JP2015216350A5 - - Google Patents

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Publication number
JP2015216350A5
JP2015216350A5 JP2014256186A JP2014256186A JP2015216350A5 JP 2015216350 A5 JP2015216350 A5 JP 2015216350A5 JP 2014256186 A JP2014256186 A JP 2014256186A JP 2014256186 A JP2014256186 A JP 2014256186A JP 2015216350 A5 JP2015216350 A5 JP 2015216350A5
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JP
Japan
Prior art keywords
metal layer
semiconductor element
semiconductor
bump
semiconductor device
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014256186A
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English (en)
Japanese (ja)
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JP6424610B2 (ja
JP2015216350A (ja
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Priority claimed from JP2014256186A external-priority patent/JP6424610B2/ja
Priority to JP2014256186A priority Critical patent/JP6424610B2/ja
Priority to PCT/JP2015/002071 priority patent/WO2015162872A1/en
Priority to KR1020167021519A priority patent/KR102370046B1/ko
Priority to KR1020237005687A priority patent/KR102619737B1/ko
Priority to US15/118,575 priority patent/US10600838B2/en
Priority to CN201580006909.0A priority patent/CN105981160B/zh
Priority to CN201811352193.1A priority patent/CN109637992B/zh
Priority to KR1020227006069A priority patent/KR20220030314A/ko
Priority to TW104112256A priority patent/TWI697074B/zh
Publication of JP2015216350A publication Critical patent/JP2015216350A/ja
Publication of JP2015216350A5 publication Critical patent/JP2015216350A5/ja
Publication of JP6424610B2 publication Critical patent/JP6424610B2/ja
Application granted granted Critical
Priority to US16/503,062 priority patent/US11476291B2/en
Priority to US17/939,796 priority patent/US20230005979A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014256186A 2014-04-23 2014-12-18 半導体装置、および製造方法 Active JP6424610B2 (ja)

Priority Applications (11)

Application Number Priority Date Filing Date Title
JP2014256186A JP6424610B2 (ja) 2014-04-23 2014-12-18 半導体装置、および製造方法
CN201811352193.1A CN109637992B (zh) 2014-04-23 2015-04-15 半导体装置及其制造方法
KR1020167021519A KR102370046B1 (ko) 2014-04-23 2015-04-15 반도체 장치 및 그 제조 방법
KR1020237005687A KR102619737B1 (ko) 2014-04-23 2015-04-15 반도체 장치 및 그 제조 방법
US15/118,575 US10600838B2 (en) 2014-04-23 2015-04-15 Semiconductor device and method of manufacturing thereof
CN201580006909.0A CN105981160B (zh) 2014-04-23 2015-04-15 半导体装置及其制造方法
PCT/JP2015/002071 WO2015162872A1 (en) 2014-04-23 2015-04-15 Semiconductor device and method of manufacturing thereof
KR1020227006069A KR20220030314A (ko) 2014-04-23 2015-04-15 반도체 장치 및 그 제조 방법
TW104112256A TWI697074B (zh) 2014-04-23 2015-04-16 半導體裝置及其製造方法
US16/503,062 US11476291B2 (en) 2014-04-23 2019-07-03 Semiconductor device and method of manufacturing thereof
US17/939,796 US20230005979A1 (en) 2014-04-23 2022-09-07 Semiconductor device and method of manufacturing thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014088804 2014-04-23
JP2014088804 2014-04-23
JP2014256186A JP6424610B2 (ja) 2014-04-23 2014-12-18 半導体装置、および製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018198181A Division JP6645555B2 (ja) 2014-04-23 2018-10-22 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2015216350A JP2015216350A (ja) 2015-12-03
JP2015216350A5 true JP2015216350A5 (enExample) 2017-03-23
JP6424610B2 JP6424610B2 (ja) 2018-11-21

Family

ID=53015851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014256186A Active JP6424610B2 (ja) 2014-04-23 2014-12-18 半導体装置、および製造方法

Country Status (6)

Country Link
US (3) US10600838B2 (enExample)
JP (1) JP6424610B2 (enExample)
KR (3) KR102619737B1 (enExample)
CN (2) CN105981160B (enExample)
TW (1) TWI697074B (enExample)
WO (1) WO2015162872A1 (enExample)

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