JP2015510260A5 - - Google Patents

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Publication number
JP2015510260A5
JP2015510260A5 JP2014552295A JP2014552295A JP2015510260A5 JP 2015510260 A5 JP2015510260 A5 JP 2015510260A5 JP 2014552295 A JP2014552295 A JP 2014552295A JP 2014552295 A JP2014552295 A JP 2014552295A JP 2015510260 A5 JP2015510260 A5 JP 2015510260A5
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JP
Japan
Prior art keywords
substrate
gas
back side
supplying
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014552295A
Other languages
English (en)
Japanese (ja)
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JP2015510260A (ja
Filing date
Publication date
Priority claimed from US13/737,350 external-priority patent/US8980767B2/en
Application filed filed Critical
Publication of JP2015510260A publication Critical patent/JP2015510260A/ja
Publication of JP2015510260A5 publication Critical patent/JP2015510260A5/ja
Pending legal-status Critical Current

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JP2014552295A 2012-01-13 2013-01-10 基板を処理する方法および装置 Pending JP2015510260A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261586186P 2012-01-13 2012-01-13
US61/586,186 2012-01-13
US13/737,350 US8980767B2 (en) 2012-01-13 2013-01-09 Methods and apparatus for processing a substrate
US13/737,350 2013-01-09
PCT/US2013/021006 WO2013106552A1 (en) 2012-01-13 2013-01-10 Methods and apparatus for processing a substrate

Publications (2)

Publication Number Publication Date
JP2015510260A JP2015510260A (ja) 2015-04-02
JP2015510260A5 true JP2015510260A5 (enExample) 2016-04-07

Family

ID=48780267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014552295A Pending JP2015510260A (ja) 2012-01-13 2013-01-10 基板を処理する方法および装置

Country Status (6)

Country Link
US (2) US8980767B2 (enExample)
JP (1) JP2015510260A (enExample)
KR (3) KR20200093702A (enExample)
CN (1) CN107464751B (enExample)
TW (1) TWI579922B (enExample)
WO (1) WO2013106552A1 (enExample)

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Publication number Priority date Publication date Assignee Title
JP6065366B2 (ja) * 2012-01-30 2017-01-25 富士通セミコンダクター株式会社 半導体装置の製造方法
WO2015073185A1 (en) * 2013-11-12 2015-05-21 Applied Materials, Inc. Pyrometer background elimination
US9881788B2 (en) * 2014-05-22 2018-01-30 Lam Research Corporation Back side deposition apparatus and applications
CN106298581B (zh) * 2015-05-13 2020-10-13 盛美半导体设备(上海)股份有限公司 光辐射加热刻蚀装置及方法
US10260149B2 (en) 2016-04-28 2019-04-16 Applied Materials, Inc. Side inject nozzle design for processing chamber
KR102528559B1 (ko) * 2016-07-26 2023-05-04 삼성전자주식회사 대면적 기판 제조 장치
US10851457B2 (en) 2017-08-31 2020-12-01 Lam Research Corporation PECVD deposition system for deposition on selective side of the substrate
CN110119072B (zh) * 2018-02-06 2021-05-14 志圣科技（广州）有限公司 曝光组件及曝光装置
KR102505474B1 (ko) 2019-08-16 2023-03-03 램 리써치 코포레이션 웨이퍼 내에서 차동 보우를 보상하기 위한 공간적으로 튜닝 가능한 증착
US12272608B2 (en) 2020-01-03 2025-04-08 Lam Research Corporation Station-to-station control of backside bow compensation deposition
WO2021154641A1 (en) 2020-01-30 2021-08-05 Lam Research Corporation Uv cure for local stress modulation
US12176242B2 (en) * 2022-01-21 2024-12-24 Applied Materials, Inc. Rotatable thermal processing chamber

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US5660472A (en) * 1994-12-19 1997-08-26 Applied Materials, Inc. Method and apparatus for measuring substrate temperatures
US6465043B1 (en) * 1996-02-09 2002-10-15 Applied Materials, Inc. Method and apparatus for reducing particle contamination in a substrate processing chamber
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US5960555A (en) * 1996-07-24 1999-10-05 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5920797A (en) * 1996-12-03 1999-07-06 Applied Materials, Inc. Method for gaseous substrate support
US6413871B2 (en) * 1999-06-22 2002-07-02 Applied Materials, Inc. Nitrogen treatment of polished halogen-doped silicon glass
US6803546B1 (en) * 1999-07-08 2004-10-12 Applied Materials, Inc. Thermally processing a substrate
US6375748B1 (en) * 1999-09-01 2002-04-23 Applied Materials, Inc. Method and apparatus for preventing edge deposition
JP2001102321A (ja) * 1999-09-17 2001-04-13 Applied Materials Inc 半導体製造装置における基板加熱方法及び半導体製造装置
EP1124252A2 (en) * 2000-02-10 2001-08-16 Applied Materials, Inc. Apparatus and process for processing substrates
JP2002057209A (ja) * 2000-06-01 2002-02-22 Tokyo Electron Ltd 枚葉式処理装置および枚葉式処理方法
EP1297560A2 (en) * 2000-07-06 2003-04-02 Applied Materials, Inc. Thermally processing a substrate
US6521292B1 (en) * 2000-08-04 2003-02-18 Applied Materials, Inc. Substrate support including purge ring having inner edge aligned to wafer edge
JP3494435B2 (ja) * 2001-02-27 2004-02-09 東京エレクトロン株式会社 基板処理装置
JP2003077851A (ja) * 2001-08-28 2003-03-14 Applied Materials Inc 熱処理方法及び装置
US20040266123A1 (en) 2002-05-08 2004-12-30 Applied Materials, Inc. Electron beam treatment of SixNy films
JP4186536B2 (ja) * 2002-07-18 2008-11-26 松下電器産業株式会社 プラズマ処理装置
JP4765328B2 (ja) 2004-04-16 2011-09-07 東京エレクトロン株式会社 被処理体の処理装置
US7860379B2 (en) * 2007-01-15 2010-12-28 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
US8580078B2 (en) * 2007-01-26 2013-11-12 Lam Research Corporation Bevel etcher with vacuum chuck
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JP5186504B2 (ja) 2007-09-06 2013-04-17 株式会社クリエイティブ テクノロジー 静電チャック装置におけるガス供給構造の製造方法及び静電チャック装置ガス供給構造並びに静電チャック装置
KR20100114037A (ko) 2007-12-20 2010-10-22 어플라이드 머티어리얼스, 인코포레이티드 향상된 가스 유동 분포를 가진 열 반응기
JP2009231401A (ja) 2008-03-21 2009-10-08 Tokyo Electron Ltd 載置台構造及び熱処理装置
TWI395272B (zh) * 2008-05-02 2013-05-01 Applied Materials Inc 用於旋轉基板之非徑向溫度控制系統
US8254767B2 (en) * 2008-08-29 2012-08-28 Applied Materials, Inc. Method and apparatus for extended temperature pyrometry
TWM478017U (zh) * 2013-09-05 2014-05-11 Sankitai Co Ltd 料件回吹分離裝置

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