JP2016536407A - サブミクロン銀粒子インク組成物、プロセスおよび応用 - Google Patents
サブミクロン銀粒子インク組成物、プロセスおよび応用 Download PDFInfo
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- JP2016536407A JP2016536407A JP2016534583A JP2016534583A JP2016536407A JP 2016536407 A JP2016536407 A JP 2016536407A JP 2016534583 A JP2016534583 A JP 2016534583A JP 2016534583 A JP2016534583 A JP 2016534583A JP 2016536407 A JP2016536407 A JP 2016536407A
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- composition
- acid
- silver particles
- substrate
- vinyl
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- 239000002245 particle Substances 0.000 title claims abstract description 67
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- 229910052709 silver Inorganic materials 0.000 title claims abstract description 52
- 239000004332 silver Substances 0.000 title claims abstract description 52
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- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 claims description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
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- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
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- 229920000642 polymer Polymers 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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Abstract
Description
本明細書に記載の組成物を適する基材上に塗布すること、および
その後に前記組成物を焼結することを含む方法を提供する。
本明細書に記載された組成物を前記基材に塗布すること、およびその後、
前記組成物を焼結することを含む方法を提供する。
ハロゲン含有熱可塑性樹脂および有機希釈剤を
前記銀粒子充填熱可塑性樹脂中に組み入れることを含む方法を提供する。
サブミクロン銀粒子を所望量の熱可塑性(Tp)樹脂と混合することにより、インクを作製する。混合は、スピードミキサー中で、組成物が実質的に均一になるまで行う。材料は、基材(ポリエチレンテレフタレート、PET)に塗布し、10ミクロンワイアバーでフィルムを作製する。材料は、その後、ボックスオーブンで、120℃、5分、または150℃、5分間乾燥する。0.5×5cm片に切断し、その厚みおよび抵抗を測定し、それに基づき、抵抗を算出した。結果を以下の表に示す。
Claims (29)
- 安定化サブミクロン銀粒子、
熱可塑性樹脂および
任意に有機希釈剤を含む組成物。 - 前記安定化サブミクロン銀粒子が、少なくとも約100ナノメートルであるが、約1マイクロメータ未満の粒子サイズを有する銀粒子を含む、請求項1に記載の組成物。
- 前記キャッピング剤が、ポリビニルアルコール、ポリ(N−ビニル−2−ピロリドン)、アラビアゴム、α−メタクリル酸、11−メルカプトウンデカン酸またはそのジスフィルド誘導体、クエン酸、クエン酸三ナトリウム、ステアリン酸、パルチミン酸、オクタン酸、デカン酸、ポリエチレングリコールおよびその誘導体、ポリアクリル酸およびアミノ修飾ポリアクリル酸、2−メルカプトエタノール、澱粉またはそれらの任意の2種以上の混合物である、請求項2に記載の組成物。
- 前記キャッピング剤が、組成物の約0.05〜約5重量%の範囲にある、請求項2に記載の組成物。
- 前記銀粒子が、組成物の約20〜約95重量%の範囲にある、請求項1に記載の組成物。
- さらに非銀の導電性充填材を5重量%まで含む、請求項1に記載の組成物。
- 前記非銀の導電性充填材が、カーボンブラック、黒鉛もくしはカーボンナノチューブである、請求項6に記載の組成物。
- 前記熱可塑性樹脂が、ビニル共重合体、ポリエステルもしくはポリウレタンである、請求項1に記載の組成物。
- 前記ビニル共重合体が、第1モノマーおよび第2モノマーを含み、
第1モノマーが、酢酸ビニル、ビニルアルコール、塩化ビニル、塩化ビニリデンおよびスチレンからなる群から選択され、および
第2モノマーが、第2の酢酸ビニル、第2のビニルアルコール、第2の塩化ビニル、第2の塩化ビニリデン、第2のスチレン、アクリレートおよび窒化物からなる群から選択される、請求項8に記載の組成物。 - 前記第1モノマーが、塩化ビニリデンであり、前記第2モノマーが、塩化ビニル、アクリロニトリルまたはアクリル酸アルキルである、請求項9に記載の組成物。
- 前記熱可塑性樹脂が、組成物の約0.1〜約15重量%の範囲にある、請求項1に記載の組成物。
- さらに約0.1〜約5重量%の熱硬化性樹脂を含む、請求項1に記載の組成物。
- 前記熱硬化性樹脂が、エポキシ官能化樹脂、アクリレート、シアン酸エステル、シリコーン、オキセタン、マレイミドまたはそれらの任意の2種以上の混合物である、請求項12に記載の組成物。
- 前記有機希釈剤が、酢酸エチル、酢酸ブチル、メトキシプロピルアセテート、α−テルピネオール、β−テルピネオール、灯油、フタル酸ジブチル、ブチルカルビトール、ブチルカルビトールアセテート、カルビトールアセテート、エチルカルビトールアセテート、へキシレングリコール、高沸点アルコール類およびそのエステル類、グリコールエーテル類、ケトン類、エステル類、二塩基エステル類、ベンゼン、トルエン、キシレン、ヘキサン、シクロヘキサン、ヘプタン、テトラデカン、ジエチルエーテル、テトラヒドロフラン、ジオキサン、ジクロロエタン、トリクロロエチレン、クロロホルム、ジクロロメタンおよびそれらの任意の2種以上の混合物である、請求項1に記載の組成物。
- 前記有機希釈剤が、存在するならば、組成物の約5〜約80重量%の範囲にある、請求項1に記載の組成物。
- さらに酸性成分を含む、請求項1に記載の組成物。
- 前記酸性成分が、リン酸、ビニルリン酸、ポリリン酸、ギ酸、酢酸、クロロ酢酸、トリフルオロ酢酸、シュウ酸、オレイン酸、安息香酸、p−トルエンスルホン酸またはそれらの任意の2種以上の混合物である、請求項16に記載の組成物。
- 前記酸性成分が、組成物の約0.1〜約5重量%の範囲にある、請求項16に記載の組成物。
- その上に導電性層を有する透明基材を含むタッチパネルディスプレイであって、前記導電性層が、請求項1に記載の組成物の硬化層を含むタッチパネルディスプレイ。
- 導電性ネットワークを作製する方法であって、前記方法が、
請求項1に記載の組成物を適する基材に塗布すること、および
その後前記組成物を焼結することを含む方法。 - 前記焼結が、約150℃以下の温度で、0.5〜約30分の範囲の時間行われる、請求項20に記載の方法。
- 前記焼結が、約120℃以下の温度で、0.1〜約2時間の範囲の時間行われる、請求項20に記載の方法。
- 前記基材が、ポリエチレンテレフタレート、ポリメチルメタクリレート、ポリエチレン、ポリプロピレン、ポリカーボネート、エポキシ樹脂、ポリイミド、ポリアミド、ポリエステルまたはガラスである、請求項20に記載の方法。
- 請求項20に記載の方法によって作製される、導電性ネットワーク。
- 1×10−4Ω・cm以下の抵抗率を有する焼結されたサブミクロン銀粒子の配列を含む、導電性ネットワーク。
- さらに導電性ネットワークのための基材を含み、前記導電性ネットワークおよび前記基材間の接着が、テスト方法D 3359−97に従ったASTM標準クロスカットテープテストによって決定され、少なくともレベル1Bである、請求項25に記載の導電性ネットワーク。
- 約100〜約1000ナノメートルの範囲の粒子サイズを有する銀粒子を非金属基材に接着させる方法であって、前記方法が、
請求項1に記載の組成物を前記基材に塗布すること、および
その後前記組成物を焼結すること
を含む方法。 - 前記基材が、ポリエチレンテレフタレート、ポリメチルメタクリレート、ポリエチレン、ポリプロピレン、ポリカーボネート、エポキシ樹脂、ポリイミド、ポリアミド、ポリエステルまたはガラスである、請求項27に記載の方法。
- サブミクロン銀粒子が充填された熱可塑性樹脂の非金属基材への接着を改善する方法であって、前記方法が、
ハロゲン含有熱可塑性樹脂および有機希釈剤
を前記銀粒子が充填された熱可塑性樹脂に組み入れること
を含む方法。
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