JP2015513609A5 - - Google Patents

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Publication number
JP2015513609A5
JP2015513609A5 JP2014557847A JP2014557847A JP2015513609A5 JP 2015513609 A5 JP2015513609 A5 JP 2015513609A5 JP 2014557847 A JP2014557847 A JP 2014557847A JP 2014557847 A JP2014557847 A JP 2014557847A JP 2015513609 A5 JP2015513609 A5 JP 2015513609A5
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JP
Japan
Prior art keywords
gas
sealing film
containing gas
nitrogen
depositing
Prior art date
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Application number
JP2014557847A
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English (en)
Japanese (ja)
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JP6082032B2 (ja
JP2015513609A (ja
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Publication date
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Priority claimed from PCT/US2013/026492 external-priority patent/WO2013123431A1/en
Publication of JP2015513609A publication Critical patent/JP2015513609A/ja
Publication of JP2015513609A5 publication Critical patent/JP2015513609A5/ja
Application granted granted Critical
Publication of JP6082032B2 publication Critical patent/JP6082032B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014557847A 2012-02-15 2013-02-15 封止膜を堆積するための方法 Active JP6082032B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261599364P 2012-02-15 2012-02-15
US61/599,364 2012-02-15
PCT/US2013/026492 WO2013123431A1 (en) 2012-02-15 2013-02-15 Method for depositing an encapsulating film

Publications (3)

Publication Number Publication Date
JP2015513609A JP2015513609A (ja) 2015-05-14
JP2015513609A5 true JP2015513609A5 (enExample) 2015-06-25
JP6082032B2 JP6082032B2 (ja) 2017-02-15

Family

ID=48945906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014557847A Active JP6082032B2 (ja) 2012-02-15 2013-02-15 封止膜を堆積するための方法

Country Status (6)

Country Link
US (1) US8901015B2 (enExample)
JP (1) JP6082032B2 (enExample)
KR (1) KR101539635B1 (enExample)
CN (1) CN104115300B (enExample)
TW (1) TWI506162B (enExample)
WO (1) WO2013123431A1 (enExample)

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KR101842586B1 (ko) * 2011-04-05 2018-03-28 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
US9299956B2 (en) * 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US9810963B2 (en) 2013-03-07 2017-11-07 Switch Materials, Inc. Seal and seal system for a layered device
KR102036327B1 (ko) * 2013-03-27 2019-11-27 삼성디스플레이 주식회사 유기발광장치 및 그 제조방법
US10254617B2 (en) * 2013-12-19 2019-04-09 Switch Materials Inc. Switchable objects and methods of manufacture
WO2015174318A1 (ja) 2014-05-16 2015-11-19 シャープ株式会社 封止フィルム、有機ｅｌ素子、及び有機ｅｌ表示装置
TWI545827B (zh) * 2014-05-23 2016-08-11 群創光電股份有限公司 有機發光二極體顯示面板
KR20160036722A (ko) * 2014-09-25 2016-04-05 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP6584162B2 (ja) * 2015-06-22 2019-10-02 東京エレクトロン株式会社 積層封止膜形成方法および形成装置
US10163859B2 (en) 2015-10-21 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Structure and formation method for chip package
US11751426B2 (en) * 2016-10-18 2023-09-05 Universal Display Corporation Hybrid thin film permeation barrier and method of making the same
US10546748B2 (en) * 2017-02-17 2020-01-28 Lam Research Corporation Tin oxide films in semiconductor device manufacturing
US20190097175A1 (en) * 2017-09-28 2019-03-28 Applied Materials, Inc. Thin film encapsulation scattering layer by pecvd
US10957543B2 (en) 2017-09-29 2021-03-23 Taiwan Semiconductor Manufacturing Co., Ltd. Device and method of dielectric layer
JP7407121B2 (ja) * 2018-04-09 2023-12-28 アプライド マテリアルズ インコーポレイテッド パターニング用途のためのカーボンハードマスク及び関連方法
CN118448237A (zh) 2018-05-03 2024-08-06 应用材料公司 用于基座的rf接地配置
US11180847B2 (en) * 2018-12-06 2021-11-23 Applied Materials, Inc. Atomic layer deposition coatings for high temperature ceramic components
CN118251042A (zh) * 2019-04-25 2024-06-25 应用材料公司 具有低折射率和低水蒸气穿透率的湿气阻挡膜
CN114365263A (zh) * 2019-09-10 2022-04-15 应用材料公司 用于显示封装应用的高密度等离子体cvd
CN111029479A (zh) * 2019-11-13 2020-04-17 武汉华星光电半导体显示技术有限公司 显示面板、显示装置以及显示面板的制造方法
KR102882467B1 (ko) * 2020-01-16 2025-11-05 에이에스엠 아이피 홀딩 비.브이. 고 종횡비 피처를 형성하는 방법
US11538677B2 (en) * 2020-09-01 2022-12-27 Applied Materials, Inc. Systems and methods for depositing high density and high tensile stress films
EP4295404B1 (en) * 2021-02-22 2024-09-18 Applied Materials, Inc. Apparatus, system and method for curing ink printed on a substrate
TWI782762B (zh) * 2021-10-21 2022-11-01 天虹科技股份有限公司 擴散機構及應用該擴散機構的薄膜沉積機台
TWI843325B (zh) * 2022-12-09 2024-05-21 元太科技工業股份有限公司 顯示裝置及其製作方法

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Publication number Priority date Publication date Assignee Title
US20090191342A1 (en) * 1999-10-25 2009-07-30 Vitex Systems, Inc. Method for edge sealing barrier films
US6743524B2 (en) 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
CN1259710C (zh) 2002-09-11 2006-06-14 联华电子股份有限公司 在低介电材料层与内连线间形成阻障层的方法
US7086918B2 (en) * 2002-12-11 2006-08-08 Applied Materials, Inc. Low temperature process for passivation applications
WO2006007313A2 (en) 2004-06-25 2006-01-19 Applied Materials, Inc. Improving water-barrier performance of an encapsulating film
US7220687B2 (en) * 2004-06-25 2007-05-22 Applied Materials, Inc. Method to improve water-barrier performance by changing film surface morphology
JP2007030387A (ja) * 2005-07-28 2007-02-08 Fujifilm Corp バリア性フィルム基板およびそれを用いた有機電界発光素子
US20080006819A1 (en) * 2006-06-19 2008-01-10 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
US7993700B2 (en) * 2007-03-01 2011-08-09 Applied Materials, Inc. Silicon nitride passivation for a solar cell
JP2009221541A (ja) * 2008-03-17 2009-10-01 Fujifilm Corp 無機層の真空成膜法、バリア性積層体、デバイスおよび光学部材
KR20100087514A (ko) * 2009-01-28 2010-08-05 한국산업기술대학교산학협력단 유기 전기 발광 다이오드의 제조장치 및 제조방법
KR101097321B1 (ko) * 2009-12-14 2011-12-23 삼성모바일디스플레이주식회사 유기 발광 장치 및 이의 제조 방법
KR101106173B1 (ko) * 2010-06-16 2012-01-20 한국기계연구원 유기태양전지용 다층박막봉지 및 이의 제조방법

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