JP2016529371A - 半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 - Google Patents
半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 Download PDFInfo
- Publication number
- JP2016529371A JP2016529371A JP2016538868A JP2016538868A JP2016529371A JP 2016529371 A JP2016529371 A JP 2016529371A JP 2016538868 A JP2016538868 A JP 2016538868A JP 2016538868 A JP2016538868 A JP 2016538868A JP 2016529371 A JP2016529371 A JP 2016529371A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- type
- weight
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 69
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000011888 foil Substances 0.000 title claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 99
- 239000011347 resin Substances 0.000 claims abstract description 99
- 239000003822 epoxy resin Substances 0.000 claims abstract description 50
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 50
- 239000000945 filler Substances 0.000 claims abstract description 36
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000002002 slurry Substances 0.000 claims abstract description 21
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 31
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 29
- 239000011521 glass Substances 0.000 claims description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- 239000004643 cyanate ester Substances 0.000 claims description 18
- 239000000835 fiber Substances 0.000 claims description 16
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 12
- 239000011256 inorganic filler Substances 0.000 claims description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 229920003986 novolac Polymers 0.000 claims description 10
- 229930185605 Bisphenol Natural products 0.000 claims description 9
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 6
- 239000005995 Aluminium silicate Substances 0.000 claims description 6
- 235000012211 aluminium silicate Nutrition 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000000454 talc Substances 0.000 claims description 6
- 229910052623 talc Inorganic materials 0.000 claims description 6
- 238000005698 Diels-Alder reaction Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 claims description 3
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 claims description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 3
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 150000004982 aromatic amines Chemical class 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000004927 clay Substances 0.000 claims description 3
- 229930003836 cresol Natural products 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 3
- 239000004843 novolac epoxy resin Substances 0.000 claims description 3
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 3
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 3
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 claims description 3
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 13
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 abstract description 3
- 230000001747 exhibiting effect Effects 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 28
- 239000011889 copper foil Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 17
- 230000000704 physical effect Effects 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 12
- 239000002966 varnish Substances 0.000 description 12
- -1 1-methylethylidene Chemical group 0.000 description 10
- 239000003365 glass fiber Substances 0.000 description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- MSYKNDXWZTZPCF-UHFFFAOYSA-N phenyl-[2-(2-phenylphenoxy)phenyl]methanone Chemical compound C=1C=CC=C(OC=2C(=CC=CC=2)C=2C=CC=CC=2)C=1C(=O)C1=CC=CC=C1 MSYKNDXWZTZPCF-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- PJGPQOXWPYYELJ-UHFFFAOYSA-N 2,4-dichloro-5-ethyl-1h-imidazole Chemical compound CCC=1NC(Cl)=NC=1Cl PJGPQOXWPYYELJ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ACKLHLPNCLNXBA-UHFFFAOYSA-N 2-cyclohexyl-5-methyl-1h-imidazole Chemical compound CC1=CNC(C2CCCCC2)=N1 ACKLHLPNCLNXBA-UHFFFAOYSA-N 0.000 description 1
- LJIAAIOUUCAFLO-UHFFFAOYSA-N 5-butyl-4-ethyl-1h-imidazole Chemical compound CCCCC=1N=CNC=1CC LJIAAIOUUCAFLO-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/68—Polyesters containing atoms other than carbon, hydrogen and oxygen
- C08G63/685—Polyesters containing atoms other than carbon, hydrogen and oxygen containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2435/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Textile Engineering (AREA)
Abstract
Description
前記ベンズオキサジンは、前記樹脂組成物全体の総重量を基準に10重量%以下含む、半導体パッケージ用熱硬化性樹脂組成物を提供する。
下記表1のような組成と含有量で各成分を混合し、それぞれ実施例および比較例の熱硬化性樹脂組成物を製造した。
ビスマレイミド系樹脂(BMI−2300、DAIWA社)、BT樹脂(Nanozine600、Nanokor社)、ノボラック型シアネート樹脂(PT−30S、Lonza社)、ナフタレン系エポキシ樹脂(HP4710、DIC社)、フェノールフタレイン系ベンズオキサジン樹脂(XU8282、Hunstman社)、エポキシシラン処理されたスラリータイプのシリカ(SC2050FNC、Admatechs社)、パウダータイプのフィラー(SFP−30NHE、Denka社)である。ただし、下記表1および2で樹脂成分の含有量は重量%(合計100重量%)であり、シリカの含有量は前記樹脂100重量部を基準にしたものである。
実施例および比較例で得られた熱硬化性樹脂組成物に対して、下記の方法で物性を評価した。
樹脂流れ性を評価するために、25℃の温度でブルックフィールド粘度計を用いて、実施例および比較例の熱硬化性樹脂組成物の粘度を測定した。
前記実施例および比較例で製造された銅箔積層板に対して、下記の方法で物性を評価し、その結果を表3および4に示した。
デスミア評価において、全体的な工程条件の雰囲気はアルカリ性であり、工程はswelling、permanganat、neutralizingの工程順に進行した。溶液は市販されているAtotech社の溶液を使用した。
銅箔積層板の銅箔層をエッチングして除去した後、DMA(Dymamic Mechanical Analysis)を用いて昇温速度5℃/minでガラス転移温度を測定した。
銅箔積層板の銅箔層をエッチングして除去した後、DMA(Dymamic Mechanical Analysis)を用いて昇温速度5℃/minで30℃、260℃での弾性率を測定した。
銅箔積層板の銅箔層をエッチングして除去した後、TMA(Thermo Mechanical Analysis)を用いて昇温速度10℃/minで熱膨張係数を測定した。
銅箔積層板の銅箔層をエッチングして除去した後、85℃/85%条件下で恒温恒湿機を用いて測定した。
Texture ananlyerを用いて銅箔積層板の幅1cmの区間の接着力を評価した。
Claims (13)
- エポキシ樹脂とビスマレイミド系樹脂を含むバインダー、およびベンズオキサジン樹脂を含む樹脂組成物;および
スラリータイプの充填剤;
を含み、
前記ベンズオキサジンは、前記樹脂組成物全体の総重量を基準に10重量%以下含む、半導体パッケージ用の熱硬化性樹脂組成物。 - 前記スラリータイプの充填剤は、前記樹脂組成物100重量部に対して160〜350重量部で含む、請求項1に記載の半導体パッケージ用の熱硬化性樹脂組成物。
- 前記ベンズオキサジンは、前記樹脂組成物全体の総重量を基準に2〜10重量%で含む、請求項1に記載の半導体パッケージ用の熱硬化性樹脂組成物。
- 前記バインダーは、エポキシ樹脂20〜80重量%、およびビスマレイミド系樹脂20〜80重量%を含む、請求項1に記載の半導体パッケージ用熱硬化性樹脂組成物。
- 前記バインダーは、シアネート系エステル樹脂をさらに含む、請求項1に記載の半導体パッケージ用の熱硬化性樹脂組成物。
- 前記バインダーは、エポキシ樹脂20〜60重量%、シアネートエステル樹脂30〜70重量%、およびビスマレイミド系樹脂20〜70重量%を含む、請求項5に記載の半導体パッケージ用の熱硬化性樹脂組成物。
- 前記スラリータイプの充填剤は、シリカ、アルミニウムトリハイドレート、マグネシウムヒドロキシド、モリブデンオキシド、ジンクモリブデート、ジンクボレート、ジンクスタネート(zinc stannate)、アルミナ、クレー、カオリン、タルク、焼成カオリン、焼成タルク、マイカ、ガラス単繊維、ガラス微細パウダー、および中空ガラスからなる群より選択された1種以上の無機充填剤を含むスラリーを使用する、請求項1に記載の熱硬化性樹脂組成物。
- 前記エポキシ樹脂は、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ノボラック型エポキシ樹脂、フェノールノボラックエポキシ樹脂、クレゾールノボラック型エポキシ樹脂、テトラフェニルエタン型エポキシ樹脂、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、およびジシクロペンタジエン型エポキシ樹脂からなる群より選択された1種以上である、請求項1に記載の熱硬化性樹脂組成物。
- 前記ビスマレイミド系樹脂は、BT(Bismaleimide−Triazine)樹脂、4,4’−ビスマレイミド−ジフェニルメタン、1,4−ビスマレイミド−2−メチルベンゼンおよびこれらの混合物;ディールスアルダー(Diels−Alder)共単量体を含有する改質されたビスマレイミド樹脂;および4,4’−ビスマレイミド−ジフェニルメタンおよびアリルフェニル化合物;または芳香族アミンを基材とする部分的に高級化されたビスマレイミド;からなる群より選択される1種以上である、請求項1に記載の熱硬化性樹脂組成物。
- 前記シアネートエステル樹脂は、ビスフェノールA型、ビスフェノールF型、ビスフェノールE型、ビスフェノールH型、ビスフェノールN型、フェノールノボラック型、ジシクロペンタジエンビスフェノール型のシアネートエステル樹脂からなる群より選択された1種以上である、請求項1に記載の熱硬化性樹脂組成物。
- 溶剤、硬化促進剤、分散剤、およびシランカップリング剤からなる群より選択された1種以上の添加剤をさらに含む、請求項1に記載の熱硬化性樹脂組成物。
- 請求項1〜11のいずれか一項に記載の熱硬化性樹脂組成物を繊維基材に含浸させて製造されたプリプレグ。
- 請求項12に記載のプリプレグ;および
加熱および加圧により前記プリプレグと一体化した金属箔;
を含む金属箔積層板。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0116771 | 2013-09-30 | ||
KR20130116771 | 2013-09-30 | ||
PCT/KR2014/008974 WO2015046921A1 (ko) | 2013-09-30 | 2014-09-25 | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
KR1020140128140A KR101677736B1 (ko) | 2013-09-30 | 2014-09-25 | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
KR10-2014-0128140 | 2014-09-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016529371A true JP2016529371A (ja) | 2016-09-23 |
JP6301473B2 JP6301473B2 (ja) | 2018-03-28 |
Family
ID=53033477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016538868A Active JP6301473B2 (ja) | 2013-09-30 | 2014-09-25 | 半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11535750B2 (ja) |
JP (1) | JP6301473B2 (ja) |
KR (1) | KR101677736B1 (ja) |
CN (1) | CN105408418B (ja) |
TW (1) | TWI538955B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018518563A (ja) * | 2016-01-13 | 2018-07-12 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ |
JP2018135447A (ja) * | 2017-02-22 | 2018-08-30 | 住友ベークライト株式会社 | 樹脂組成物及び構造体 |
JP2021084968A (ja) * | 2019-11-28 | 2021-06-03 | 住友ベークライト株式会社 | 基材付き樹脂膜、プリント配線基板および電子装置 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018029146A (ja) * | 2016-08-19 | 2018-02-22 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリント配線基板および半導体装置 |
JP6520872B2 (ja) * | 2016-09-01 | 2019-05-29 | 信越化学工業株式会社 | 半導体封止用熱硬化性樹脂組成物 |
FR3057802A1 (fr) * | 2016-10-26 | 2018-04-27 | Compagnie Generale Des Etablissements Michelin | Renfort metallique ou metallise dont la surface est revetue d'une polybenzoxazine |
KR102049024B1 (ko) | 2017-03-22 | 2019-11-26 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
KR102057255B1 (ko) | 2017-03-22 | 2019-12-18 | 주식회사 엘지화학 | 반도체 패키지용 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 |
KR102187509B1 (ko) * | 2017-04-19 | 2020-12-07 | 쇼와 덴코 가부시키가이샤 | 경화성 수지 조성물, 그 경화물, 및 그 경화물을 포함하는 구조체 |
JP2019116532A (ja) * | 2017-12-26 | 2019-07-18 | 京セラ株式会社 | 封止成形材料用組成物及び電子部品装置 |
TWI678393B (zh) * | 2017-09-07 | 2019-12-01 | 台燿科技股份有限公司 | 樹脂組成物、以及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
KR102196881B1 (ko) | 2017-12-11 | 2020-12-30 | 주식회사 엘지화학 | 금속 박막 코팅용 열경화성 수지 조성물 및 이를 이용한 금속 적층체 |
KR20190081987A (ko) * | 2017-12-29 | 2019-07-09 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 열경화성 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
EP3744788B1 (en) * | 2017-12-29 | 2024-01-10 | Shengyi Technology Co., Ltd | Resin composition, prepreg, laminate, and metal foil-coated laminate |
JP7109940B2 (ja) * | 2018-03-08 | 2022-08-01 | 日東電工株式会社 | 封止用接着シート |
TWI765147B (zh) * | 2018-04-10 | 2022-05-21 | 南韓商Lg化學股份有限公司 | 用於金屬包覆積層板的熱固性樹脂複合物及使用其之金屬包覆積層板 |
WO2022045663A1 (ko) * | 2020-08-25 | 2022-03-03 | 엘지이노텍 주식회사 | 반도체 패키지용 수지 조성물 및 이를 포함하는 동박 부착 수지 |
US11837415B2 (en) | 2021-01-15 | 2023-12-05 | KYOCERA AVX Components Corpration | Solid electrolytic capacitor |
TWI792365B (zh) * | 2021-06-24 | 2023-02-11 | 穗曄實業股份有限公司 | 熱固性樹脂組成物以及預浸漬片 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009280758A (ja) * | 2008-05-26 | 2009-12-03 | Sumitomo Bakelite Co Ltd | スラリー組成物、スラリー組成物の製造方法、樹脂ワニスの製造方法 |
JP2010235806A (ja) * | 2009-03-31 | 2010-10-21 | Taiyo Ink Mfg Ltd | 熱硬化性樹脂組成物及びその硬化物 |
JP2011157509A (ja) * | 2010-02-02 | 2011-08-18 | Hitachi Chem Co Ltd | 熱硬化性絶縁樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
JP2011202140A (ja) * | 2009-10-14 | 2011-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板および半導体装置 |
WO2013015469A1 (en) * | 2011-07-28 | 2013-01-31 | Protavic Korea Co., Ltd. | Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5114995A (en) * | 1974-07-29 | 1976-02-05 | Mitsubishi Gas Chemical Co | Shiansanesuterukiganjufuenoorujushino seizohoho |
US6190759B1 (en) | 1998-02-18 | 2001-02-20 | International Business Machines Corporation | High optical contrast resin composition and electronic package utilizing same |
JP3920582B2 (ja) | 2001-03-23 | 2007-05-30 | トヨタ自動車株式会社 | フィラー含有スラリー組成物 |
JP2003026957A (ja) * | 2001-07-16 | 2003-01-29 | Shigeru Koshibe | 充填材及びそれを含む樹脂組成物 |
AU2003276729A1 (en) | 2002-06-17 | 2003-12-31 | Henkel Corporation | Interlayer dielectric and pre-applied die attach adhesive materials |
KR101021047B1 (ko) | 2005-10-10 | 2011-03-15 | 아지노모토 가부시키가이샤 | 변성 폴리이미드 수지를 함유하는 열경화성 수지 조성물 |
JP4986256B2 (ja) | 2005-12-21 | 2012-07-25 | 味の素株式会社 | 変性ポリイミド樹脂を含有するプリプレグ |
WO2010035451A1 (ja) * | 2008-09-24 | 2010-04-01 | 積水化学工業株式会社 | 半硬化体、硬化体、積層体、半硬化体の製造方法及び硬化体の製造方法 |
CN101381506B (zh) * | 2008-09-26 | 2012-05-30 | 广东生益科技股份有限公司 | 无卤无磷阻燃环氧树脂组合物以及用其制作的粘结片与覆铜箔层压板 |
WO2010075006A1 (en) * | 2008-12-16 | 2010-07-01 | Dow Global Technologies Inc. | Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
JP5476715B2 (ja) | 2008-12-25 | 2014-04-23 | 味の素株式会社 | 樹脂組成物ワニスの製造方法 |
US20100193950A1 (en) | 2009-01-30 | 2010-08-05 | E.I.Du Pont De Nemours And Company | Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto |
US7842401B2 (en) | 2009-03-24 | 2010-11-30 | Iteq Corporation | Halogen-free varnish and prepreg thereof |
JP2010229227A (ja) | 2009-03-26 | 2010-10-14 | Sekisui Chem Co Ltd | エポキシ樹脂組成物、シート状成形体、プリプレグ、硬化体及び積層板 |
WO2010110433A1 (ja) * | 2009-03-27 | 2010-09-30 | 日立化成工業株式会社 | 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、支持体付絶縁フィルム、積層板及びプリント配線板 |
WO2011010672A1 (ja) | 2009-07-24 | 2011-01-27 | 住友ベークライト株式会社 | 樹脂組成物、樹脂シート、プリプレグ、金属張積層板、プリント配線板及び半導体装置 |
CN102648247B (zh) | 2009-12-02 | 2015-10-14 | 陶氏环球技术有限责任公司 | 涂料组合物 |
TWI529161B (zh) * | 2009-12-25 | 2016-04-11 | Hitachi Chemical Co Ltd | 熱硬化性樹脂組成物、樹脂組成物清漆的製造方法、預浸體及積層板 |
TW201220977A (en) * | 2010-07-01 | 2012-05-16 | Sumitomo Bakelite Co | Preppreg, circuit board, and semiconductor device |
CN102134375B (zh) | 2010-12-23 | 2013-03-06 | 广东生益科技股份有限公司 | 无卤高Tg树脂组合物及用其制成的预浸料与层压板 |
US9278505B2 (en) | 2011-07-22 | 2016-03-08 | Lg Chem, Ltd. | Thermosetting resin composition and prepreg and metal clad laminate using the same |
US9422412B2 (en) | 2011-09-22 | 2016-08-23 | Elite Material Co., Ltd. | Halogen-free resin composition and copper clad laminate and printed circuit board using same |
JP6152246B2 (ja) | 2011-09-26 | 2017-06-21 | 日立化成株式会社 | プリント配線板用プリプレグ、積層板及びプリント配線板 |
-
2014
- 2014-09-25 JP JP2016538868A patent/JP6301473B2/ja active Active
- 2014-09-25 CN CN201480042067.XA patent/CN105408418B/zh active Active
- 2014-09-25 KR KR1020140128140A patent/KR101677736B1/ko active IP Right Grant
- 2014-09-25 US US14/901,895 patent/US11535750B2/en active Active
- 2014-09-30 TW TW103133863A patent/TWI538955B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009280758A (ja) * | 2008-05-26 | 2009-12-03 | Sumitomo Bakelite Co Ltd | スラリー組成物、スラリー組成物の製造方法、樹脂ワニスの製造方法 |
JP2010235806A (ja) * | 2009-03-31 | 2010-10-21 | Taiyo Ink Mfg Ltd | 熱硬化性樹脂組成物及びその硬化物 |
JP2011202140A (ja) * | 2009-10-14 | 2011-10-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板および半導体装置 |
JP2011157509A (ja) * | 2010-02-02 | 2011-08-18 | Hitachi Chem Co Ltd | 熱硬化性絶縁樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板 |
WO2013015469A1 (en) * | 2011-07-28 | 2013-01-31 | Protavic Korea Co., Ltd. | Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018518563A (ja) * | 2016-01-13 | 2018-07-12 | エルジー・ケム・リミテッド | 半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ |
US10294341B2 (en) | 2016-01-13 | 2019-05-21 | Lg Chem, Ltd. | Thermosetting resin composition for semiconductor package and prepreg using the same |
JP2018135447A (ja) * | 2017-02-22 | 2018-08-30 | 住友ベークライト株式会社 | 樹脂組成物及び構造体 |
JP2021084968A (ja) * | 2019-11-28 | 2021-06-03 | 住友ベークライト株式会社 | 基材付き樹脂膜、プリント配線基板および電子装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20150037568A (ko) | 2015-04-08 |
KR101677736B1 (ko) | 2016-11-18 |
JP6301473B2 (ja) | 2018-03-28 |
CN105408418A (zh) | 2016-03-16 |
CN105408418B (zh) | 2017-04-26 |
TW201527402A (zh) | 2015-07-16 |
TWI538955B (zh) | 2016-06-21 |
US11535750B2 (en) | 2022-12-27 |
US20160369099A1 (en) | 2016-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6301473B2 (ja) | 半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 | |
JP6501211B2 (ja) | 半導体パッケージ用熱硬化性樹脂組成物とこれを用いたプリプレグ | |
US9278505B2 (en) | Thermosetting resin composition and prepreg and metal clad laminate using the same | |
KR101668855B1 (ko) | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 | |
JP6421755B2 (ja) | プリプレグ、金属箔張積層板及びプリント配線板 | |
CN108239372B (zh) | 树脂组合物、预浸料、层压板以及覆金属箔层压板 | |
WO2012083727A1 (zh) | 无卤高tg树脂组合物及用其制成的预浸料与层压板 | |
JP6249345B2 (ja) | 樹脂組成物、プリプレグ、積層板及びプリント配線板 | |
WO2015154314A1 (zh) | 一种热固性树脂组合物 | |
US10081728B2 (en) | Resin composition and uses of the same | |
TWI449721B (zh) | Epoxy resin compositions and prepregs and printed circuit boards made thereof | |
TWI746445B (zh) | 樹脂組成物、預浸體、樹脂片、疊層板及印刷電路板 | |
WO2015046921A1 (ko) | 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판 | |
TWI401269B (zh) | 環氧樹脂組成物及其製成的預浸材和印刷電路板 | |
JP6989086B6 (ja) | 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ | |
JP2020528471A6 (ja) | 半導体パッケージ用熱硬化性樹脂組成物およびこれを用いたプリプレグ | |
KR20200059296A (ko) | 수지 조성물, 프리프레그, 적층판 및 금속박적층판 | |
JP7070074B2 (ja) | 樹脂組成物、プリプレグ、樹脂付き金属箔、積層板及びプリント配線板 | |
KR101652174B1 (ko) | 프리프레그 및 이를 포함하는 금속박 적층판 및 인쇄회로기판 | |
KR20200059295A (ko) | 수지 조성물, 프리프레그, 적층판 및 금속박적층판 | |
WO2020133472A1 (zh) | 树脂组合物、预浸料、层压板以及覆金属箔层压板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160224 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161215 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170110 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170405 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171110 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180205 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180228 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6301473 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |