JP2016539034A5 - - Google Patents

Download PDF

Info

Publication number
JP2016539034A5
JP2016539034A5 JP2016544776A JP2016544776A JP2016539034A5 JP 2016539034 A5 JP2016539034 A5 JP 2016539034A5 JP 2016544776 A JP2016544776 A JP 2016544776A JP 2016544776 A JP2016544776 A JP 2016544776A JP 2016539034 A5 JP2016539034 A5 JP 2016539034A5
Authority
JP
Japan
Prior art keywords
film
printing
entity
flat film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016544776A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016539034A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/FI2014/050729 external-priority patent/WO2015044523A1/en
Publication of JP2016539034A publication Critical patent/JP2016539034A/ja
Publication of JP2016539034A5 publication Critical patent/JP2016539034A5/ja
Pending legal-status Critical Current

Links

JP2016544776A 2013-09-27 2014-09-25 電気機械的構造体を製造するための方法およびその方法を実施するための装置 Pending JP2016539034A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361883484P 2013-09-27 2013-09-27
US61/883,484 2013-09-27
PCT/FI2014/050729 WO2015044523A1 (en) 2013-09-27 2014-09-25 Method for manufacturing an electromechanical structure and an arrangement for carrying out the method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019232630A Division JP7221858B2 (ja) 2013-09-27 2019-12-24 電気機械的構造体を製造するための方法およびその方法を実施するための装置

Publications (2)

Publication Number Publication Date
JP2016539034A JP2016539034A (ja) 2016-12-15
JP2016539034A5 true JP2016539034A5 (enExample) 2018-02-08

Family

ID=52742142

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2016544776A Pending JP2016539034A (ja) 2013-09-27 2014-09-25 電気機械的構造体を製造するための方法およびその方法を実施するための装置
JP2019232630A Active JP7221858B2 (ja) 2013-09-27 2019-12-24 電気機械的構造体を製造するための方法およびその方法を実施するための装置
JP2022062869A Active JP7656568B2 (ja) 2013-09-27 2022-04-05 電気機械的構造体を製造するための方法およびその方法を実施するための装置
JP2023054798A Active JP7654705B2 (ja) 2013-09-27 2023-03-30 電気機械的構造体を製造するための方法およびその方法を実施するための装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2019232630A Active JP7221858B2 (ja) 2013-09-27 2019-12-24 電気機械的構造体を製造するための方法およびその方法を実施するための装置
JP2022062869A Active JP7656568B2 (ja) 2013-09-27 2022-04-05 電気機械的構造体を製造するための方法およびその方法を実施するための装置
JP2023054798A Active JP7654705B2 (ja) 2013-09-27 2023-03-30 電気機械的構造体を製造するための方法およびその方法を実施するための装置

Country Status (9)

Country Link
US (9) US10660211B2 (enExample)
EP (2) EP3049227B1 (enExample)
JP (4) JP2016539034A (enExample)
KR (4) KR102444268B1 (enExample)
CN (4) CN106061704A (enExample)
ES (2) ES2900225T3 (enExample)
PL (1) PL3957459T3 (enExample)
TW (1) TWI610881B (enExample)
WO (1) WO2015044523A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10660211B2 (en) 2013-09-27 2020-05-19 Tactotek Oy Method for manufacturing an electromechanical structure
US20160113118A1 (en) * 2014-09-23 2016-04-21 Osram Sylvania Inc. Formable light source and method of making
EP3124197B1 (en) * 2015-07-31 2017-12-20 C.R.F. Società Consortile per Azioni Method for manufacturing a component for a motor-vehicle interior
EP3187322A1 (en) 2015-12-31 2017-07-05 Arjo Wiggins Fine Papers Limited Use of printed electronics on paper to embed a circuit into plastic moulded objects
EP3795334B1 (en) * 2015-12-07 2023-02-22 Nike Innovate C.V. Three-dimensional printing utilizing a captive element
EP4325264A3 (en) * 2016-04-13 2024-05-22 TactoTek Oy Illuminated multilayer structure with embedded light sources
FR3052594B1 (fr) 2016-06-10 2018-11-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif a piste electriquement conductrice et procede de fabrication du dispositif
FR3061800B1 (fr) * 2017-01-12 2019-05-31 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur
FR3069476A1 (fr) * 2017-07-31 2019-02-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation d'une piece moulee dotee d'au moins un dispositif electromecanique
DE102017129975A1 (de) * 2017-12-14 2019-06-19 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauteils und Halbleiterbauteil
US10119869B1 (en) * 2017-12-21 2018-11-06 Tactotek Oy Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device
CN108556246B (zh) * 2018-04-27 2020-08-18 滁州迪蒙德模具制造有限公司 一种使零件与薄膜一体成型的便捷式成型模具
DE102018112649B3 (de) * 2018-05-25 2019-08-08 Uwe Beier Eingabevorrichtung zur Steuerung eines elektronischen Gerätes und Verfahren zu ihrer Herstellung
TWI853828B (zh) 2018-08-07 2024-09-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法
EP3991525A1 (en) * 2019-06-28 2022-05-04 Lumileds LLC Three-dimensional light emitting appliance
FR3102083B1 (fr) * 2019-10-16 2021-10-08 Safran Seats Procede de fabrication d'une piece finie
JP7473175B2 (ja) * 2020-06-01 2024-04-23 国立研究開発法人産業技術総合研究所 立体デバイスの製造方法
JP7514137B2 (ja) * 2020-07-31 2024-07-10 株式会社日本製鋼所 成形方法および成形システム
KR102357563B1 (ko) 2020-12-14 2022-02-07 인탑스 주식회사 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법
KR102418622B1 (ko) 2020-12-30 2022-07-07 인탑스 주식회사 가열 및 발광 기능 동시 구현 레이돔 구조
KR102394587B1 (ko) 2021-07-19 2022-05-06 인탑스 주식회사 다중 ime 구조 및 그 제조 방법
TWI872486B (zh) * 2022-03-23 2025-02-11 美商阿爾發金屬化工公司 可成形及可撓性觸覺材料及結構
EP4561269A1 (en) 2023-11-22 2025-05-28 Grupo Antolin-Ingenieria, S.A. Method for manufacturing trim panels for vehicles having an electronic function

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850582B2 (ja) * 1979-08-24 1983-11-11 道男 長田 半導体封入成形方法とその金型装置
CA1243417A (en) * 1984-03-16 1988-10-18 Shoji Tanaka Printed circuit board laminating apparatus
US4584767A (en) * 1984-07-16 1986-04-29 Gregory Vernon C In-mold process for fabrication of molded plastic printed circuit boards
JPS61176139A (ja) * 1985-01-31 1986-08-07 Alps Electric Co Ltd 混成集積回路およびその製造方法
JPH0712111B2 (ja) * 1985-09-04 1995-02-08 ユーエフイー・インコーポレイテッド 電気回路埋設方法及びプラスチック製品
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
JPS63284888A (ja) * 1987-05-18 1988-11-22 Furukawa Electric Co Ltd:The 回路成形体の製造方法
JPH0170349U (enExample) * 1987-10-29 1989-05-10
JP2751450B2 (ja) 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
JP2747096B2 (ja) * 1990-07-24 1998-05-06 北川工業株式会社 ３次元回路基板の製造方法
ATE180137T1 (de) * 1992-06-15 1999-05-15 Heinze Dyconex Patente Verfahren zur herstellung von leiterplatten unter verwendung eines halbzeuges mit extrem dichter verdrahtung für die signalführung
JPH066010A (ja) * 1992-06-19 1994-01-14 Murata Mfg Co Ltd 立体回路基板の製造方法
US5264061A (en) 1992-10-22 1993-11-23 Motorola, Inc. Method of forming a three-dimensional printed circuit assembly
US5780965A (en) 1993-12-09 1998-07-14 Key Plastics, Inc. Three dimensional electroluminescent display
US5622652A (en) * 1995-06-07 1997-04-22 Img Group Limited Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid
US5979043A (en) * 1997-07-14 1999-11-09 Ford Motor Company Method of manufacturing a circuit assembly from two or more layers of flexible film
JPH1158680A (ja) 1997-08-22 1999-03-02 Canon Inc スクリーン印刷機および画像形成装置の製造方法
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
JP2000277893A (ja) * 1999-03-23 2000-10-06 Seiko Epson Corp 熱圧着用ヘッド及びこれを備えた熱圧着装置
JP2001177224A (ja) 1999-12-17 2001-06-29 Sony Corp 立体回路基板及びその製造方法
DE112004000260T5 (de) * 2003-02-12 2006-01-19 Teikoku Tsushin Kogyo Co. Ltd., Kawasaki Elektronikbauteilleiterplatte und Verfahren zu deren Herstellung
US7200009B2 (en) 2003-07-01 2007-04-03 Nokia Corporation Integrated electromechanical arrangement and method of production
US7080787B2 (en) 2003-07-03 2006-07-25 Symbol Technologies, Inc. Insert molded antenna
ATE365381T1 (de) 2004-03-16 2007-07-15 Vhf Technologies Sa Elektrische energieerzeugungsmodule mit zweidimensionalem profil und herstellungsverfahren dafür
GB2412247B (en) 2004-03-16 2007-08-22 In2Tec Ltd Contoured circuit boards
US7157309B2 (en) * 2004-04-09 2007-01-02 Tessera, Inc. Manufacture of microelectronic fold packages
US7486280B2 (en) * 2005-08-04 2009-02-03 Uniplas Enterprises Pte, Ltd. Contoured capacitive touch control panel
US20070069418A1 (en) 2005-09-28 2007-03-29 Chih-Yuan Liao In mold manufacturing of an object comprising a functional element
US20100196651A1 (en) * 2005-09-28 2010-08-05 Sipix Chemical Inc. Mold manufacturing of an object comprising a functional element, transfering process and object
US20070184273A1 (en) 2006-02-09 2007-08-09 Husky Injection Molding Systems Ltd. Overmolding of Inserts
JP4857859B2 (ja) 2006-03-30 2012-01-18 凸版印刷株式会社 印刷方法および薄膜トランジスタの製造方法
DE102006028816B4 (de) * 2006-06-21 2008-05-15 Hansatronic Gmbh Verfahren zum getakteten, kontinuierlichen Herstellen von beidseitig umspritzten flexiblen Leiterplatten
FR2905198B1 (fr) 2006-08-22 2008-10-17 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
US8198979B2 (en) 2007-04-20 2012-06-12 Ink-Logix, Llc In-molded resistive and shielding elements
US8514545B2 (en) 2007-04-20 2013-08-20 Ink-Logix, Llc In-molded capacitive switch
US8778124B2 (en) * 2008-01-17 2014-07-15 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
US9117602B2 (en) 2008-01-17 2015-08-25 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
CN103872002B (zh) 2008-03-05 2017-03-01 伊利诺伊大学评议会 可拉伸和可折叠的电子器件
CN101587980A (zh) 2008-05-20 2009-11-25 李建宏 在机壳上形成天线的方法
KR101484944B1 (ko) 2008-10-02 2015-01-22 삼성전자 주식회사 전자기기 케이스 및 이의 제조방법
FI121862B (fi) * 2008-10-24 2011-05-13 Valtion Teknillinen Järjestely kosketusnäyttöä varten ja vastaava valmistusmenetelmä
US20100151118A1 (en) * 2008-12-17 2010-06-17 Eastman Chemical Company Carrier solvent compositions, coatings compositions, and methods to produce thick polymer coatings
CN102484308A (zh) 2009-04-21 2012-05-30 莫列斯公司 三维天线
FI124221B (fi) 2009-04-24 2014-05-15 Valtion Teknillinen Käyttäjäsyötejärjestely ja siihen liittyvä valmistusmenetelmä
WO2011008459A2 (en) * 2009-06-29 2011-01-20 Infinite Corridor Technology, Llc Structured material substrates for flexible, stretchable electronics
FI20096062A7 (fi) 2009-10-15 2011-04-16 Valtion Teknillinen Tutkimuskeskus Käyttöliittymäjärjestely ja menetelmä sen valmistamiseksi
US9090456B2 (en) * 2009-11-16 2015-07-28 Qualcomm Mems Technologies, Inc. System and method of manufacturing an electromechanical device by printing raised conductive contours
JP5323668B2 (ja) * 2009-12-24 2013-10-23 日本メクトロン株式会社 照明装置及びその製造方法
CN102264198A (zh) * 2010-05-27 2011-11-30 昆山同寅兴业机电制造有限公司 电子产品外壳的结构及其加工工艺
EP2395572A1 (de) 2010-06-10 2011-12-14 Bayer MaterialScience AG Schichtaufbau umfassend elektrotechnische Bauelemente
JPWO2012049898A1 (ja) 2010-10-15 2014-02-24 日本電気株式会社 部品内蔵モジュール及びこれを備える電子機器並びに部品内蔵モジュールの製造方法
JP5636947B2 (ja) * 2010-12-21 2014-12-10 日本電気株式会社 部品内蔵モジュール及びこれを備える電子機器
EP2378846A1 (de) 2011-01-25 2011-10-19 Bayer Material Science AG Dekorative Produktoberfläche mit Leiterplattenfunktion
CN102651723B (zh) 2011-02-25 2015-06-10 澜起科技（上海）有限公司 基于时域训练序列的信道估计方法及系统
US9030837B2 (en) * 2011-06-10 2015-05-12 Scott Moncrieff Injection molded control panel with in-molded decorated plastic film that includes an internal connector
DE112012003250T5 (de) * 2011-08-05 2014-04-30 Mc10, Inc. Katheder Ballon-Verfahren und Vorrichtung unter Einsatz von Abtastelementen
JP6277130B2 (ja) * 2011-10-05 2018-02-14 エムシーテン、インコーポレイテッド 医療用の装置およびそれの製造方法
KR101479892B1 (ko) * 2011-10-18 2015-01-06 피셔 테크놀로지 피티이. 엘티디. 몰딩하는 방법
US20130152386A1 (en) 2011-12-15 2013-06-20 Praveen Pandojirao-S Methods and apparatus to form electrical interconnects on ophthalmic devices
US10748867B2 (en) 2012-01-04 2020-08-18 Board Of Regents, The University Of Texas System Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices
GB2500037A (en) 2012-03-08 2013-09-11 Tactotek Oy An integrated light guide.
US9226402B2 (en) * 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
JP2013258172A (ja) * 2012-06-11 2013-12-26 Panasonic Corp 電子部品実装システムおよび電子部品実装方法
WO2014012024A2 (en) * 2012-07-12 2014-01-16 Massachusetts Institute Of Technology Strain engineered band gaps
DE102012109820B4 (de) * 2012-10-15 2014-09-18 Leonhard Kurz Stiftung & Co. Kg Durch In-Mould-Verfahren hergestellter Körper und Verfahren zu seiner Herstellung
US20140160692A1 (en) * 2012-12-07 2014-06-12 Pc Concepts Limited Method for surface decoration of an object with 3-dimensional geometry and the object obtained therefrom
US9451714B2 (en) 2012-12-21 2016-09-20 Gurit (USA) Inc. Housing components of handheld electronic devices
US20140182875A1 (en) * 2012-12-28 2014-07-03 Mark Sprenger Case for an electronic device
CH708048A2 (de) 2013-05-13 2014-11-14 Abatek Internat Ag Funktionsträger mit Tastenfunktionen.
US9335034B2 (en) * 2013-09-27 2016-05-10 Osram Sylvania Inc Flexible circuit board for electronic applications, light source containing same, and method of making
US10660211B2 (en) 2013-09-27 2020-05-19 Tactotek Oy Method for manufacturing an electromechanical structure
US20150257278A1 (en) * 2014-03-06 2015-09-10 Tactotek Oy Method for manufacturing electronic products, related arrangement and product
TWI709481B (zh) * 2014-08-25 2020-11-11 日商東洋紡股份有限公司 矽烷偶合劑層疊層高分子膜及其製造方法、疊層體及其製造方法、可撓性電子器件之製造方法
US20160282977A1 (en) * 2015-03-23 2016-09-29 Synaptics Inc. Capacitive sensing assembly including a thin film plastic
KR101762807B1 (ko) * 2016-01-28 2017-07-28 주식회사 탑앤씨 이차전지용 파우치필름 실링장치

Similar Documents

Publication Publication Date Title
JP2016539034A5 (enExample)
JP7221858B2 (ja) 電気機械的構造体を製造するための方法およびその方法を実施するための装置
EP3114910B1 (en) Method for manufacturing electronic products and related manufacturing arrangement
JP2017501056A5 (enExample)
TW201240819A (en) Metal-colored and non-conductive transfer film
TW200714142A (en) Method of continuous producing flexible printed circuit board
US20170135220A1 (en) Printable Films for Printed Circuit Boards and Processes for Making Same
JP6582456B2 (ja) 積層造形装置および積層造形方法
CN103779240B (zh) 制造电路板的方法及使用其制造的芯片封装件和电路板
KR100859008B1 (ko) 배선기판 제조방법
JP2016090795A (ja) 回路パターンの形成方法、フォトマスク、フォトマスクの製造方法、及び電気電子機器の製造方法
TWI630854B (zh) 電路板的製備方法
KR20130134528A (ko) 마이크로 패턴과 나노홀로그램 패턴이 형성된 성형물 제작용 금형 및 이의 제작 방법
HK40051688A (en) Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
CN101431866A (zh) 利用水洗工艺制造软性电路板的方法
EP3632192A2 (en) Method of producing an electrical through connection between opposite surfaces of a flexible substrate
TW202401504A (zh) 用於製造數個電氣節點之方法、電氣節點模組、電氣節點及多層結構
JP2017159563A (ja) 積層造形装置および積層造形方法
JP2005251902A (ja) プリント基板の製造方法。
KR101438788B1 (ko) 패턴성형필름
HK40051688B (zh) 用於制造机电结构的方法以及用於执行该方法的装置
KR20190132727A (ko) 인쇄회로기판의 신축변화 방지 방법
JPH11330670A (ja) 電子回路の形成方法
JP2009111233A (ja) 軟質回路板