JP2015510260A - 基板を処理する方法および装置 - Google Patents
基板を処理する方法および装置 Download PDFInfo
- Publication number
- JP2015510260A JP2015510260A JP2014552295A JP2014552295A JP2015510260A JP 2015510260 A JP2015510260 A JP 2015510260A JP 2014552295 A JP2014552295 A JP 2014552295A JP 2014552295 A JP2014552295 A JP 2014552295A JP 2015510260 A JP2015510260 A JP 2015510260A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- gas
- back side
- processing
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02301—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment in-situ cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Description
Mw×g=(Pfs−Pfb)×Aw
Claims (15)
- 処理チャンバ内に配置された基板を処理する方法であって、
前記基板を支持するように構成された基板支持リングと、前記基板の裏側の最も近くに配置された反射板とを有する処理チャンバ内に配置された基板上に処理を実行すること、
前記基板上に前記処理を実行している間、酸素を含むガスまたは窒素を含むガスのうちの一方のガスを含む第1のガスを、前記反射板内に配置された1つまたは複数の貫通穴を通して前記基板の裏側に供給すること、および
前記基板の上面の最も近くを第1の圧力、かつ前記基板の底面の最も近くを第2の圧力に前記処理チャンバを維持すること
を含み、前記第1の圧力が、処理中に前記基板支持リングから前記基板が外れるのを防ぐのに十分な大きさだけ前記第2の圧力よりも大きい
方法。 - 前記1つまたは複数の貫通穴のうちの1つまたは複数の貫通穴に真空を与えて、前記基板の前記裏側から離れる前記第1のガスの流れを生み出し、前記基板の前記裏側に加えられる圧力の量を低減させること
をさらに含む、請求項1に記載の方法。 - 前記第1の圧力が前記第2の圧力よりも少なくとも2トルだけ大きい、請求項1に記載の方法。
- 前記1つまたは複数の貫通穴が、リフトピンまたは温度センサのうちの少なくとも一方を収容するように構成された、請求項1ないし3のいずれか一項に記載の方法。
- 前記処理がアニール処理である、請求項1ないし3のいずれか一項に記載の方法。
- 前記基板の前記裏側に前記第1のガスを供給するのと同時に前記基板の表側に前記第1のガスを供給すること
をさらに含む、請求項1ないし3のいずれか一項に記載の方法。 - 前記第1のガスを供給することが、
前記第1のガスを第1の流量で供給すること、および
ある時間をかけて前記第1の流量を第2の流量まで増大させること
を含む、請求項1ないし3のいずれか一項に記載の方法。 - 前記第1のガスからプラズマを形成すること、および
前記基板の前記裏側を前記プラズマによって形成された励起種にさらすことによって、前記基板の前記裏側にキャッピング層を形成すること
をさらに含む、請求項1ないし3のいずれか一項に記載の方法。 - 前記第1のガスから前記プラズマを形成することが、
遠隔プラズマチャンバ内で前記プラズマを形成すること、および
前記プラズマを前記処理チャンバに供給すること
を含む、請求項8に記載の方法。 - 前記キャッピング層が、窒化物層または酸化物層のうちの一方の層である、請求項8に記載の方法。
- 命令が記憶されたコンピュータ可読媒体であって、前記命令が実行されたときに、基板を処理する方法を処理チャンバ内で実行させ、前記方法が、請求項1ないし3のいずれか一項に記載の方法であるコンピュータ可読媒体。
- 基板を処理する装置であって、
基板を支持するように構成された基板支持リングと、前記基板の裏側の最も近くに配置された反射板とを有する処理チャンバであり、前記反射板が複数の貫通穴を有する処理チャンバ
を備え、
前記反射板内に配置された前記複数の貫通穴のうちの少なくとも1つの貫通穴が、前記基板の裏面の最も近くのエリアに第1のガスを供給するための入口であり、
前記反射板内に配置された前記複数の貫通穴のうちの少なくとも1つの貫通穴が、前記基板の前記裏面から離れる前記ガスの流れを生み出すための出口である
装置。 - 前記入口に結合されたガス供給源と、
前記出口に結合された真空ポンプと
をさらに備える、請求項12に記載の装置。 - 前記基板のおもての面の最も近くのエリアに前記第1のガスを供給するために前記処理チャンバ内に配置された第2の入口
をさらに備える、請求項12または13に記載の装置。 - 前記複数の貫通穴のうちの少なくともいくつかの貫通穴内に配置された、リフトピンまたは温度センサのうちの少なくとも一方
をさらに備える、請求項12または13に記載の装置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261586186P | 2012-01-13 | 2012-01-13 | |
US61/586,186 | 2012-01-13 | ||
US13/737,350 US8980767B2 (en) | 2012-01-13 | 2013-01-09 | Methods and apparatus for processing a substrate |
US13/737,350 | 2013-01-09 | ||
PCT/US2013/021006 WO2013106552A1 (en) | 2012-01-13 | 2013-01-10 | Methods and apparatus for processing a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015510260A true JP2015510260A (ja) | 2015-04-02 |
JP2015510260A5 JP2015510260A5 (ja) | 2016-04-07 |
Family
ID=48780267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014552295A Pending JP2015510260A (ja) | 2012-01-13 | 2013-01-10 | 基板を処理する方法および装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8980767B2 (ja) |
JP (1) | JP2015510260A (ja) |
KR (3) | KR20200093702A (ja) |
CN (1) | CN107464751B (ja) |
TW (1) | TWI579922B (ja) |
WO (1) | WO2013106552A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6065366B2 (ja) * | 2012-01-30 | 2017-01-25 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
KR102535623B1 (ko) | 2013-11-12 | 2023-05-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 고온계 배경 제거 |
US9881788B2 (en) * | 2014-05-22 | 2018-01-30 | Lam Research Corporation | Back side deposition apparatus and applications |
CN106298581B (zh) * | 2015-05-13 | 2020-10-13 | 盛美半导体设备(上海)股份有限公司 | 光辐射加热刻蚀装置及方法 |
US10260149B2 (en) | 2016-04-28 | 2019-04-16 | Applied Materials, Inc. | Side inject nozzle design for processing chamber |
KR102528559B1 (ko) * | 2016-07-26 | 2023-05-04 | 삼성전자주식회사 | 대면적 기판 제조 장치 |
US10851457B2 (en) | 2017-08-31 | 2020-12-01 | Lam Research Corporation | PECVD deposition system for deposition on selective side of the substrate |
CN110119072B (zh) * | 2018-02-06 | 2021-05-14 | 志圣科技(广州)有限公司 | 曝光组件及曝光装置 |
KR20230037057A (ko) | 2019-08-16 | 2023-03-15 | 램 리써치 코포레이션 | 웨이퍼 내에서 차동 보우를 보상하기 위한 공간적으로 튜닝 가능한 증착 |
US20230238269A1 (en) * | 2022-01-21 | 2023-07-27 | Applied Materials, Inc. | Rotatable thermal processing chamber |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08255800A (ja) * | 1994-12-19 | 1996-10-01 | Applied Materials Inc | 基板温度測定のための方法及び装置 |
JPH10189469A (ja) * | 1996-12-03 | 1998-07-21 | Applied Materials Inc | 基板をガスにより支持する方法 |
JP2001102321A (ja) * | 1999-09-17 | 2001-04-13 | Applied Materials Inc | 半導体製造装置における基板加熱方法及び半導体製造装置 |
JP2001135635A (ja) * | 1999-06-22 | 2001-05-18 | Applied Materials Inc | 研磨されたハロゲンドープシリコンガラスの窒素処理 |
JP2001196324A (ja) * | 1999-07-08 | 2001-07-19 | Applied Materials Inc | 基板の熱処理 |
JP2002033314A (ja) * | 2000-02-10 | 2002-01-31 | Applied Materials Inc | Pecvdキャッピングモジュールを含む低誘電率誘電体処理のための方法及び一体型装置 |
JP2002057209A (ja) * | 2000-06-01 | 2002-02-22 | Tokyo Electron Ltd | 枚葉式処理装置および枚葉式処理方法 |
JP2002261087A (ja) * | 2001-02-27 | 2002-09-13 | Tokyo Electron Ltd | 基板処理装置 |
JP2003077851A (ja) * | 2001-08-28 | 2003-03-14 | Applied Materials Inc | 熱処理方法及び装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5267607A (en) * | 1991-05-28 | 1993-12-07 | Tokyo Electron Limited | Substrate processing apparatus |
US6465043B1 (en) * | 1996-02-09 | 2002-10-15 | Applied Materials, Inc. | Method and apparatus for reducing particle contamination in a substrate processing chamber |
US5960555A (en) * | 1996-07-24 | 1999-10-05 | Applied Materials, Inc. | Method and apparatus for purging the back side of a substrate during chemical vapor processing |
US5879128A (en) * | 1996-07-24 | 1999-03-09 | Applied Materials, Inc. | Lift pin and support pin apparatus for a processing chamber |
US6375748B1 (en) * | 1999-09-01 | 2002-04-23 | Applied Materials, Inc. | Method and apparatus for preventing edge deposition |
EP1297560A2 (en) * | 2000-07-06 | 2003-04-02 | Applied Materials, Inc. | Thermally processing a substrate |
US6521292B1 (en) * | 2000-08-04 | 2003-02-18 | Applied Materials, Inc. | Substrate support including purge ring having inner edge aligned to wafer edge |
US20040266123A1 (en) | 2002-05-08 | 2004-12-30 | Applied Materials, Inc. | Electron beam treatment of SixNy films |
JP4186536B2 (ja) * | 2002-07-18 | 2008-11-26 | 松下電器産業株式会社 | プラズマ処理装置 |
JP4765328B2 (ja) | 2004-04-16 | 2011-09-07 | 東京エレクトロン株式会社 | 被処理体の処理装置 |
US7860379B2 (en) * | 2007-01-15 | 2010-12-28 | Applied Materials, Inc. | Temperature measurement and control of wafer support in thermal processing chamber |
US8580078B2 (en) * | 2007-01-26 | 2013-11-12 | Lam Research Corporation | Bevel etcher with vacuum chuck |
US8057602B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
US8051548B2 (en) | 2007-09-06 | 2011-11-08 | Creative Technology Corporation | Method of manufacturing an electrostatic chuck |
KR20100114037A (ko) * | 2007-12-20 | 2010-10-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 향상된 가스 유동 분포를 가진 열 반응기 |
JP2009231401A (ja) | 2008-03-21 | 2009-10-08 | Tokyo Electron Ltd | 載置台構造及び熱処理装置 |
TWI395272B (zh) * | 2008-05-02 | 2013-05-01 | Applied Materials Inc | 用於旋轉基板之非徑向溫度控制系統 |
US8254767B2 (en) * | 2008-08-29 | 2012-08-28 | Applied Materials, Inc. | Method and apparatus for extended temperature pyrometry |
TWM478017U (zh) * | 2013-09-05 | 2014-05-11 | Sankitai Co Ltd | 料件回吹分離裝置 |
-
2013
- 2013-01-09 US US13/737,350 patent/US8980767B2/en active Active
- 2013-01-10 CN CN201610946323.9A patent/CN107464751B/zh active Active
- 2013-01-10 JP JP2014552295A patent/JP2015510260A/ja active Pending
- 2013-01-10 KR KR1020207021970A patent/KR20200093702A/ko active Application Filing
- 2013-01-10 WO PCT/US2013/021006 patent/WO2013106552A1/en active Application Filing
- 2013-01-10 KR KR2020207000049U patent/KR200496202Y1/ko active IP Right Grant
- 2013-01-10 TW TW102100951A patent/TWI579922B/zh active
- 2013-01-10 KR KR1020147022262A patent/KR20140121833A/ko active Application Filing
-
2015
- 2015-03-16 US US14/658,732 patent/US20150206721A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08255800A (ja) * | 1994-12-19 | 1996-10-01 | Applied Materials Inc | 基板温度測定のための方法及び装置 |
JP2007208287A (ja) * | 1994-12-19 | 2007-08-16 | Applied Materials Inc | 基板温度測定のための装置 |
JPH10189469A (ja) * | 1996-12-03 | 1998-07-21 | Applied Materials Inc | 基板をガスにより支持する方法 |
JP2001135635A (ja) * | 1999-06-22 | 2001-05-18 | Applied Materials Inc | 研磨されたハロゲンドープシリコンガラスの窒素処理 |
JP2001196324A (ja) * | 1999-07-08 | 2001-07-19 | Applied Materials Inc | 基板の熱処理 |
JP2001102321A (ja) * | 1999-09-17 | 2001-04-13 | Applied Materials Inc | 半導体製造装置における基板加熱方法及び半導体製造装置 |
JP2002033314A (ja) * | 2000-02-10 | 2002-01-31 | Applied Materials Inc | Pecvdキャッピングモジュールを含む低誘電率誘電体処理のための方法及び一体型装置 |
JP2002057209A (ja) * | 2000-06-01 | 2002-02-22 | Tokyo Electron Ltd | 枚葉式処理装置および枚葉式処理方法 |
JP2002261087A (ja) * | 2001-02-27 | 2002-09-13 | Tokyo Electron Ltd | 基板処理装置 |
JP2003077851A (ja) * | 2001-08-28 | 2003-03-14 | Applied Materials Inc | 熱処理方法及び装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20200093702A (ko) | 2020-08-05 |
CN107464751B (zh) | 2020-09-11 |
WO2013106552A1 (en) | 2013-07-18 |
KR200496202Y1 (ko) | 2022-11-29 |
KR20140121833A (ko) | 2014-10-16 |
US8980767B2 (en) | 2015-03-17 |
US20130183834A1 (en) | 2013-07-18 |
KR20200001978U (ko) | 2020-09-08 |
TW201335997A (zh) | 2013-09-01 |
TWI579922B (zh) | 2017-04-21 |
US20150206721A1 (en) | 2015-07-23 |
CN107464751A (zh) | 2017-12-12 |
CN104025280A (zh) | 2014-09-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2015510260A (ja) | 基板を処理する方法および装置 | |
US7700376B2 (en) | Edge temperature compensation in thermal processing particularly useful for SOI wafers | |
US8222574B2 (en) | Temperature measurement and control of wafer support in thermal processing chamber | |
US9640412B2 (en) | Apparatus and method for enhancing the cool down of radiatively heated substrates | |
US10211046B2 (en) | Substrate support ring for more uniform layer thickness | |
TWI615503B (zh) | 用於減少快速熱處理的污染之影響的設備 | |
WO2009122913A1 (ja) | 熱処理装置 | |
US20090298300A1 (en) | Apparatus and Methods for Hyperbaric Rapid Thermal Processing | |
EP1886339A1 (en) | Method and apparatus for hydrogenation of thin film silicon on glass | |
TWI570265B (zh) | Film forming apparatus, base, and film forming method | |
KR101799968B1 (ko) | 서셉터 처리 방법 및 서셉터 처리용 플레이트 | |
JP2012146741A (ja) | 半導体装置の製造方法および基板処理装置 | |
TWI492305B (zh) | 製造半導體裝置之方法及設備 | |
JP2012054408A (ja) | 基板処理装置及び被処理基板の製造方法 | |
JP2005259902A (ja) | 基板処理装置 | |
CN104025280B (zh) | 用于处理基板的方法和设备 | |
JP2004241565A (ja) | 基板処理装置 | |
TWI833760B (zh) | 摻雜基底的方法與用於摻雜基底的裝置 | |
JP2006303289A (ja) | 基板処理装置 | |
US20230317463A1 (en) | Methods, systems, and apparatus for processing substrates using one or more amorphous carbon hardmask layers | |
JP2023131971A (ja) | エッチング方法、および、エッチング装置 | |
JP2007051335A (ja) | Cvd装置 | |
JP2005012141A (ja) | 基板処理装置 | |
JP2006012985A (ja) | 基板処理装置 | |
JP2005259975A (ja) | 基板処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151210 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160217 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161115 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161117 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170209 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170411 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170707 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20171010 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180213 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20180221 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20180413 |