JP2015216332A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015216332A5 JP2015216332A5 JP2014105400A JP2014105400A JP2015216332A5 JP 2015216332 A5 JP2015216332 A5 JP 2015216332A5 JP 2014105400 A JP2014105400 A JP 2014105400A JP 2014105400 A JP2014105400 A JP 2014105400A JP 2015216332 A5 JP2015216332 A5 JP 2015216332A5
- Authority
- JP
- Japan
- Prior art keywords
- resist layer
- solder resist
- connection
- solder
- connecting electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 description 23
- 238000000034 method Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 2
- XYRRJTMWSSGQGR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO.OCC(CO)(CO)CO XYRRJTMWSSGQGR-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- WFKIYROFDWMUEO-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1.C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 WFKIYROFDWMUEO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014105400A JP6224520B2 (ja) | 2013-05-22 | 2014-05-21 | 配線基板の製造方法 |
Applications Claiming Priority (21)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013107932 | 2013-05-22 | ||
| JP2013107932 | 2013-05-22 | ||
| JP2013125178 | 2013-06-14 | ||
| JP2013125178 | 2013-06-14 | ||
| JP2013131839 | 2013-06-24 | ||
| JP2013131839 | 2013-06-24 | ||
| JP2013139706 | 2013-07-03 | ||
| JP2013139706 | 2013-07-03 | ||
| JP2013142482 | 2013-07-08 | ||
| JP2013142482 | 2013-07-08 | ||
| JP2013147430 | 2013-07-16 | ||
| JP2013147430 | 2013-07-16 | ||
| JP2013150824 | 2013-07-19 | ||
| JP2013150825 | 2013-07-19 | ||
| JP2013150824 | 2013-07-19 | ||
| JP2013150825 | 2013-07-19 | ||
| JP2014086392 | 2014-04-18 | ||
| JP2014086392 | 2014-04-18 | ||
| JP2014090220 | 2014-04-24 | ||
| JP2014090220 | 2014-04-24 | ||
| JP2014105400A JP6224520B2 (ja) | 2013-05-22 | 2014-05-21 | 配線基板の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017102666A Division JP6416323B2 (ja) | 2013-05-22 | 2017-05-24 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015216332A JP2015216332A (ja) | 2015-12-03 |
| JP2015216332A5 true JP2015216332A5 (enrdf_load_stackoverflow) | 2016-05-26 |
| JP6224520B2 JP6224520B2 (ja) | 2017-11-01 |
Family
ID=51933504
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014105400A Active JP6224520B2 (ja) | 2013-05-22 | 2014-05-21 | 配線基板の製造方法 |
| JP2017102666A Active JP6416323B2 (ja) | 2013-05-22 | 2017-05-24 | 配線基板の製造方法 |
| JP2018093701A Active JP6514807B2 (ja) | 2013-05-22 | 2018-05-15 | 配線基板の製造方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017102666A Active JP6416323B2 (ja) | 2013-05-22 | 2017-05-24 | 配線基板の製造方法 |
| JP2018093701A Active JP6514807B2 (ja) | 2013-05-22 | 2018-05-15 | 配線基板の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (3) | JP6224520B2 (enrdf_load_stackoverflow) |
| KR (1) | KR102076479B1 (enrdf_load_stackoverflow) |
| CN (4) | CN107969077B (enrdf_load_stackoverflow) |
| TW (1) | TWI625996B (enrdf_load_stackoverflow) |
| WO (1) | WO2014188945A1 (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6075643B2 (ja) * | 2013-11-28 | 2017-02-08 | 京セラ株式会社 | 配線基板の製造方法 |
| KR200491846Y1 (ko) | 2014-12-10 | 2020-06-17 | 미쓰비시 세이시 가부시키가이샤 | 레지스트층의 박막화 장치 |
| TWI675256B (zh) * | 2015-03-13 | 2019-10-21 | 日商三菱製紙股份有限公司 | 阻焊劑圖型之形成方法 |
| JP6656027B2 (ja) * | 2015-03-13 | 2020-03-04 | 三菱製紙株式会社 | ソルダーレジストパターンの形成方法 |
| KR102814782B1 (ko) | 2020-03-12 | 2025-05-30 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
| KR20210131149A (ko) * | 2020-04-23 | 2021-11-02 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
| KR20210154454A (ko) * | 2020-06-12 | 2021-12-21 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
| KR20210154450A (ko) * | 2020-06-12 | 2021-12-21 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
| US11551939B2 (en) | 2020-09-02 | 2023-01-10 | Qualcomm Incorporated | Substrate comprising interconnects embedded in a solder resist layer |
| US20240314937A1 (en) * | 2021-04-26 | 2024-09-19 | Lg Innotek Co., Ltd. | Circuit board |
| CN113517202A (zh) * | 2021-05-27 | 2021-10-19 | 日月光半导体(上海)有限公司 | 集成电路装置及其制造方法 |
| CN113950193B (zh) * | 2021-09-24 | 2024-09-10 | 上海富乐华半导体科技有限公司 | Dbc覆铜陶瓷基板上圆形半腐蚀沉孔的设计方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS346263B1 (enrdf_load_stackoverflow) | 1957-01-18 | 1959-07-18 | ||
| EP0377872A2 (de) * | 1989-01-09 | 1990-07-18 | Siemens Aktiengesellschaft | Verfahren zum Aufbringen einer Lötstoppabdeckung auf Leiterplatten |
| JPH05226505A (ja) | 1992-02-18 | 1993-09-03 | Ibiden Co Ltd | プリント配線板 |
| JPH0659449A (ja) * | 1992-08-06 | 1994-03-04 | Tamura Kaken Kk | 感光性樹脂組成物 |
| JPH0661647A (ja) * | 1992-08-07 | 1994-03-04 | Fujitsu Ltd | 薄膜回路基板の製造方法 |
| JP3395222B2 (ja) * | 1992-12-10 | 2003-04-07 | 松下電器産業株式会社 | プリント配線板の製造方法 |
| EP0817548B1 (en) * | 1996-01-11 | 2006-04-05 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| JP3856414B2 (ja) * | 1997-12-25 | 2006-12-13 | 日本ビクター株式会社 | プリント配線基板の製造方法及びプリント配線基板 |
| JP2001135919A (ja) * | 1999-11-08 | 2001-05-18 | Sumitomo Metal Electronics Devices Inc | プラスチックパッケージの製造方法 |
| JP3767676B2 (ja) * | 2000-09-12 | 2006-04-19 | 信越化学工業株式会社 | オルガノシロキサン系高分子化合物及び光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜 |
| KR100389314B1 (ko) * | 2001-07-18 | 2003-06-25 | 엘지전자 주식회사 | 도금인입선 없는 인쇄회로기판의 제조방법 |
| TWI312166B (en) * | 2001-09-28 | 2009-07-11 | Toppan Printing Co Ltd | Multi-layer circuit board, integrated circuit package, and manufacturing method for multi-layer circuit board |
| JP3883948B2 (ja) | 2002-10-16 | 2007-02-21 | 大日本印刷株式会社 | 多層配線基板およびフリップチップ方式の半導体パッケージ |
| CN101562953B (zh) * | 2003-02-13 | 2011-12-07 | 株式会社藤仓 | 多层基板及其制造方法 |
| CN1926930B (zh) * | 2004-03-03 | 2011-06-15 | 新光电气工业株式会社 | 电路板制造方法与电路板 |
| CN100459077C (zh) * | 2006-03-15 | 2009-02-04 | 日月光半导体制造股份有限公司 | 基板的制造方法 |
| JP4660826B2 (ja) * | 2006-08-18 | 2011-03-30 | 山栄化学株式会社 | レジストパターンの形成方法 |
| CN100555619C (zh) * | 2007-04-11 | 2009-10-28 | 全懋精密科技股份有限公司 | 基板表面处理结构及其制作方法 |
| KR100850243B1 (ko) * | 2007-07-26 | 2008-08-04 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| CN101364586B (zh) * | 2007-08-10 | 2010-06-23 | 全懋精密科技股份有限公司 | 封装基板结构 |
| CN101170069A (zh) * | 2007-11-21 | 2008-04-30 | 健鼎（无锡）电子有限公司 | 高对准度的防焊层开口方法 |
| TWI355222B (en) * | 2008-12-18 | 2011-12-21 | Unimicron Technology Corp | Surface plating process for circuit substrate |
| CN101668390B (zh) * | 2009-09-22 | 2011-06-08 | 深圳崇达多层线路板有限公司 | 一种印刷线路板阻焊层的生产工艺 |
| JP5255545B2 (ja) * | 2009-09-29 | 2013-08-07 | 三菱製紙株式会社 | ソルダーレジストの形成方法 |
| CN102088822B (zh) * | 2009-12-08 | 2014-12-17 | 三星半导体(中国)研究开发有限公司 | 具有焊点自保护功能的pcb基板及其焊盘制作工艺 |
| JP5871396B2 (ja) * | 2010-09-28 | 2016-03-01 | 三菱製紙株式会社 | ソルダーレジストパターンの形成方法 |
| JP5830925B2 (ja) | 2011-05-10 | 2015-12-09 | 日立化成株式会社 | プリント配線板の製造方法 |
| JP2013041958A (ja) * | 2011-08-15 | 2013-02-28 | Hitachi Cable Ltd | プリント配線基板およびプリント配線基板の製造方法 |
| JP3182371U (ja) * | 2012-02-10 | 2013-03-21 | 三菱製紙株式会社 | レジスト層の薄膜化処理装置 |
| JP2014078551A (ja) * | 2012-10-09 | 2014-05-01 | Ngk Spark Plug Co Ltd | 配線基板、配線基板の製造方法 |
-
2014
- 2014-05-15 CN CN201711304405.4A patent/CN107969077B/zh active Active
- 2014-05-15 CN CN201711303988.9A patent/CN107979919B/zh active Active
- 2014-05-15 CN CN201480029187.6A patent/CN105210460B/zh active Active
- 2014-05-15 WO PCT/JP2014/062928 patent/WO2014188945A1/ja active Application Filing
- 2014-05-15 CN CN201711303986.XA patent/CN107969076B/zh active Active
- 2014-05-15 KR KR1020157030969A patent/KR102076479B1/ko active Active
- 2014-05-21 JP JP2014105400A patent/JP6224520B2/ja active Active
- 2014-05-22 TW TW103117893A patent/TWI625996B/zh active
-
2017
- 2017-05-24 JP JP2017102666A patent/JP6416323B2/ja active Active
-
2018
- 2018-05-15 JP JP2018093701A patent/JP6514807B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015216332A5 (enrdf_load_stackoverflow) | ||
| JP5771987B2 (ja) | 多層回路基板、絶縁シート、および多層回路基板を用いた半導体パッケージ | |
| CN100489048C (zh) | 半导体装置用粘接剂组合物及半导体装置用粘接片材 | |
| JP3559137B2 (ja) | 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム | |
| TW201513758A (zh) | 配線基板的製造方法 | |
| JP2013093613A (ja) | 埋め込み印刷回路基板の製造方法 | |
| JP4802987B2 (ja) | 接着フィルム | |
| JPWO2008123248A1 (ja) | 基材付絶縁シート、多層プリント配線板、半導体装置および多層プリント配線板の製造方法 | |
| KR20080082365A (ko) | 금속 코어를 사용한 ｐｃｂ, 그 제조방법 및 반도체 패키지제조방법 | |
| US8551819B2 (en) | Method for surface mounting using cleaning-free activated resinous composition | |
| JP6371513B2 (ja) | フレキシブルプリント配線板、およびその製造方法 | |
| JP2003142529A (ja) | 接着フィルム、それを用いた半導体パッケージまたは半導体装置、および半導体パッケージまたは半導体装置の製造方法 | |
| JP6768188B2 (ja) | 接着フィルム用接着剤組成物及びその製造方法 | |
| JP2006272886A (ja) | フレキシブル金属積層体およびフレキシブルプリント基板 | |
| KR20170029297A (ko) | 부품 실장용 홈을 포함하는 다층인쇄회로기판 및 그의 제조방법 | |
| JP2009094217A (ja) | 半導体装置、半導体装置用プリント配線板及び銅張積層板 | |
| KR20110139599A (ko) | 내열성과 접착력이 우수한 열경화성 양면 접착 필름 | |
| JP2007126498A (ja) | 絶縁樹脂接着シートの製造方法及び絶縁樹脂接着シートを用いたプリント配線板の製造方法 | |
| JP2007238769A (ja) | 樹脂組成物、樹脂フィルム、カバーレイフィルムおよびフレキシブルプリント回路板 | |
| JP5934057B2 (ja) | プリント回路基板 | |
| JP7716593B2 (ja) | 熱硬化性樹脂組成物、樹脂シート、放熱板、樹脂シートの製造方法、及び放熱板の製造方法 | |
| JP2011040699A (ja) | プリント基板及びその製造方法 | |
| JP4415920B2 (ja) | 接着フィルム、それを用いた半導体パッケージまたは半導体装置、および半導体パッケージまたは半導体装置の製造方法 | |
| JP5105030B2 (ja) | 基板、半導体装置および基板の製造方法 | |
| US11688668B2 (en) | Component carrier with low shrinkage dielectric material |