JP2016139654A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2016139654A JP2016139654A JP2015012379A JP2015012379A JP2016139654A JP 2016139654 A JP2016139654 A JP 2016139654A JP 2015012379 A JP2015012379 A JP 2015012379A JP 2015012379 A JP2015012379 A JP 2015012379A JP 2016139654 A JP2016139654 A JP 2016139654A
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- Prior art keywords
- semiconductor chip
- semiconductor
- semiconductor device
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- adhesive
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 193
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
【解決手段】パッケージ基板と、パッケージ基板上に積層される複数の半導体チップとを有し、複数の半導体チップの内、少なくとも一つは、裏面の周縁部に段差部を有することを特徴とする半導体装置である。
【選択図】図1
Description
図1を参照して本実施形態に係る半導体装置100の構成を説明する。図1(A)は、本実施形態に係る半導体装置100の平面図である。図1(B)は、本実施形態に係る半導体チップ100の断面図である。半導体装置100は、パッケージ基板105上に積層された複数の半導体チップ101を有している。複数の半導体チップ101の各々には、複数の電気接続用端子104が設けられている。また、パッケージ基板105には、半導体チップ101の電気接続用端子104と電気的に接続される端子が設けられている。この端子の形態は任意であるが、例えば、図1(A)に示すように複数のリードフレーム106であってもよい。電気接続用端子104とリードフレーム106との接続にはボンディングワイヤ108が用いられている。図1(B)の断面図で示すように、積層される複数の半導体チップ101のサイズは略同一となっている。なお、図1(B)では半導体チップ101が2層積層されている態様を例示しているが、2層に限られず、本実施形態よる半導体装置100は3層以上に拡張することが可能である。
図2を参照して本変形例に係る半導体装置200の構成を説明する。図2(A)は、本変形例に係る半導体装置200の平面図である。図2(B)は、本変形例に係る半導体装置200の断面図である。本変形例に係る半導体装置200は、前述の半導体装置100に比べて、上層の半導体チップ103の段差部の配置のみが異なっている。前述の半導体装置100では、上層の半導体チップ103の外周全域の端部に段差部が設けられているが、これに限られるものではなく、本変形例のように周縁部の内、周縁部の1辺にのみ段差部が設けられていてもよい。また、任意の2辺や3辺に設けられてもよい。
図3を参照して本実施形態に係る半導体チップ300の構成を説明する。図3(A)は、本実施形態に係る半導体チップ300の平面図である。図3(B)は、本実施形態に係る半導体チップ300の断面図である。
図4を参照して本変形例に係る半導体装置400の構成を説明する。図4は、本変形例に係る半導体装置400の断面である。本変形例に係る半導体装置400は、前述の第1実施形態による半導体装置100と第2実施形態による半導体装置300を組み合わせた態様である。具体的には、パッケージ基板105と、下層の半導体チップ102との接着にはペースト状の接着剤112を用いており、下層の半導体チップ102と上層の半導体チップ103との接触にはフィルム状の接着剤110を用いている。
図5を参照して本実施形態に係る半導体チップ500の構成を説明する。図5は、本実施形態に係る半導体装置500の断面図である。半導体装置500は、装置基板105に接して配置された半導体チップ102と、半導体チップ102の上層に配置された半導体チップ103と、半導体チップ103上に配置された放熱板114と、電気接続用端子104と、装置基板105上に設けられた複数のリードフレーム106と、電気接続用端子104とリードフレーム106を接続するボンディングワイヤ108とを有している。図5の断面図においては、2層の半導体チップが積層されている態様を例示しているが、2層に限られず、本実施形態よる半導体装置500は3層以上に拡張することが可能である。
半導体チップ:101、102、103
電気接続用端子:104
パッケージ基板:105
リードフレーム:106
ボンディングワイヤ:108
接着剤:110、112、116
放熱板:114
Claims (12)
- パッケージ基板と、
前記パッケージ基板上に積層される複数の半導体チップと
を有し、
前記複数の半導体チップの内、少なくとも一つは、裏面の周縁部に段差部を有することを特徴とする半導体装置。 - 前記段差部は、前記複数の半導体チップの内、上層に積層される半導体チップに設けられ、下層に配置される半導体チップの電気接続用端子が露出されていることを特徴とする請求項1に記載の半導体装置。
- 前記段差部は、前記半導体チップの周縁部の一部に設けられることを特徴とする請求項2に記載の半導体装置。
- 前記複数の半導体チップの各々の中心は略一致し、半径が0.005mm以内の領域内に配置されることを特徴とする請求項2又は請求項3に記載の半導体装置。
- 前記複数の半導体チップの内、少なくとも一つは、裏面に複数の溝を有し、接着剤を介して下層と接着されることを特徴とする請求項4に記載の半導体装置。
- 前記接着材はダイアタッチペーストであることを特徴とする請求項5に記載の半導体装置。
- 放熱板を更に具備し、
前記複数の半導体チップの内最上層の半導体チップは、裏面に複数の溝を有し、
前記最上層の半導体チップの裏面と前記放熱板は、接着剤を介して接着され、
前記最上層の半導体チップの表面と下層が接着されることを特徴とする請求項1に記載の半導体装置。 - 前記最上層の半導体チップの裏面と前記放熱板とを接着する接着材は、ダイアタッチペーストであることを特徴とする請求項7に記載の半導体装置。
- パッケージ基板と、
裏面に複数の溝を有し、裏面の端部に段差部を有する第1の半導体チップと
を具備し、
前記第1の半導体チップの裏面と前記パッケージ基板が、接着材で接着されることを特徴とする半導体装置。 - 前記接着材はダイアタッチペーストであることを特徴とする請求項9に記載の半導体装置。
- 放熱板と、
裏面に複数の溝を有する第2の半導体チップと
を更に具備し、
前記第2の半導体チップの裏面と前記放熱板が、接着剤を介して接着され、
前記第2の半導体チップの表面と前記第1の半導体チップの表面が接着されることを特徴とする請求項10に記載の半導体装置。 - 前記第2の半導体チップの裏面と前記放熱板とを接着する接着材は、ダイアタッチペーストであることを特徴とする請求項11に記載の半導体装置。
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TW104144388A TWI719006B (zh) | 2015-01-26 | 2015-12-30 | 半導體裝置 |
US14/994,963 US9905536B2 (en) | 2015-01-26 | 2016-01-13 | Semiconductor device |
CN201610024987.XA CN105826308A (zh) | 2015-01-26 | 2016-01-14 | 半导体装置 |
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JP2003163313A (ja) * | 2001-09-13 | 2003-06-06 | Texas Instr Japan Ltd | 半導体装置及びその製造方法 |
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US20160218086A1 (en) | 2016-07-28 |
KR20160091810A (ko) | 2016-08-03 |
CN105826308A (zh) | 2016-08-03 |
TW201628150A (zh) | 2016-08-01 |
US9905536B2 (en) | 2018-02-27 |
JP6560496B2 (ja) | 2019-08-14 |
TWI719006B (zh) | 2021-02-21 |
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