JP2014042050A5 - - Google Patents
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- Publication number
- JP2014042050A5 JP2014042050A5 JP2013214264A JP2013214264A JP2014042050A5 JP 2014042050 A5 JP2014042050 A5 JP 2014042050A5 JP 2013214264 A JP2013214264 A JP 2013214264A JP 2013214264 A JP2013214264 A JP 2013214264A JP 2014042050 A5 JP2014042050 A5 JP 2014042050A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- pad
- solder joint
- opening
- passivation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002161 passivation Methods 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 5
- 229920000642 polymer Polymers 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000001465 metallisation Methods 0.000 claims 2
- 150000004767 nitrides Chemical class 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013214264A JP2014042050A (ja) | 2013-10-11 | 2013-10-11 | ポストパッシベーション法を使用した高性能システムオンチップ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013214264A JP2014042050A (ja) | 2013-10-11 | 2013-10-11 | ポストパッシベーション法を使用した高性能システムオンチップ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001267522A Division JP5683765B2 (ja) | 2001-09-04 | 2001-09-04 | 集積回路チップ及びその形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014042050A JP2014042050A (ja) | 2014-03-06 |
| JP2014042050A5 true JP2014042050A5 (enExample) | 2014-04-17 |
Family
ID=50394010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013214264A Withdrawn JP2014042050A (ja) | 2013-10-11 | 2013-10-11 | ポストパッシベーション法を使用した高性能システムオンチップ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2014042050A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116705758A (zh) * | 2023-07-18 | 2023-09-05 | 江苏帝奥微电子股份有限公司 | 一种降低高速开关通道金属寄生电容金属结构及制备工艺 |
-
2013
- 2013-10-11 JP JP2013214264A patent/JP2014042050A/ja not_active Withdrawn
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