JP2016529702A5 - - Google Patents

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Publication number
JP2016529702A5
JP2016529702A5 JP2016527009A JP2016527009A JP2016529702A5 JP 2016529702 A5 JP2016529702 A5 JP 2016529702A5 JP 2016527009 A JP2016527009 A JP 2016527009A JP 2016527009 A JP2016527009 A JP 2016527009A JP 2016529702 A5 JP2016529702 A5 JP 2016529702A5
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JP
Japan
Prior art keywords
tiers
monolithic
3dic
tier
providing
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JP2016527009A
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English (en)
Japanese (ja)
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JP2016529702A (ja
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Priority claimed from US14/013,399 external-priority patent/US9418985B2/en
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Publication of JP2016529702A publication Critical patent/JP2016529702A/ja
Publication of JP2016529702A5 publication Critical patent/JP2016529702A5/ja
Pending legal-status Critical Current

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JP2016527009A 2013-07-16 2014-07-14 モノリシック３次元（３ｄ）集積回路（ｉｃ）（３ｄｉｃ）技術を使用した完全システムオンチップ（ｓｏｃ） Pending JP2016529702A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361846648P 2013-07-16 2013-07-16
US61/846,648 2013-07-16
US14/013,399 US9418985B2 (en) 2013-07-16 2013-08-29 Complete system-on-chip (SOC) using monolithic three dimensional (3D) integrated circuit (IC) (3DIC) technology
US14/013,399 2013-08-29
PCT/US2014/046503 WO2015009614A1 (en) 2013-07-16 2014-07-14 Complete system-on-chip (soc) using monolithic three dimensional (3d) integrated circuit (ic) (3dic) technology

Publications (2)

Publication Number Publication Date
JP2016529702A JP2016529702A (ja) 2016-09-23
JP2016529702A5 true JP2016529702A5 (enExample) 2016-11-17

Family

ID=52343114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016527009A Pending JP2016529702A (ja) 2013-07-16 2014-07-14 モノリシック３次元（３ｄ）集積回路（ｉｃ）（３ｄｉｃ）技術を使用した完全システムオンチップ（ｓｏｃ）

Country Status (9)

Country Link
US (2) US9418985B2 (enExample)
EP (1) EP3022766A1 (enExample)
JP (1) JP2016529702A (enExample)
KR (1) KR101832330B1 (enExample)
CN (1) CN105378918B (enExample)
BR (1) BR112016000868B1 (enExample)
CA (1) CA2917586C (enExample)
TW (1) TWI618222B (enExample)
WO (1) WO2015009614A1 (enExample)

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US12230607B2 (en) * 2021-03-31 2025-02-18 Taiwan Semiconductor Manufacturing Company Limited Semiconductor device including power management die in a stack and methods of forming the same
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