JP2016534556A5 - - Google Patents
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- JP2016534556A5 JP2016534556A5 JP2016533318A JP2016533318A JP2016534556A5 JP 2016534556 A5 JP2016534556 A5 JP 2016534556A5 JP 2016533318 A JP2016533318 A JP 2016533318A JP 2016533318 A JP2016533318 A JP 2016533318A JP 2016534556 A5 JP2016534556 A5 JP 2016534556A5
- Authority
- JP
- Japan
- Prior art keywords
- heating elements
- electrostatic chuck
- insulating base
- yttrium
- electrode assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361862866P | 2013-08-06 | 2013-08-06 | |
| US61/862,866 | 2013-08-06 | ||
| PCT/US2014/048182 WO2015020813A1 (en) | 2013-08-06 | 2014-07-25 | Locally heated multi-zone substrate support |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018219072A Division JP2019047132A (ja) | 2013-08-06 | 2018-11-22 | 局部的に加熱されるマルチゾーン式の基板支持体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016534556A JP2016534556A (ja) | 2016-11-04 |
| JP2016534556A5 true JP2016534556A5 (enExample) | 2017-04-27 |
| JP6441927B2 JP6441927B2 (ja) | 2018-12-19 |
Family
ID=52448462
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016533318A Expired - Fee Related JP6441927B2 (ja) | 2013-08-06 | 2014-07-25 | 局部的に加熱されるマルチゾーン式の基板支持体 |
| JP2018219072A Pending JP2019047132A (ja) | 2013-08-06 | 2018-11-22 | 局部的に加熱されるマルチゾーン式の基板支持体 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018219072A Pending JP2019047132A (ja) | 2013-08-06 | 2018-11-22 | 局部的に加熱されるマルチゾーン式の基板支持体 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9472434B2 (enExample) |
| JP (2) | JP6441927B2 (enExample) |
| KR (2) | KR101905158B1 (enExample) |
| CN (1) | CN105408993A (enExample) |
| TW (3) | TWI641074B (enExample) |
| WO (1) | WO2015020813A1 (enExample) |
Families Citing this family (76)
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| US8064185B2 (en) | 2008-09-05 | 2011-11-22 | Applied Materials, Inc. | Electrostatic chuck electrical balancing circuit repair |
| JP5620090B2 (ja) | 2008-12-15 | 2014-11-05 | キヤノンアネルバ株式会社 | 基板処理装置、熱処理基板の製造方法及び半導体デバイスの製造方法 |
| KR101001454B1 (ko) | 2009-01-23 | 2010-12-14 | 삼성모바일디스플레이주식회사 | 정전척 및 이를 구비한 유기전계발광 소자의 제조장치 |
| SG180882A1 (en) * | 2009-12-15 | 2012-07-30 | Lam Res Corp | Adjusting substrate temperature to improve cd uniformity |
| JP5423632B2 (ja) * | 2010-01-29 | 2014-02-19 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP5644161B2 (ja) * | 2010-04-12 | 2014-12-24 | 住友電気工業株式会社 | 半導体保持用の静電チャックおよびその製造方法 |
| CN103081088B (zh) | 2010-08-06 | 2016-04-06 | 应用材料公司 | 静电夹盘和使用静电夹盘的方法 |
| US8546732B2 (en) * | 2010-11-10 | 2013-10-01 | Lam Research Corporation | Heating plate with planar heater zones for semiconductor processing |
| US20120227886A1 (en) | 2011-03-10 | 2012-09-13 | Taipei Semiconductor Manufacturing Company, Ltd. | Substrate Assembly Carrier Using Electrostatic Force |
| KR101981766B1 (ko) | 2011-06-02 | 2019-05-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 정전기 척 aln 유전체 수리 |
| US9117867B2 (en) | 2011-07-01 | 2015-08-25 | Applied Materials, Inc. | Electrostatic chuck assembly |
| US8624168B2 (en) * | 2011-09-20 | 2014-01-07 | Lam Research Corporation | Heating plate with diode planar heater zones for semiconductor processing |
| JP6223983B2 (ja) | 2011-09-30 | 2017-11-01 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 温度制御付き静電チャック |
| US20130086809A1 (en) | 2011-10-05 | 2013-04-11 | Agostino Difante | Combined handi-hold serving spoon |
| KR102047001B1 (ko) | 2012-10-16 | 2019-12-03 | 삼성디스플레이 주식회사 | 정전 척 |
| WO2015013142A1 (en) * | 2013-07-22 | 2015-01-29 | Applied Materials, Inc. | An electrostatic chuck for high temperature process applications |
| CN105408993A (zh) * | 2013-08-06 | 2016-03-16 | 应用材料公司 | 局部加热的多区域基板支撑件 |
| US9740111B2 (en) | 2014-05-16 | 2017-08-22 | Applied Materials, Inc. | Electrostatic carrier for handling substrates for processing |
| US10978334B2 (en) | 2014-09-02 | 2021-04-13 | Applied Materials, Inc. | Sealing structure for workpiece to substrate bonding in a processing chamber |
| US10707110B2 (en) * | 2015-11-23 | 2020-07-07 | Lam Research Corporation | Matched TCR joule heater designs for electrostatic chucks |
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2014
- 2014-07-25 CN CN201480040003.6A patent/CN105408993A/zh active Pending
- 2014-07-25 KR KR1020167005977A patent/KR101905158B1/ko active Active
- 2014-07-25 KR KR1020187028007A patent/KR20180110213A/ko not_active Ceased
- 2014-07-25 WO PCT/US2014/048182 patent/WO2015020813A1/en not_active Ceased
- 2014-07-25 JP JP2016533318A patent/JP6441927B2/ja not_active Expired - Fee Related
- 2014-08-05 TW TW103126784A patent/TWI641074B/zh not_active IP Right Cessation
- 2014-08-05 TW TW109107577A patent/TW202040744A/zh unknown
- 2014-08-05 TW TW107101624A patent/TWI688038B/zh not_active IP Right Cessation
- 2014-08-06 US US14/452,801 patent/US9472434B2/en active Active
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2016
- 2016-10-17 US US15/295,375 patent/US9735037B2/en not_active Expired - Fee Related
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2017
- 2017-08-14 US US15/676,031 patent/US9984912B2/en active Active
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2018
- 2018-11-22 JP JP2018219072A patent/JP2019047132A/ja active Pending
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