KR102444268B1 - 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열 - Google Patents

전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열 Download PDF

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KR102444268B1
KR102444268B1 KR1020217016798A KR20217016798A KR102444268B1 KR 102444268 B1 KR102444268 B1 KR 102444268B1 KR 1020217016798 A KR1020217016798 A KR 1020217016798A KR 20217016798 A KR20217016798 A KR 20217016798A KR 102444268 B1 KR102444268 B1 KR 102444268B1
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film
manufacturing
forming
electronic device
entity
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KR20210069123A (ko
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미코 헤이키넨
자모 사키
야코 토비넨
파보 니스카라
미코 시파리
파시 라파나
안티 케라넨
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택토텍 오와이
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C2045/169—Making multilayered or multicoloured articles injecting electrical circuits, e.g. one layer being made of conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1020217016798A 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열 Active KR102444268B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361883484P 2013-09-27 2013-09-27
US61/883,484 2013-09-27
PCT/FI2014/050729 WO2015044523A1 (en) 2013-09-27 2014-09-25 Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
KR1020207025316A KR102444269B1 (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020207025316A Division KR102444269B1 (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열

Publications (2)

Publication Number Publication Date
KR20210069123A KR20210069123A (ko) 2021-06-10
KR102444268B1 true KR102444268B1 (ko) 2022-09-16

Family

ID=52742142

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020217016798A Active KR102444268B1 (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열
KR1020227030991A Active KR102539522B1 (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열
KR1020207025316A Active KR102444269B1 (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열
KR1020167011262A Ceased KR20160094936A (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020227030991A Active KR102539522B1 (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열
KR1020207025316A Active KR102444269B1 (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열
KR1020167011262A Ceased KR20160094936A (ko) 2013-09-27 2014-09-25 전기기계의 구조를 제작하기 위한 방법 및 그 방법을 수행하기 위한 배열

Country Status (9)

Country Link
US (9) US10660211B2 (enExample)
EP (2) EP3049227B1 (enExample)
JP (4) JP2016539034A (enExample)
KR (4) KR102444268B1 (enExample)
CN (4) CN106061704A (enExample)
ES (2) ES2900225T3 (enExample)
PL (1) PL3957459T3 (enExample)
TW (1) TWI610881B (enExample)
WO (1) WO2015044523A1 (enExample)

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FR3052594B1 (fr) 2016-06-10 2018-11-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif a piste electriquement conductrice et procede de fabrication du dispositif
FR3061800B1 (fr) * 2017-01-12 2019-05-31 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur
FR3069476A1 (fr) * 2017-07-31 2019-02-01 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation d'une piece moulee dotee d'au moins un dispositif electromecanique
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US10119869B1 (en) * 2017-12-21 2018-11-06 Tactotek Oy Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device
CN108556246B (zh) * 2018-04-27 2020-08-18 滁州迪蒙德模具制造有限公司 一种使零件与薄膜一体成型的便捷式成型模具
DE102018112649B3 (de) * 2018-05-25 2019-08-08 Uwe Beier Eingabevorrichtung zur Steuerung eines elektronischen Gerätes und Verfahren zu ihrer Herstellung
TWI853828B (zh) 2018-08-07 2024-09-01 加拿大國家研究委員會 包覆成型的印刷電子零件和其製造方法
EP3991525A1 (en) * 2019-06-28 2022-05-04 Lumileds LLC Three-dimensional light emitting appliance
FR3102083B1 (fr) * 2019-10-16 2021-10-08 Safran Seats Procede de fabrication d'une piece finie
JP7473175B2 (ja) * 2020-06-01 2024-04-23 国立研究開発法人産業技術総合研究所 立体デバイスの製造方法
JP7514137B2 (ja) * 2020-07-31 2024-07-10 株式会社日本製鋼所 成形方法および成形システム
KR102357563B1 (ko) 2020-12-14 2022-02-07 인탑스 주식회사 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법
KR102418622B1 (ko) 2020-12-30 2022-07-07 인탑스 주식회사 가열 및 발광 기능 동시 구현 레이돔 구조
KR102394587B1 (ko) 2021-07-19 2022-05-06 인탑스 주식회사 다중 ime 구조 및 그 제조 방법
TWI872486B (zh) * 2022-03-23 2025-02-11 美商阿爾發金屬化工公司 可成形及可撓性觸覺材料及結構
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