JP2016164646A - 遮光膜を含むデバイスおよび前記遮光膜パターニング方法 - Google Patents
遮光膜を含むデバイスおよび前記遮光膜パターニング方法 Download PDFInfo
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- JP2016164646A JP2016164646A JP2015227953A JP2015227953A JP2016164646A JP 2016164646 A JP2016164646 A JP 2016164646A JP 2015227953 A JP2015227953 A JP 2015227953A JP 2015227953 A JP2015227953 A JP 2015227953A JP 2016164646 A JP2016164646 A JP 2016164646A
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000000059 patterning Methods 0.000 title claims description 47
- 239000010408 film Substances 0.000 claims abstract description 119
- 239000000203 mixture Substances 0.000 claims abstract description 58
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 29
- 239000003086 colorant Substances 0.000 claims abstract description 28
- 229920000642 polymer Polymers 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000002161 passivation Methods 0.000 claims abstract description 25
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000010409 thin film Substances 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims description 48
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 18
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 18
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 16
- 239000002243 precursor Substances 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 125000000524 functional group Chemical group 0.000 claims description 13
- GHPVDCPCKSNJDR-UHFFFAOYSA-N 2-hydroxydecanoic acid Chemical compound CCCCCCCCC(O)C(O)=O GHPVDCPCKSNJDR-UHFFFAOYSA-N 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 10
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 10
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 10
- 239000006229 carbon black Substances 0.000 claims description 10
- 239000004094 surface-active agent Substances 0.000 claims description 10
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 9
- 229940116333 ethyl lactate Drugs 0.000 claims description 9
- 229920002577 polybenzoxazole Polymers 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 125000006832 (C1-C10) alkylene group Chemical group 0.000 claims description 6
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 6
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 6
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- LMHJFKYQYDSOQO-UHFFFAOYSA-N hydroxydecanoic acid Natural products CCCCCC(O)CCCC(O)=O LMHJFKYQYDSOQO-UHFFFAOYSA-N 0.000 claims description 6
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 6
- 239000007870 radical polymerization initiator Substances 0.000 claims description 6
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 claims description 5
- KQIGMPWTAHJUMN-UHFFFAOYSA-N 3-aminopropane-1,2-diol Chemical compound NCC(O)CO KQIGMPWTAHJUMN-UHFFFAOYSA-N 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229910000428 cobalt oxide Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 5
- 229920000767 polyaniline Polymers 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
- GEWWCWZGHNIUBW-UHFFFAOYSA-N 1-(4-nitrophenyl)propan-2-one Chemical compound CC(=O)CC1=CC=C([N+]([O-])=O)C=C1 GEWWCWZGHNIUBW-UHFFFAOYSA-N 0.000 claims description 4
- 239000004971 Cross linker Substances 0.000 claims description 4
- 238000004061 bleaching Methods 0.000 claims description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 description 26
- -1 3-amino-4-hydroxyphenyl Chemical group 0.000 description 22
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 21
- 125000003118 aryl group Chemical group 0.000 description 15
- 125000002723 alicyclic group Chemical group 0.000 description 13
- 239000002253 acid Substances 0.000 description 11
- 230000018109 developmental process Effects 0.000 description 10
- 239000002270 dispersing agent Substances 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 150000004984 aromatic diamines Chemical class 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- PASDCCFISLVPSO-UHFFFAOYSA-N benzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1 PASDCCFISLVPSO-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 description 2
- 125000000923 (C1-C30) alkyl group Chemical group 0.000 description 2
- 125000006736 (C6-C20) aryl group Chemical group 0.000 description 2
- OSUWBBMPVXVSOA-UHFFFAOYSA-N 4-(4-carbonochloridoylphenoxy)benzoyl chloride Chemical compound C1=CC(C(=O)Cl)=CC=C1OC1=CC=C(C(Cl)=O)C=C1 OSUWBBMPVXVSOA-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 125000003358 C2-C20 alkenyl group Chemical group 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 150000001733 carboxylic acid esters Chemical class 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 125000006649 (C2-C20) alkynyl group Chemical group 0.000 description 1
- 125000006737 (C6-C20) arylalkyl group Chemical group 0.000 description 1
- 125000006835 (C6-C20) arylene group Chemical group 0.000 description 1
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- WBODDOZXDKQEFS-UHFFFAOYSA-N 1,2,3,4-tetramethyl-5-phenylbenzene Chemical group CC1=C(C)C(C)=CC(C=2C=CC=CC=2)=C1C WBODDOZXDKQEFS-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- KZLDGFZCFRXUIB-UHFFFAOYSA-N 2-amino-4-(3-amino-4-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC(C=2C=C(N)C(O)=CC=2)=C1 KZLDGFZCFRXUIB-UHFFFAOYSA-N 0.000 description 1
- KECOIASOKMSRFT-UHFFFAOYSA-N 2-amino-4-(3-amino-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(O)C(N)=CC(S(=O)(=O)C=2C=C(N)C(O)=CC=2)=C1 KECOIASOKMSRFT-UHFFFAOYSA-N 0.000 description 1
- UVULKOXOMNNKHQ-UHFFFAOYSA-N 2-amino-4-[2-[3-amino-4-hydroxy-2-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-3-(trifluoromethyl)phenol Chemical compound NC1=C(O)C=CC(C(C=2C(=C(N)C(O)=CC=2)C(F)(F)F)(C(F)(F)F)C(F)(F)F)=C1C(F)(F)F UVULKOXOMNNKHQ-UHFFFAOYSA-N 0.000 description 1
- GCPBXBPTVLXELM-UHFFFAOYSA-N 2-amino-4-[2-[3-amino-4-hydroxy-5-(1,1,2,2,2-pentafluoroethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-6-(1,1,2,2,2-pentafluoroethyl)phenol Chemical compound FC(F)(F)C(F)(F)C1=C(O)C(N)=CC(C(C=2C=C(C(O)=C(N)C=2)C(F)(F)C(F)(F)F)(C(F)(F)F)C(F)(F)F)=C1 GCPBXBPTVLXELM-UHFFFAOYSA-N 0.000 description 1
- CERCNNGWSFHMRS-UHFFFAOYSA-N 2-amino-4-[2-[3-amino-4-hydroxy-5-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-6-(trifluoromethyl)phenol Chemical compound FC(F)(F)C1=C(O)C(N)=CC(C(C=2C=C(C(O)=C(N)C=2)C(F)(F)F)(C(F)(F)F)C(F)(F)F)=C1 CERCNNGWSFHMRS-UHFFFAOYSA-N 0.000 description 1
- KDTQDPGQSURHCS-UHFFFAOYSA-N 2-amino-4-[2-[4-amino-3-hydroxy-5-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-6-(trifluoromethyl)phenol Chemical compound FC(F)(F)C1=C(O)C(N)=CC(C(C=2C=C(C(N)=C(O)C=2)C(F)(F)F)(C(F)(F)F)C(F)(F)F)=C1 KDTQDPGQSURHCS-UHFFFAOYSA-N 0.000 description 1
- HSDJJCLSBWAWCR-UHFFFAOYSA-N 2-amino-4-[2-[4-amino-5-hydroxy-2-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-6-(trifluoromethyl)phenol Chemical compound C1=C(O)C(N)=CC(C(F)(F)F)=C1C(C(F)(F)F)(C(F)(F)F)C1=CC(N)=C(O)C(C(F)(F)F)=C1 HSDJJCLSBWAWCR-UHFFFAOYSA-N 0.000 description 1
- UAOAJEXJIVJGFW-UHFFFAOYSA-N 2-amino-4-[2-[5-amino-4-hydroxy-2-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-5-(trifluoromethyl)phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C(=CC(O)=C(N)C=2)C(F)(F)F)(C(F)(F)F)C(F)(F)F)=C1C(F)(F)F UAOAJEXJIVJGFW-UHFFFAOYSA-N 0.000 description 1
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical group C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 1
- KHAFBBNQUOEYHB-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(O)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(O)=C1 KHAFBBNQUOEYHB-UHFFFAOYSA-N 0.000 description 1
- ZDRNVPNSQJRIRN-UHFFFAOYSA-N 2-amino-5-[2-(4-amino-3-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C(O)=C1 ZDRNVPNSQJRIRN-UHFFFAOYSA-N 0.000 description 1
- JDFAWEKPFLGRAK-UHFFFAOYSA-N 2-amino-5-[2-(4-amino-3-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(N)C(O)=CC=1C(C)(C)C1=CC=C(N)C(O)=C1 JDFAWEKPFLGRAK-UHFFFAOYSA-N 0.000 description 1
- GXEAXAATWBRDKR-UHFFFAOYSA-N 2-amino-5-[2-[4-amino-3-hydroxy-5-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-3-(trifluoromethyl)phenol Chemical compound C1=C(C(F)(F)F)C(N)=C(O)C=C1C(C(F)(F)F)(C(F)(F)F)C1=CC(O)=C(N)C(C(F)(F)F)=C1 GXEAXAATWBRDKR-UHFFFAOYSA-N 0.000 description 1
- WYQNZULITNCPDJ-UHFFFAOYSA-N 2-amino-5-[2-[4-amino-5-hydroxy-2-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-4-(trifluoromethyl)phenol Chemical compound C1=C(O)C(N)=CC(C(F)(F)F)=C1C(C(F)(F)F)(C(F)(F)F)C1=CC(O)=C(N)C=C1C(F)(F)F WYQNZULITNCPDJ-UHFFFAOYSA-N 0.000 description 1
- NJQCNUUEPDKIOO-UHFFFAOYSA-N 2-amino-5-[2-[5-amino-4-hydroxy-2-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-3-(trifluoromethyl)phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(C(N)=C(O)C=2)C(F)(F)F)(C(F)(F)F)C(F)(F)F)=C1C(F)(F)F NJQCNUUEPDKIOO-UHFFFAOYSA-N 0.000 description 1
- JTAZMBPIWJGSNR-UHFFFAOYSA-N 2-hydroxy-2-methylpropanoic acid methyl 2-hydroxypropanoate Chemical compound COC(=O)C(C)O.CC(C)(O)C(O)=O JTAZMBPIWJGSNR-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- QITGRLDGDYMKNB-UHFFFAOYSA-N 3-(3-aminopropyl-phenyl-triphenylsilyloxysilyl)propan-1-amine Chemical compound C=1C=CC=CC=1[Si](CCCN)(CCCN)O[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 QITGRLDGDYMKNB-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- FGWQCROGAHMWSU-UHFFFAOYSA-N 3-[(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(N)=C1 FGWQCROGAHMWSU-UHFFFAOYSA-N 0.000 description 1
- QMAQHCMFKOQWML-UHFFFAOYSA-N 3-[2-[2-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C(=CC=CC=2)S(=O)(=O)C=2C(=CC=CC=2)OC=2C=C(N)C=CC=2)=C1 QMAQHCMFKOQWML-UHFFFAOYSA-N 0.000 description 1
- FPHRTSFRLFDOHZ-UHFFFAOYSA-N 3-[[4-[3-aminopropyl(dimethyl)silyl]phenyl]-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)C1=CC=C([Si](C)(C)CCCN)C=C1 FPHRTSFRLFDOHZ-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- CHJYKNDQMVDBKS-UHFFFAOYSA-N 4,4,4-trifluorobutane-1-sulfonic acid Chemical compound OS(=O)(=O)CCCC(F)(F)F CHJYKNDQMVDBKS-UHFFFAOYSA-N 0.000 description 1
- FFKSVVOWOROQIU-UHFFFAOYSA-N 4-(2,5-dioxooxolan-3-yl)-1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic acid Chemical compound C12=CC=CC=C2C(C(O)=O)C(C(=O)O)CC1C1CC(=O)OC1=O FFKSVVOWOROQIU-UHFFFAOYSA-N 0.000 description 1
- JQGUWEUKOQRRJU-UHFFFAOYSA-N 4-(4-aminobutyl-methyl-trimethylsilyloxysilyl)butan-1-amine Chemical compound NCCCC[Si](C)(O[Si](C)(C)C)CCCCN JQGUWEUKOQRRJU-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- KKTPGXGRDRSYMY-UHFFFAOYSA-N 4-[(4-aminophenyl)-dimethylsilyl]aniline Chemical compound C=1C=C(N)C=CC=1[Si](C)(C)C1=CC=C(N)C=C1 KKTPGXGRDRSYMY-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 1
- IDXLMUPIWAJBRO-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)-3-methylcyclohexane-1,2-dicarboxylic acid Chemical compound C1C(C(O)=O)C(C(O)=O)C(C)CC1C1C(=O)OC(=O)C1 IDXLMUPIWAJBRO-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- PWGYQXPTXMXJKP-UHFFFAOYSA-N 6-amino-3-[2-[3-amino-4-hydroxy-5-(trifluoromethyl)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-(trifluoromethyl)phenol Chemical compound FC(F)(F)C1=C(O)C(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC(N)=C(O)C(C(F)(F)F)=C1 PWGYQXPTXMXJKP-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- 125000003860 C1-C20 alkoxy group Chemical group 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000000852 azido group Chemical group *N=[N+]=[N-] 0.000 description 1
- FYXKZNLBZKRYSS-UHFFFAOYSA-N benzene-1,2-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC=C1C(Cl)=O FYXKZNLBZKRYSS-UHFFFAOYSA-N 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- QSCQBWYZLHJYRJ-UHFFFAOYSA-N butyl 2-hydroxypropanoate 2-hydroxy-2-methylhexanoic acid Chemical compound CCCCOC(=O)C(C)O.CCCCC(C)(O)C(O)=O QSCQBWYZLHJYRJ-UHFFFAOYSA-N 0.000 description 1
- 125000003739 carbamimidoyl group Chemical group C(N)(=N)* 0.000 description 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 1
- 125000006297 carbonyl amino group Chemical group [H]N([*:2])C([*:1])=O 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000004989 dicarbonyl group Chemical group 0.000 description 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- LNSXAHXVHYLJEG-UHFFFAOYSA-N ethyl 2-hydroxypropanoate;2-hydroxy-2-methylbutanoic acid Chemical compound CCOC(=O)C(C)O.CCC(C)(O)C(O)=O LNSXAHXVHYLJEG-UHFFFAOYSA-N 0.000 description 1
- KJSZRMCHQUWQSJ-UHFFFAOYSA-N ethyl 2-oxopropanoate;2-oxopentanoic acid Chemical compound CCCC(=O)C(O)=O.CCOC(=O)C(C)=O KJSZRMCHQUWQSJ-UHFFFAOYSA-N 0.000 description 1
- 125000005549 heteroarylene group Chemical group 0.000 description 1
- 125000004366 heterocycloalkenyl group Chemical group 0.000 description 1
- 125000000717 hydrazino group Chemical group [H]N([*])N([H])[H] 0.000 description 1
- 125000005638 hydrazono group Chemical group 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- XUTLZGKVFSLSDR-UHFFFAOYSA-N methyl 2-oxopropanoate;2-oxobutanoic acid Chemical compound CCC(=O)C(O)=O.COC(=O)C(C)=O XUTLZGKVFSLSDR-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- AIKVCUNQWYTVTO-UHFFFAOYSA-N nicardipine hydrochloride Chemical compound Cl.COC(=O)C1=C(C)NC(C)=C(C(=O)OCCN(C)CC=2C=CC=CC=2)C1C1=CC=CC([N+]([O-])=O)=C1 AIKVCUNQWYTVTO-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- LCUPNHOUKMJAQN-UHFFFAOYSA-N phenoxycarbonyl phenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC(=O)OC1=CC=CC=C1 LCUPNHOUKMJAQN-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical class [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/003—Light absorbing elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Materials For Photolithography (AREA)
- Optical Filters (AREA)
Abstract
Description
R2およびR3は、それぞれ独立して、水素原子または置換もしくは非置換のC1〜C10アルキル基である。
Xは、−CH2−または−NH−(を含む2価の基)であり、
Wは、−O−または−S−であり、
nは、0または1の整数であり、
R1は、水素原子または置換もしくは非置換のC1〜C10アルキル基であり、
L1は、単結合または置換もしくは非置換のC1〜C10アルキレン基である。
Xは、−CH2−または−NH−であり、
R1は、水素原子または置換もしくは非置換のC1〜C10アルキル基であり、
L1は、単結合または置換もしくは非置換のC1〜C10アルキレン基である。
X1は、置換もしくは非置換のC6〜C30芳香族有機基であってもよく、
Y1は、置換もしくは非置換のC6〜C30芳香族有機基、置換もしくは非置換の2価〜6価のC1〜C30脂肪族有機基または置換もしくは非置換の2価〜6価のC3〜C30脂環族有機基であってもよい。
X2は、置換もしくは非置換のC6〜C30芳香族有機基、置換もしくは非置換の2価〜6価のC1〜C30脂肪族有機基または置換もしくは非置換の2価〜6価のC3〜C30脂環族有機基であってもよく、
Y2は、置換もしくは非置換のC6〜C30芳香族有機基、置換もしくは非置換の4価〜6価のC1〜C30脂肪族有機基または置換もしくは非置換の4価〜6価のC3〜C30脂環族有機基であってもよい。
A1は、単結合、O、CO、CR47R48、SO2またはSであってもよく、前記R47およびR48は、それぞれ独立して、水素原子、または置換もしくは非置換のC1〜C30アルキル基であり、具体的にはC1〜C30フルオロアルキル基であってもよく、
R50〜R52は、それぞれ独立して、水素原子、置換もしくは非置換のC1〜C30アルキル基、*−COORx(Rxは水素原子または置換もしくは非置換のC1〜C10アルキル基)、ヒドロキシ基またはチオール基であってもよく、
n10は、0〜2の整数であってもよく、n11およびn12は、それぞれ0〜3の整数であってもよい。
R53〜R56は、それぞれ独立して、水素原子または置換もしくは非置換のC1〜C30アルキル基であってもよく、
n13およびn14は、それぞれ0〜4の整数であってもよく、n15およびn16は、それぞれ0〜3の整数であってもよく、
A2は、単結合、O、CR47R48、CO、CONH、SまたはSO2であってもよく、前記R47およびR48は、それぞれ独立して、水素原子または置換もしくは非置換のC1〜C30アルキル基であってもよく、具体的にはC1〜C30フルオロアルキル基であってもよい。
R2およびR3は、それぞれ独立して、水素原子または置換もしくは非置換のC1〜C10アルキル基である。
Xは、−CH2−または−NH−(を含む2価の基)であり、
Wは、−O−または−S−であり、
nは、0または1の整数であり、
R1は、水素原子または置換もしくは非置換のC1〜C10アルキル基であり、
L1は、単結合または置換もしくは非置換のC1〜C10アルキレン基である。
Xは、−CH2−または−NH−(を含む2価の基)であり、
R1は、水素原子または置換もしくは非置換のC1〜C10アルキル基であり、
L1は、単結合または置換もしくは非置換のC1〜C10アルキレン基である。
(耐熱性ポリマーの製造)
攪拌器、温度調節装置、窒素ガス注入装置、および冷却器が装着された4口フラスコに窒素を通過させながら2,2−ビス(3−アミノ−4−ヒドロキシフェニル)−1,1,1,3,3,3−ヘキサフルオロプロパン12.4gおよびN−メチル−2−ピロリドン(NMP)125gを入れて溶解した。
(実施例1)
前記実施例で得られたポリベンゾオキサゾール前駆体10gをγ−ブチロラクトン(GBL)10g、PGME(プロピレングリコールモノメチルエーテル)140g及びEL(乳酸エチル)40gの混合溶媒に添加して溶解した後、カーボンブラック8gと下記の化学式Bで表される架橋剤2.5gをさらに入れて溶解した後、0.45μmのフッ素樹脂材フィルターで濾過して遮光膜パターニング用組成物を得た。
前記実施例1で、カーボンブラック、前記化学式Bで表される架橋剤と共に下記の化学式10で表される塩基発生剤2.5gをさらに含ませたことを除いては、実施例1と同様にして遮光膜パターニング用組成物を製造した。
前記実施例1で、カーボンブラック、前記化学式Bで表される架橋剤と共に下記の化学式21で表される塩基発生剤2.5gをさらに含ませたことを除いては、実施例1と同様にして遮光膜パターニング用組成物を製造した。
前記実施例1で、前記化学式Bで表される架橋剤を用いないことを除いては、実施例1と同様にして遮光膜パターニング用組成物を製造した。
(評価1:耐薬品性の評価)
前記実施例1〜実施例3および比較例1による遮光膜パターニング用組成物を8インチのウエハーにSEMES社のスピンコーターであるK−SPINNERを用いてコーティングした後、140℃のホットプレートで3分間加熱して厚さ1.5μmの遮光膜を形成した。前記遮光膜をPGMEAに1分間ディッピング(dipping)した後、厚さの変化を観察して、その結果を下記表1に示した。
○:厚さの変化がない
×:厚さの変化がある。
前記実施例1〜実施例3および比較例1による遮光膜パターニング用組成物を8インチのウエハーにSEMES社のスピンコーターであるK−SPINNERを用いてコーティングした後、140℃のホットプレートで3分間加熱して厚さ1.5μmの遮光膜を形成した。そしてi−line PR(Photo Resist)(HKT−501)を前記遮光膜上にコーティングした後、これを100℃のホットプレートで1分間加熱して厚さ1.0μmのPR(Photo Resist)膜を形成した。以降、Nikon社のi10Cでエネルギーをスプリット(split)して5μmの微細パターンを実現した。パターニングされたウエハーを前面露光(bleaching;1000mJ/cm2)した。以降、Al etchant(アルミニウムエッチング液)で30℃で300秒間ディッピングした後、TMAH(テトラメチルアンモニウムヒドロキシド;2.5質量%のテトラメチルアンモニウムヒドロキシドのアルカリ水溶液の現像液)で200秒puddle(パドル;パドル法による現像)工程を行い、最終遮光膜パターニングを得た。また、前記パターンが実現された基板を350℃で1時間硬化後、Hitachi社のS−4300でテーパ角を測定し、その結果を表2に示した。
○:最終遮光膜パターンの形成ができる
×:最終遮光膜パターンの形成ができない。
110、180、210、280:基板、
120、220:遮光膜、
130、150、230、250:パッシベーション膜、
140、240:薄膜トランジスター、
160、260:カラーフィルター、
170、270:絶縁膜。
Claims (19)
- 基板と、
前記基板上に位置する遮光膜と、
前記基板上に位置し、前記遮光膜を覆うパッシベーション膜と、
前記パッシベーション膜上に位置する薄膜トランジスターと、
前記薄膜トランジスターを覆う他のパッシベーション膜と、
前記他のパッシベーション膜上に位置するカラーフィルターと、
前記他のパッシベーション膜上に位置し、前記カラーフィルターを覆う絶縁膜と、を含み、
前記遮光膜は、耐熱性ポリマー、架橋剤、黒色着色剤および溶媒を含む組成物を用いてパターニングされるデバイス。 - 前記耐熱性ポリマーは、ポリベンゾオキサゾール前駆体、ポリイミド前駆体、ノボラック樹脂、ビスフェノールA樹脂、ビスフェノールF樹脂、アクリレート樹脂、シロキサン系樹脂またはこれらの組み合わせである、請求項1に記載のデバイス。
- 前記架橋剤は、下記の化学式1で表される官能基を一つ以上含む、請求項1または2に記載のデバイス。
- 前記架橋剤は、下記の化学式2〜化学式4で表される官能基からなる群より選択された少なくとも一つをさらに含む、請求項3に記載のデバイス。
R2およびR3は、それぞれ独立して、水素原子または置換もしくは非置換のC1〜C10アルキル基である。) - 前記組成物は、塩基発生剤をさらに含む、請求項1〜4のいずれか1項に記載のデバイス。
- 前記塩基発生剤は、下記の化学式5で表される、請求項5に記載のデバイス。
Xは、−CH2−または−NH−であり、
Wは、−O−または−S−であり、
nは、0または1の整数であり、
R1は、水素原子または置換もしくは非置換のC1〜C10アルキル基であり、
L1は、単結合または置換もしくは非置換のC1〜C10アルキレン基である。) - 前記塩基発生剤は、下記の化学式6〜化学式9のうちのいずれか一つで表される、請求項5または6に記載のデバイス。
Xは、−CH2−または−NH−であり、
R1は、水素原子または置換もしくは非置換のC1〜C10アルキル基であり、
L1は、単結合または置換もしくは非置換のC1〜C10アルキレン基である。) - 前記塩基発生剤は、下記の化学式10〜化学式22からなる群より選択された少なくとも一つである、請求項5〜7のいずれか1項に記載のデバイス。
- 前記黒色着色剤は、カーボンブラック、アニリンブラック、ペリレンブラック、RGB混合型ブラック、コバルト酸化物、チタニウム酸化物、またはこれらの組み合わせである、請求項1〜8のいずれか1項に記載のデバイス。
- 前記組成物は、
前記耐熱性ポリマー100重量部に対して
前記架橋剤を5重量部〜40重量部含み、
前記黒色着色剤を10重量部〜200重量部含み、
前記溶媒を150重量部〜4000重量部含む、請求項1〜9のいずれか1項に記載のデバイス。 - 前記塩基発生剤は、前記耐熱性ポリマー100重量部に対して5重量部〜40重量部で含まれる、請求項5〜10のいずれか1項に記載のデバイス。
- 前記組成物は、マロン酸、3−アミノ−1,2−プロパンジオール、レベリング剤、フッ素系界面活性剤、シリコン系界面活性剤、ラジカル重合開始剤またはこれらの組み合わせの添加剤をさらに含む、請求項1〜11のいずれか1項に記載のデバイス。
- 基材上に耐熱性ポリマー、架橋剤、黒色着色剤および溶媒を含む組成物をコーティングする段階と、
前記組成物上にフォトレジストをコーティングして加熱する段階と、
露光および現像する段階と、
前記現像後、エッチングする段階と、
前記エッチング後、ストリッパーを用いてストリッピングする段階と、
前記ストリッピング後、加熱する段階と、
を含む遮光膜パターニング方法。 - 前記ストリッピング後、加熱する段階において、前記加熱は、200℃〜600℃で行う、請求項13に記載の遮光膜パターニング方法。
- 前記組成物上にフォトレジストをコーティングして加熱する段階において、前記加熱は、70℃〜160℃で行う、請求項13または14に記載の遮光膜パターニング方法。
- 前記ストリッパーは、プロピレングリコールモノメチルエーテル(PGME)、プロピレングリコールモノメチルエーテルアセテート(PGMEA)、エチルラクテート(EL)、γ−ブチロラクトン(GBL)、テトラメチルアンモニウムヒドロキシド(TMAH)、水酸化カリウム(KOH)、ジメチルスルホキシド(DMSO)、ブチルジグリコール(BDG)、モノエタノールアミン(MEA)、N−メチルピロリドン(NMP)、ヒドロキシデカン酸(HDA)、カテコールまたはこれらの組み合わせを含む、請求項13〜15のいずれか1項に記載の遮光膜パターニング方法。
- 前記現像後、エッチングする前または前記エッチング後ストリッピングする前に、漂白する段階をさらに含む、請求項13〜16のいずれか1項に記載の遮光膜パターニング方法。
- 前記架橋剤は、下記の化学式1で表される官能基を一つ以上含む、請求項13〜17のいずれか1項に記載の遮光膜パターニング方法。
- 前記組成物は、塩基発生剤をさらに含む、請求項13〜18のいずれか1項に記載の遮光膜パターニング方法。
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