet The coating liquid of the adhesive composition obtained in the above step (1) was applied to one side of the substrate obtained in the above step (2), and the obtained coating film was formed. By drying at 100° C. for 1 minute, a pressure-sensitive adhesive layer having a thickness of 10 μm and formed of a pressure-sensitive adhesive having no active energy ray curability was formed. Thus, a dicing sheet including the base material and the pressure-sensitive adhesive layer was obtained.

Here, the above-mentioned weight average molecular weight (Mw) is a weight average molecular weight in terms of standard polystyrene measured by gel permeation chromatography (GPC) (GPC measurement).

[Example 2]
95 parts by mass of n-butyl acrylate and 5 parts by mass of acrylic acid were copolymerized by a solution polymerization method to prepare a (meth)acrylic acid ester polymer. When the molecular weight of this polymer was measured using gel permeation chromatography (GPC) described later, the weight average molecular weight (Mw) was 500,000.

100 parts by mass of the obtained (meth)acrylic acid ester polymer, 120 parts by mass of a urethane acrylate oligomer (Mw:8000), 5 parts by mass of an isocyanate curing agent (Tosoh Corporation, product name "Coronate L"), and light. 4 parts by mass of a polymerization initiator (manufactured by Ciba Specialty Chemicals, product name “Irgacure 184”) was mixed to obtain an adhesive composition having active energy ray curability.

A dicing sheet was obtained in the same manner as in Example 1 except that the pressure sensitive adhesive composition was used. The pressure-sensitive adhesive layer in the obtained dicing sheet is composed of a pressure-sensitive adhesive having active energy ray curability.

[Example 3]
(1) Preparation of Extrusion Raw Material for the First Layer Ethylene-methacrylic acid copolymer (manufactured by Mitsui DuPont Polychemical Co., product name "Nucrel N0903HC", ratio of constituent units derived from methacrylic acid: 9% by mass, 23°C) Tensile modulus of elasticity at 140 MPa) and ethylene-polypropylene random copolymer (manufactured by Prime Polymer Co., product name “Prime Polypro F227D”, tensile modulus at 23° C.: 950 MPa, 230° C., MFR at load of 2.16 kgf: 7.0 g/10 min, melting peak temperature: 135° C., heat of fusion: 81.9 J/g) at a mass ratio of 97:3, a twin-screw kneader (manufactured by Toyo Seiki Seisakusho, Ltd., product name “Labo Plastomill”). ]) were melt-kneaded to obtain an extrusion raw material A for the first layer.

(2) Preparation of raw material for extrusion for the second layer Ethylene-methacrylic acid copolymer (manufactured by Mitsui DuPont Polychemical Co., product name "Nucrel N0903HC", ratio of constituent units derived from methacrylic acid: 9% by mass, at 23°C) Tensile elastic modulus: 140 MPa) was melt-kneaded with a twin-screw kneader (manufactured by Toyo Seiki Seisakusho, product name “Laboplast Mill”) to obtain an extrusion raw material B for the second layer.

(3) Production of base material A small T-die extruder (manufactured by Toyo Seiki Seisakusho Co., Ltd.) was prepared by using the extrusion raw material A obtained in the step (1) and the extrusion raw material B obtained in the step (2). Co-extrusion molding was performed by a product name “Labo Plastomill”) to obtain a base material having a two-layer structure including a first layer having a thickness of 40 μm and a second layer having a thickness of 60 μm.

(4) Preparation of dicing sheet A dicing sheet was obtained in the same manner as in Example 1 except that the pressure-sensitive adhesive layer was formed on the surface of the base material obtained in the step (3) on the first layer side.

[Example 4]
100 parts by mass of ethylene-methacrylic acid copolymer (manufactured by Mitsui DuPont Polychemical Co., Ltd., product name “Nucrel N0903H, ratio of methacrylic acid-derived constitutional units: 9% by mass) and bifunctional bisphenol A type epoxy resin (Japan Epoxy) 0.25 parts by mass of resin, product name "jER1055", number average molecular weight Mn: 1600) melted at 210°C with a twin-screw kneader (manufactured by Toyo Seiki Seisakusho, product name "Labo Plastomill"). The mixture was kneaded to obtain a raw material for extrusion. The obtained raw material for extrusion was extrusion-molded by a small-sized T-die extruder (manufactured by Toyo Seiki Seisakusho, product name “Labo Plastomill”) to obtain a base material having a thickness of 100 μm. A dicing sheet was obtained in the same manner as in Example 1 except that the base material was used.

[Example 5]
A dicing sheet was obtained in the same manner as in Example 1 except that a 100-μm-thick polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., product name “Cosmo Shine A4100”) was used as a substrate.

[Comparative Example 1]
100 parts by mass of polyvinyl chloride resin (PVC; average degree of polymerization 1050), 52 parts by mass of polyester plasticizer, and a small amount of stabilizer are kneaded and molded into a film by using a calendering device to obtain a film having a thickness of 80 μm. A vinyl chloride film was obtained. A dicing sheet was obtained in the same manner as in Example 1 except that the vinyl chloride film was used as the substrate.

[Comparative Example 2]
A dicing sheet was obtained in the same manner as in Example 2 except that a vinyl chloride film having a thickness of 80 μm produced in the same manner as in Comparative Example 1 was used as a substrate.

[Test Example 1] (Measurement of mass reduction rate)
The dicing sheets manufactured in the examples and comparative examples were cut into a size of 10 cm×10 cm to obtain measurement samples. The mass of the measurement sample was measured and used as the mass before vacuum conditions were applied.

Then, the above-mentioned measurement sample was put into a vacuum low-temperature dryer (manufactured by Tokyo Rika Kikai Co., Ltd., product name “VOS-201SD”) set to a vacuum condition of atmospheric pressure 0.1 MPa and temperature 25° C., and under the vacuum conditions. Let stand for 60 minutes. Then, the measurement sample was taken out from the vacuum low temperature dryer, and the mass was measured again. The obtained mass was taken as the mass after the vacuum conditions were applied.

Then, the following formula mass reduction rate={(mass before vacuum condition injection)−(mass after vacuum condition injection)}/(mass before vacuum condition injection)×100
Based on, the mass reduction rate was calculated. The results are shown in Table 1.

[Test Example 2] (Measurement of surface resistivity)
The surface resistivity of the base material side surface of the dicing sheets manufactured in Examples and Comparative Examples was measured according to JIS K6911 under a temperature of 23° C. and a relative humidity of 50% under a surface resistance measuring instrument (manufactured by ADVANTEST, product name). "R8252-TR42"). The surface resistivity of the dicing sheet according to Example 2 was measured before being irradiated with the active energy ray. The results are shown in Table 1.

[Test Example 3] (Evaluation of suitability for plasma dicing)
A pressure-sensitive adhesive layer-side surface of the dicing sheets manufactured in Examples and Comparative Examples is attached to a surface opposite to the resist on a silicon wafer having a diameter of 8 inches with a patterned dicing line on one surface. did.

Then, on the electrostatic chuck table in the plasma dicing apparatus equipped with the electrostatic chuck table in the vacuum chamber, the dicing sheet having the silicon wafer adhered as described above is placed with the surface on the base material side facing down. , Held by electrostatic adsorption.

Then, the inside of the vacuum chamber is set to a vacuum condition of an air pressure of 0.03 MPa and a temperature of 25° C., SF ₆ gas is used as a plasma generating gas, and a plasma is applied to the silicon wafer through the resist at an etching rate of 0.3 m/s. Was irradiated. At this time, peeling of the dicing sheet from the electrostatic chuck table was confirmed, and plasma dicing suitability was evaluated based on the following criteria. The results are shown in Table 1.
◯: Plasma dicing was successfully performed without peeling of the dicing sheet from the electrostatic chuck table.
X: The dicing sheet was peeled off from the electrostatic chuck table, and plasma dicing could not be performed.

Details of the abbreviations and the like shown in Table 1 are as follows.
[Base material]
EMAA1: ethylene-methacrylic acid copolymer (manufactured by Mitsui DuPont Polychemical Co., Ltd., product name "Nucrel N0908C", ratio of methacrylic acid-derived constitutional unit: 9% by mass)
EMAA2: ethylene-methacrylic acid copolymer (manufactured by Mitsui DuPont Polychemical Co., Ltd., product name "Nucrel N0903HC", ratio of methacrylic acid-derived constituent units: 9% by mass, tensile elastic modulus at 23° C.: 140 MPa)
Propylene-based copolymer: ethylene-polypropylene random copolymer (manufactured by Prime Polymer Co., product name "Prime Polypro F227D", tensile elastic modulus at 23°C: 950 MPa, 230°C, MFR at load 2.16 kgf: 7.0 g /10 min, melting peak temperature: 135° C., heat of fusion: 81.9 J/g)
EMAA3: ethylene-methacrylic acid copolymer (manufactured by Mitsui DuPont Polychemical Co., Ltd., product name "Nucrel N0903H", ratio of methacrylic acid-derived constitutional unit: 9% by mass)
Epoxy compound: Bifunctional bisphenol A type epoxy resin (manufactured by Japan Epoxy Resin Co., product name "jER1055", number average molecular weight Mn: 1600)
PET: Polyethylene terephthalate PVC: Polyvinyl chloride

As can be seen from Table 1, the dicing sheets obtained in the examples were able to well hold the work when used for plasma dicing, thereby enabling good plasma dicing.

The dicing sheet of the present invention can be suitably used for plasma dicing.

Claims (6)

A dicing sheet for plasma dicing, comprising a base material and an adhesive layer laminated on one side of the base material,
The mass reduction rate of the dicing sheet for plasma dicing is 0.4% or less when the dicing sheet for plasma dicing is allowed to stand for 60 minutes in an environment with an atmospheric pressure of 0.1 MPa and a temperature of 25° C. Dicing sheet for plasma dicing. The dicing sheet for plasma dicing according to claim 1, wherein the surface resistivity of the dicing sheet for plasma dicing measured from the surface on the substrate side is 1.0×10 ¹⁵ Ω/sq or more. .. The dicing sheet for plasma dicing according to claim 1, wherein the substrate has a thickness of 50 μm or more and 200 μm or less. The dicing sheet for plasma dicing according to any one of claims 1 to 3, wherein the pressure-sensitive adhesive layer has a thickness of 1 µm or more and 50 µm or less. The dicing sheet for plasma dicing according to any one of claims 1 to 4, wherein the pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive having no active energy ray curability. The pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive having active energy ray curability,
The dicing agent for plasma dicing according to any one of claims 1 to 4, wherein the pressure-sensitive adhesive contains an acrylic copolymer in which a functional group having an active energy ray curability is introduced into a side chain. Sheet.