JP2016527722A5 - - Google Patents

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Publication number
JP2016527722A5
JP2016527722A5 JP2016528598A JP2016528598A JP2016527722A5 JP 2016527722 A5 JP2016527722 A5 JP 2016527722A5 JP 2016528598 A JP2016528598 A JP 2016528598A JP 2016528598 A JP2016528598 A JP 2016528598A JP 2016527722 A5 JP2016527722 A5 JP 2016527722A5
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JP
Japan
Prior art keywords
region
well region
trench
semiconductor
elements
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JP2016528598A
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English (en)
Japanese (ja)
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JP2016527722A (ja
JP6495272B2 (ja
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Priority claimed from GBGB1313126.3A external-priority patent/GB201313126D0/en
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Publication of JP2016527722A publication Critical patent/JP2016527722A/ja
Publication of JP2016527722A5 publication Critical patent/JP2016527722A5/ja
Application granted granted Critical
Publication of JP6495272B2 publication Critical patent/JP6495272B2/ja
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JP2016528598A 2013-07-23 2014-07-02 Mos−バイポーラ素子 Active JP6495272B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GBGB1313126.3A GB201313126D0 (en) 2013-07-23 2013-07-23 MOS-Bipolar Device
GB1313126.3 2013-07-23
GB1314474.6 2013-08-13
GBGB1314474.6A GB201314474D0 (en) 2013-07-23 2013-08-13 MOS-Bipolar device
PCT/GB2014/052013 WO2015011440A1 (en) 2013-07-23 2014-07-02 Mos-bipolar device

Publications (3)

Publication Number Publication Date
JP2016527722A JP2016527722A (ja) 2016-09-08
JP2016527722A5 true JP2016527722A5 (enExample) 2017-08-24
JP6495272B2 JP6495272B2 (ja) 2019-04-03

Family

ID=49119141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016528598A Active JP6495272B2 (ja) 2013-07-23 2014-07-02 Mos−バイポーラ素子

Country Status (10)

Country Link
US (1) US10170605B2 (enExample)
EP (1) EP3025373B1 (enExample)
JP (1) JP6495272B2 (enExample)
KR (1) KR102173473B1 (enExample)
CN (1) CN105706241B (enExample)
AU (1) AU2014294820B2 (enExample)
CA (1) CA2918848A1 (enExample)
ES (1) ES2942334T3 (enExample)
GB (3) GB201313126D0 (enExample)
WO (1) WO2015011440A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016112721B4 (de) 2016-07-12 2022-02-03 Infineon Technologies Ag n-Kanal-Leistungshalbleitervorrichtung mit p-Schicht im Driftvolumen
DE102016117264B4 (de) 2016-09-14 2020-10-08 Infineon Technologies Ag Leistungshalbleiterbauelement mit Steuerbarkeit von dU/dt
DE102017107174B4 (de) 2017-04-04 2020-10-08 Infineon Technologies Ag IGBT mit dV/dt-Steuerbarkeit und Verfahren zum Verarbeiten eines IGBT
DE102017124872B4 (de) 2017-10-24 2021-02-18 Infineon Technologies Ag Verfahren zur Herstellung eines IGBT mit dV/dt-Steuerbarkeit
DE102017124871B4 (de) 2017-10-24 2021-06-17 Infineon Technologies Ag Leistungshalbleiter-Vorrichtung und Verfahren zum Herstellen einer Leistungshalbleiter-Vorrichtung
GB2606383A (en) 2021-05-06 2022-11-09 Eco Semiconductors Ltd A semiconductor device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4761011B2 (ja) * 1999-05-26 2011-08-31 株式会社豊田中央研究所 サイリスタを有する半導体装置及びその製造方法
GB9921068D0 (en) * 1999-09-08 1999-11-10 Univ Montfort Bipolar mosfet device
JP4028333B2 (ja) * 2002-09-02 2007-12-26 株式会社東芝 半導体装置
JP4130356B2 (ja) 2002-12-20 2008-08-06 株式会社東芝 半導体装置
JP5984282B2 (ja) 2006-04-27 2016-09-06 富士電機株式会社 縦型トレンチ型絶縁ゲートmos半導体装置
US7968940B2 (en) * 2007-07-05 2011-06-28 Anpec Electronics Corporation Insulated gate bipolar transistor device comprising a depletion-mode MOSFET
US8716746B2 (en) * 2010-08-17 2014-05-06 Denso Corporation Semiconductor device
JP5634318B2 (ja) 2011-04-19 2014-12-03 三菱電機株式会社 半導体装置
US8564047B2 (en) 2011-09-27 2013-10-22 Force Mos Technology Co., Ltd. Semiconductor power devices integrated with a trenched clamp diode

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