TWI610881B - 用以製造機電結構的方法和用以實行該方法的配置 - Google Patents
用以製造機電結構的方法和用以實行該方法的配置 Download PDFInfo
- Publication number
- TWI610881B TWI610881B TW103133399A TW103133399A TWI610881B TW I610881 B TWI610881 B TW I610881B TW 103133399 A TW103133399 A TW 103133399A TW 103133399 A TW103133399 A TW 103133399A TW I610881 B TWI610881 B TW I610881B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- flat film
- dimensional
- printing
- electronic components
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 83
- 239000004020 conductor Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 238000000465 moulding Methods 0.000 claims abstract description 12
- 239000010408 film Substances 0.000 claims description 177
- 230000008569 process Effects 0.000 claims description 33
- 238000007639 printing Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 21
- 238000005516 engineering process Methods 0.000 claims description 15
- 238000003856 thermoforming Methods 0.000 claims description 15
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000007666 vacuum forming Methods 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 238000000071 blow moulding Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 229920001903 high density polyethylene Polymers 0.000 claims description 4
- 229920005669 high impact polystyrene Polymers 0.000 claims description 4
- 239000004700 high-density polyethylene Substances 0.000 claims description 4
- 239000004797 high-impact polystyrene Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 3
- 238000004873 anchoring Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000007646 gravure printing Methods 0.000 claims description 2
- 238000007641 inkjet printing Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 2
- 238000010022 rotary screen printing Methods 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 238000000427 thin-film deposition Methods 0.000 claims description 2
- RYNNCVCHGQBRQR-UHFFFAOYSA-N C=C.C1=CC=CC=C1.C=CC=C.C(C=C)#N Chemical group C=C.C1=CC=CC=C1.C=CC=C.C(C=C)#N RYNNCVCHGQBRQR-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 8
- 238000007493 shaping process Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 239000012778 molding material Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C2045/169—Making multilayered or multicoloured articles injecting electrical circuits, e.g. one layer being made of conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361883484P | 2013-09-27 | 2013-09-27 | |
| US61/883,484 | 2013-09-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201522202A TW201522202A (zh) | 2015-06-16 |
| TWI610881B true TWI610881B (zh) | 2018-01-11 |
Family
ID=52742142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103133399A TWI610881B (zh) | 2013-09-27 | 2014-09-26 | 用以製造機電結構的方法和用以實行該方法的配置 |
Country Status (9)
| Country | Link |
|---|---|
| US (9) | US10660211B2 (enExample) |
| EP (2) | EP3049227B1 (enExample) |
| JP (4) | JP2016539034A (enExample) |
| KR (4) | KR102444268B1 (enExample) |
| CN (4) | CN106061704A (enExample) |
| ES (2) | ES2900225T3 (enExample) |
| PL (1) | PL3957459T3 (enExample) |
| TW (1) | TWI610881B (enExample) |
| WO (1) | WO2015044523A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10660211B2 (en) | 2013-09-27 | 2020-05-19 | Tactotek Oy | Method for manufacturing an electromechanical structure |
| US20160113118A1 (en) * | 2014-09-23 | 2016-04-21 | Osram Sylvania Inc. | Formable light source and method of making |
| EP3124197B1 (en) * | 2015-07-31 | 2017-12-20 | C.R.F. Società Consortile per Azioni | Method for manufacturing a component for a motor-vehicle interior |
| EP3187322A1 (en) | 2015-12-31 | 2017-07-05 | Arjo Wiggins Fine Papers Limited | Use of printed electronics on paper to embed a circuit into plastic moulded objects |
| EP3795334B1 (en) * | 2015-12-07 | 2023-02-22 | Nike Innovate C.V. | Three-dimensional printing utilizing a captive element |
| EP4325264A3 (en) * | 2016-04-13 | 2024-05-22 | TactoTek Oy | Illuminated multilayer structure with embedded light sources |
| FR3052594B1 (fr) | 2016-06-10 | 2018-11-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif a piste electriquement conductrice et procede de fabrication du dispositif |
| FR3061800B1 (fr) * | 2017-01-12 | 2019-05-31 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur |
| FR3069476A1 (fr) * | 2017-07-31 | 2019-02-01 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d'une piece moulee dotee d'au moins un dispositif electromecanique |
| DE102017129975A1 (de) * | 2017-12-14 | 2019-06-19 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauteils und Halbleiterbauteil |
| US10119869B1 (en) * | 2017-12-21 | 2018-11-06 | Tactotek Oy | Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device |
| CN108556246B (zh) * | 2018-04-27 | 2020-08-18 | 滁州迪蒙德模具制造有限公司 | 一种使零件与薄膜一体成型的便捷式成型模具 |
| DE102018112649B3 (de) * | 2018-05-25 | 2019-08-08 | Uwe Beier | Eingabevorrichtung zur Steuerung eines elektronischen Gerätes und Verfahren zu ihrer Herstellung |
| TWI853828B (zh) | 2018-08-07 | 2024-09-01 | 加拿大國家研究委員會 | 包覆成型的印刷電子零件和其製造方法 |
| EP3991525A1 (en) * | 2019-06-28 | 2022-05-04 | Lumileds LLC | Three-dimensional light emitting appliance |
| FR3102083B1 (fr) * | 2019-10-16 | 2021-10-08 | Safran Seats | Procede de fabrication d'une piece finie |
| JP7473175B2 (ja) * | 2020-06-01 | 2024-04-23 | 国立研究開発法人産業技術総合研究所 | 立体デバイスの製造方法 |
| JP7514137B2 (ja) * | 2020-07-31 | 2024-07-10 | 株式会社日本製鋼所 | 成形方法および成形システム |
| KR102357563B1 (ko) | 2020-12-14 | 2022-02-07 | 인탑스 주식회사 | 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법 |
| KR102418622B1 (ko) | 2020-12-30 | 2022-07-07 | 인탑스 주식회사 | 가열 및 발광 기능 동시 구현 레이돔 구조 |
| KR102394587B1 (ko) | 2021-07-19 | 2022-05-06 | 인탑스 주식회사 | 다중 ime 구조 및 그 제조 방법 |
| TWI872486B (zh) * | 2022-03-23 | 2025-02-11 | 美商阿爾發金屬化工公司 | 可成形及可撓性觸覺材料及結構 |
| EP4561269A1 (en) | 2023-11-22 | 2025-05-28 | Grupo Antolin-Ingenieria, S.A. | Method for manufacturing trim panels for vehicles having an electronic function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070069418A1 (en) * | 2005-09-28 | 2007-03-29 | Chih-Yuan Liao | In mold manufacturing of an object comprising a functional element |
| US20080006440A1 (en) * | 2006-06-21 | 2008-01-10 | Hans-Georg Huonker | Process for manufacturing an injection molded part with integrated flexible printed circuit board |
| US20080257706A1 (en) * | 2007-04-20 | 2008-10-23 | Haag Ronald H | In-molded capacitive switch |
| US20090108985A1 (en) * | 2007-04-20 | 2009-04-30 | Ink-Logix, Llc | In-molded resistive and shielding elements |
| WO2011045474A1 (en) * | 2009-10-15 | 2011-04-21 | Valtion Teknillinen Tutkimuskeskus | Ui arrangement and related method of manufacture |
Family Cites Families (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850582B2 (ja) * | 1979-08-24 | 1983-11-11 | 道男 長田 | 半導体封入成形方法とその金型装置 |
| CA1243417A (en) * | 1984-03-16 | 1988-10-18 | Shoji Tanaka | Printed circuit board laminating apparatus |
| US4584767A (en) * | 1984-07-16 | 1986-04-29 | Gregory Vernon C | In-mold process for fabrication of molded plastic printed circuit boards |
| JPS61176139A (ja) * | 1985-01-31 | 1986-08-07 | Alps Electric Co Ltd | 混成集積回路およびその製造方法 |
| JPH0712111B2 (ja) * | 1985-09-04 | 1995-02-08 | ユーエフイー・インコーポレイテッド | 電気回路埋設方法及びプラスチック製品 |
| US5220488A (en) * | 1985-09-04 | 1993-06-15 | Ufe Incorporated | Injection molded printed circuits |
| JPS63284888A (ja) * | 1987-05-18 | 1988-11-22 | Furukawa Electric Co Ltd:The | 回路成形体の製造方法 |
| JPH0170349U (enExample) * | 1987-10-29 | 1989-05-10 | ||
| JP2751450B2 (ja) | 1989-08-28 | 1998-05-18 | セイコーエプソン株式会社 | テープキャリアの実装構造及びその実装方法 |
| JP2747096B2 (ja) * | 1990-07-24 | 1998-05-06 | 北川工業株式会社 | ３次元回路基板の製造方法 |
| ATE180137T1 (de) * | 1992-06-15 | 1999-05-15 | Heinze Dyconex Patente | Verfahren zur herstellung von leiterplatten unter verwendung eines halbzeuges mit extrem dichter verdrahtung für die signalführung |
| JPH066010A (ja) * | 1992-06-19 | 1994-01-14 | Murata Mfg Co Ltd | 立体回路基板の製造方法 |
| US5264061A (en) | 1992-10-22 | 1993-11-23 | Motorola, Inc. | Method of forming a three-dimensional printed circuit assembly |
| US5780965A (en) | 1993-12-09 | 1998-07-14 | Key Plastics, Inc. | Three dimensional electroluminescent display |
| US5622652A (en) * | 1995-06-07 | 1997-04-22 | Img Group Limited | Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid |
| US5979043A (en) * | 1997-07-14 | 1999-11-09 | Ford Motor Company | Method of manufacturing a circuit assembly from two or more layers of flexible film |
| JPH1158680A (ja) | 1997-08-22 | 1999-03-02 | Canon Inc | スクリーン印刷機および画像形成装置の製造方法 |
| US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
| JP2000277893A (ja) * | 1999-03-23 | 2000-10-06 | Seiko Epson Corp | 熱圧着用ヘッド及びこれを備えた熱圧着装置 |
| JP2001177224A (ja) | 1999-12-17 | 2001-06-29 | Sony Corp | 立体回路基板及びその製造方法 |
| DE112004000260T5 (de) * | 2003-02-12 | 2006-01-19 | Teikoku Tsushin Kogyo Co. Ltd., Kawasaki | Elektronikbauteilleiterplatte und Verfahren zu deren Herstellung |
| US7200009B2 (en) | 2003-07-01 | 2007-04-03 | Nokia Corporation | Integrated electromechanical arrangement and method of production |
| US7080787B2 (en) | 2003-07-03 | 2006-07-25 | Symbol Technologies, Inc. | Insert molded antenna |
| ATE365381T1 (de) | 2004-03-16 | 2007-07-15 | Vhf Technologies Sa | Elektrische energieerzeugungsmodule mit zweidimensionalem profil und herstellungsverfahren dafür |
| GB2412247B (en) | 2004-03-16 | 2007-08-22 | In2Tec Ltd | Contoured circuit boards |
| US7157309B2 (en) * | 2004-04-09 | 2007-01-02 | Tessera, Inc. | Manufacture of microelectronic fold packages |
| US7486280B2 (en) * | 2005-08-04 | 2009-02-03 | Uniplas Enterprises Pte, Ltd. | Contoured capacitive touch control panel |
| US20100196651A1 (en) * | 2005-09-28 | 2010-08-05 | Sipix Chemical Inc. | Mold manufacturing of an object comprising a functional element, transfering process and object |
| US20070184273A1 (en) | 2006-02-09 | 2007-08-09 | Husky Injection Molding Systems Ltd. | Overmolding of Inserts |
| JP4857859B2 (ja) | 2006-03-30 | 2012-01-18 | 凸版印刷株式会社 | 印刷方法および薄膜トランジスタの製造方法 |
| FR2905198B1 (fr) | 2006-08-22 | 2008-10-17 | 3D Plus Sa Sa | Procede de fabrication collective de modules electroniques 3d |
| US8778124B2 (en) * | 2008-01-17 | 2014-07-15 | Harris Corporation | Method for making three-dimensional liquid crystal polymer multilayer circuit boards |
| US9117602B2 (en) | 2008-01-17 | 2015-08-25 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
| CN103872002B (zh) | 2008-03-05 | 2017-03-01 | 伊利诺伊大学评议会 | 可拉伸和可折叠的电子器件 |
| CN101587980A (zh) | 2008-05-20 | 2009-11-25 | 李建宏 | 在机壳上形成天线的方法 |
| KR101484944B1 (ko) | 2008-10-02 | 2015-01-22 | 삼성전자 주식회사 | 전자기기 케이스 및 이의 제조방법 |
| FI121862B (fi) * | 2008-10-24 | 2011-05-13 | Valtion Teknillinen | Järjestely kosketusnäyttöä varten ja vastaava valmistusmenetelmä |
| US20100151118A1 (en) * | 2008-12-17 | 2010-06-17 | Eastman Chemical Company | Carrier solvent compositions, coatings compositions, and methods to produce thick polymer coatings |
| CN102484308A (zh) | 2009-04-21 | 2012-05-30 | 莫列斯公司 | 三维天线 |
| FI124221B (fi) | 2009-04-24 | 2014-05-15 | Valtion Teknillinen | Käyttäjäsyötejärjestely ja siihen liittyvä valmistusmenetelmä |
| WO2011008459A2 (en) * | 2009-06-29 | 2011-01-20 | Infinite Corridor Technology, Llc | Structured material substrates for flexible, stretchable electronics |
| US9090456B2 (en) * | 2009-11-16 | 2015-07-28 | Qualcomm Mems Technologies, Inc. | System and method of manufacturing an electromechanical device by printing raised conductive contours |
| JP5323668B2 (ja) * | 2009-12-24 | 2013-10-23 | 日本メクトロン株式会社 | 照明装置及びその製造方法 |
| CN102264198A (zh) * | 2010-05-27 | 2011-11-30 | 昆山同寅兴业机电制造有限公司 | 电子产品外壳的结构及其加工工艺 |
| EP2395572A1 (de) | 2010-06-10 | 2011-12-14 | Bayer MaterialScience AG | Schichtaufbau umfassend elektrotechnische Bauelemente |
| JPWO2012049898A1 (ja) | 2010-10-15 | 2014-02-24 | 日本電気株式会社 | 部品内蔵モジュール及びこれを備える電子機器並びに部品内蔵モジュールの製造方法 |
| JP5636947B2 (ja) * | 2010-12-21 | 2014-12-10 | 日本電気株式会社 | 部品内蔵モジュール及びこれを備える電子機器 |
| EP2378846A1 (de) | 2011-01-25 | 2011-10-19 | Bayer Material Science AG | Dekorative Produktoberfläche mit Leiterplattenfunktion |
| CN102651723B (zh) | 2011-02-25 | 2015-06-10 | 澜起科技（上海）有限公司 | 基于时域训练序列的信道估计方法及系统 |
| US9030837B2 (en) * | 2011-06-10 | 2015-05-12 | Scott Moncrieff | Injection molded control panel with in-molded decorated plastic film that includes an internal connector |
| DE112012003250T5 (de) * | 2011-08-05 | 2014-04-30 | Mc10, Inc. | Katheder Ballon-Verfahren und Vorrichtung unter Einsatz von Abtastelementen |
| JP6277130B2 (ja) * | 2011-10-05 | 2018-02-14 | エムシーテン、インコーポレイテッド | 医療用の装置およびそれの製造方法 |
| KR101479892B1 (ko) * | 2011-10-18 | 2015-01-06 | 피셔 테크놀로지 피티이. 엘티디. | 몰딩하는 방법 |
| US20130152386A1 (en) | 2011-12-15 | 2013-06-20 | Praveen Pandojirao-S | Methods and apparatus to form electrical interconnects on ophthalmic devices |
| US10748867B2 (en) | 2012-01-04 | 2020-08-18 | Board Of Regents, The University Of Texas System | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices |
| GB2500037A (en) | 2012-03-08 | 2013-09-11 | Tactotek Oy | An integrated light guide. |
| US9226402B2 (en) * | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| JP2013258172A (ja) * | 2012-06-11 | 2013-12-26 | Panasonic Corp | 電子部品実装システムおよび電子部品実装方法 |
| WO2014012024A2 (en) * | 2012-07-12 | 2014-01-16 | Massachusetts Institute Of Technology | Strain engineered band gaps |
| DE102012109820B4 (de) * | 2012-10-15 | 2014-09-18 | Leonhard Kurz Stiftung & Co. Kg | Durch In-Mould-Verfahren hergestellter Körper und Verfahren zu seiner Herstellung |
| US20140160692A1 (en) * | 2012-12-07 | 2014-06-12 | Pc Concepts Limited | Method for surface decoration of an object with 3-dimensional geometry and the object obtained therefrom |
| US9451714B2 (en) | 2012-12-21 | 2016-09-20 | Gurit (USA) Inc. | Housing components of handheld electronic devices |
| US20140182875A1 (en) * | 2012-12-28 | 2014-07-03 | Mark Sprenger | Case for an electronic device |
| CH708048A2 (de) | 2013-05-13 | 2014-11-14 | Abatek Internat Ag | Funktionsträger mit Tastenfunktionen. |
| US9335034B2 (en) * | 2013-09-27 | 2016-05-10 | Osram Sylvania Inc | Flexible circuit board for electronic applications, light source containing same, and method of making |
| US10660211B2 (en) | 2013-09-27 | 2020-05-19 | Tactotek Oy | Method for manufacturing an electromechanical structure |
| US20150257278A1 (en) * | 2014-03-06 | 2015-09-10 | Tactotek Oy | Method for manufacturing electronic products, related arrangement and product |
| TWI709481B (zh) * | 2014-08-25 | 2020-11-11 | 日商東洋紡股份有限公司 | 矽烷偶合劑層疊層高分子膜及其製造方法、疊層體及其製造方法、可撓性電子器件之製造方法 |
| US20160282977A1 (en) * | 2015-03-23 | 2016-09-29 | Synaptics Inc. | Capacitive sensing assembly including a thin film plastic |
| KR101762807B1 (ko) * | 2016-01-28 | 2017-07-28 | 주식회사 탑앤씨 | 이차전지용 파우치필름 실링장치 |
-
2014
- 2014-09-25 US US15/030,883 patent/US10660211B2/en active Active
- 2014-09-25 JP JP2016544776A patent/JP2016539034A/ja active Pending
- 2014-09-25 EP EP14849632.6A patent/EP3049227B1/en active Active
- 2014-09-25 KR KR1020217016798A patent/KR102444268B1/ko active Active
- 2014-09-25 CN CN201480060020.6A patent/CN106061704A/zh active Pending
- 2014-09-25 KR KR1020227030991A patent/KR102539522B1/ko active Active
- 2014-09-25 KR KR1020207025316A patent/KR102444269B1/ko active Active
- 2014-09-25 PL PL21203098.5T patent/PL3957459T3/pl unknown
- 2014-09-25 KR KR1020167011262A patent/KR20160094936A/ko not_active Ceased
- 2014-09-25 WO PCT/FI2014/050729 patent/WO2015044523A1/en not_active Ceased
- 2014-09-25 CN CN202310799467.6A patent/CN116872434A/zh active Pending
- 2014-09-25 CN CN202110615125.5A patent/CN113370458B/zh active Active
- 2014-09-25 CN CN202311481054.XA patent/CN117601354A/zh active Pending
- 2014-09-25 ES ES14849632T patent/ES2900225T3/es active Active
- 2014-09-25 EP EP21203098.5A patent/EP3957459B1/en active Active
- 2014-09-25 ES ES21203098T patent/ES3041856T3/es active Active
- 2014-09-26 TW TW103133399A patent/TWI610881B/zh active
-
2017
- 2017-11-15 US US15/813,397 patent/US10986733B2/en active Active
-
2018
- 2018-06-26 US US16/018,127 patent/US10575407B2/en active Active
- 2018-09-25 US US16/140,633 patent/US10986734B2/en active Active
- 2018-10-24 US US16/168,927 patent/US10986735B2/en active Active
-
2019
- 2019-12-24 JP JP2019232630A patent/JP7221858B2/ja active Active
-
2020
- 2020-01-21 US US16/747,614 patent/US10813222B2/en active Active
- 2020-08-28 US US17/006,417 patent/US11363720B2/en active Active
-
2021
- 2021-03-29 US US17/215,001 patent/US11516920B2/en active Active
- 2021-12-21 US US17/557,104 patent/US11406021B2/en active Active
-
2022
- 2022-04-05 JP JP2022062869A patent/JP7656568B2/ja active Active
-
2023
- 2023-03-30 JP JP2023054798A patent/JP7654705B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070069418A1 (en) * | 2005-09-28 | 2007-03-29 | Chih-Yuan Liao | In mold manufacturing of an object comprising a functional element |
| US20080006440A1 (en) * | 2006-06-21 | 2008-01-10 | Hans-Georg Huonker | Process for manufacturing an injection molded part with integrated flexible printed circuit board |
| US20080257706A1 (en) * | 2007-04-20 | 2008-10-23 | Haag Ronald H | In-molded capacitive switch |
| US20090108985A1 (en) * | 2007-04-20 | 2009-04-30 | Ink-Logix, Llc | In-molded resistive and shielding elements |
| WO2011045474A1 (en) * | 2009-10-15 | 2011-04-21 | Valtion Teknillinen Tutkimuskeskus | Ui arrangement and related method of manufacture |
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI610881B (zh) | 用以製造機電結構的方法和用以實行該方法的配置 | |
| HK40051688A (en) | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method | |
| HK40051688B (zh) | 用於制造机电结构的方法以及用於执行该方法的装置 | |
| CN118901286A (zh) | 用于制造数个电气节点的方法、电气节点模块、电气节点及多层结构 |