ES2900225T3 - Método para fabricar una estructura electromecánica y un sistema para llevar a cabo el método - Google Patents
Método para fabricar una estructura electromecánica y un sistema para llevar a cabo el método Download PDFInfo
- Publication number
- ES2900225T3 ES2900225T3 ES14849632T ES14849632T ES2900225T3 ES 2900225 T3 ES2900225 T3 ES 2900225T3 ES 14849632 T ES14849632 T ES 14849632T ES 14849632 T ES14849632 T ES 14849632T ES 2900225 T3 ES2900225 T3 ES 2900225T3
- Authority
- ES
- Spain
- Prior art keywords
- film
- elements
- dimensional
- electronic elements
- substantially flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14819—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being completely encapsulated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C2045/169—Making multilayered or multicoloured articles injecting electrical circuits, e.g. one layer being made of conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361883484P | 2013-09-27 | 2013-09-27 | |
| PCT/FI2014/050729 WO2015044523A1 (en) | 2013-09-27 | 2014-09-25 | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2900225T3 true ES2900225T3 (es) | 2022-03-16 |
Family
ID=52742142
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES14849632T Active ES2900225T3 (es) | 2013-09-27 | 2014-09-25 | Método para fabricar una estructura electromecánica y un sistema para llevar a cabo el método |
| ES21203098T Active ES3041856T3 (en) | 2013-09-27 | 2014-09-25 | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES21203098T Active ES3041856T3 (en) | 2013-09-27 | 2014-09-25 | Method for manufacturing an electromechanical structure and an arrangement for carrying out the method |
Country Status (9)
| Country | Link |
|---|---|
| US (9) | US10660211B2 (enExample) |
| EP (2) | EP3049227B1 (enExample) |
| JP (4) | JP2016539034A (enExample) |
| KR (4) | KR102444268B1 (enExample) |
| CN (4) | CN106061704A (enExample) |
| ES (2) | ES2900225T3 (enExample) |
| PL (1) | PL3957459T3 (enExample) |
| TW (1) | TWI610881B (enExample) |
| WO (1) | WO2015044523A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10660211B2 (en) | 2013-09-27 | 2020-05-19 | Tactotek Oy | Method for manufacturing an electromechanical structure |
| US20160113118A1 (en) * | 2014-09-23 | 2016-04-21 | Osram Sylvania Inc. | Formable light source and method of making |
| EP3124197B1 (en) * | 2015-07-31 | 2017-12-20 | C.R.F. Società Consortile per Azioni | Method for manufacturing a component for a motor-vehicle interior |
| EP3187322A1 (en) | 2015-12-31 | 2017-07-05 | Arjo Wiggins Fine Papers Limited | Use of printed electronics on paper to embed a circuit into plastic moulded objects |
| EP3795334B1 (en) * | 2015-12-07 | 2023-02-22 | Nike Innovate C.V. | Three-dimensional printing utilizing a captive element |
| EP4325264A3 (en) * | 2016-04-13 | 2024-05-22 | TactoTek Oy | Illuminated multilayer structure with embedded light sources |
| FR3052594B1 (fr) | 2016-06-10 | 2018-11-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif a piste electriquement conductrice et procede de fabrication du dispositif |
| FR3061800B1 (fr) * | 2017-01-12 | 2019-05-31 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur |
| FR3069476A1 (fr) * | 2017-07-31 | 2019-02-01 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d'une piece moulee dotee d'au moins un dispositif electromecanique |
| DE102017129975A1 (de) * | 2017-12-14 | 2019-06-19 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Halbleiterbauteils und Halbleiterbauteil |
| US10119869B1 (en) * | 2017-12-21 | 2018-11-06 | Tactotek Oy | Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device |
| CN108556246B (zh) * | 2018-04-27 | 2020-08-18 | 滁州迪蒙德模具制造有限公司 | 一种使零件与薄膜一体成型的便捷式成型模具 |
| DE102018112649B3 (de) * | 2018-05-25 | 2019-08-08 | Uwe Beier | Eingabevorrichtung zur Steuerung eines elektronischen Gerätes und Verfahren zu ihrer Herstellung |
| TWI853828B (zh) | 2018-08-07 | 2024-09-01 | 加拿大國家研究委員會 | 包覆成型的印刷電子零件和其製造方法 |
| EP3991525A1 (en) * | 2019-06-28 | 2022-05-04 | Lumileds LLC | Three-dimensional light emitting appliance |
| FR3102083B1 (fr) * | 2019-10-16 | 2021-10-08 | Safran Seats | Procede de fabrication d'une piece finie |
| JP7473175B2 (ja) * | 2020-06-01 | 2024-04-23 | 国立研究開発法人産業技術総合研究所 | 立体デバイスの製造方法 |
| JP7514137B2 (ja) * | 2020-07-31 | 2024-07-10 | 株式会社日本製鋼所 | 成形方法および成形システム |
| KR102357563B1 (ko) | 2020-12-14 | 2022-02-07 | 인탑스 주식회사 | 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법 |
| KR102418622B1 (ko) | 2020-12-30 | 2022-07-07 | 인탑스 주식회사 | 가열 및 발광 기능 동시 구현 레이돔 구조 |
| KR102394587B1 (ko) | 2021-07-19 | 2022-05-06 | 인탑스 주식회사 | 다중 ime 구조 및 그 제조 방법 |
| TWI872486B (zh) * | 2022-03-23 | 2025-02-11 | 美商阿爾發金屬化工公司 | 可成形及可撓性觸覺材料及結構 |
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