TWI625996B - 配線基板的製造方法 - Google Patents

配線基板的製造方法 Download PDF

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Publication number
TWI625996B
TWI625996B TW103117893A TW103117893A TWI625996B TW I625996 B TWI625996 B TW I625996B TW 103117893 A TW103117893 A TW 103117893A TW 103117893 A TW103117893 A TW 103117893A TW I625996 B TWI625996 B TW I625996B
Authority
TW
Taiwan
Prior art keywords
solder resist
resist layer
manufacturing
thickness
exposed
Prior art date
Application number
TW103117893A
Other languages
English (en)
Chinese (zh)
Other versions
TW201509256A (zh
Inventor
豊田裕二
後閑寬彥
川合宣行
中川邦弘
Original Assignee
三菱製紙股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱製紙股份有限公司 filed Critical 三菱製紙股份有限公司
Publication of TW201509256A publication Critical patent/TW201509256A/zh
Application granted granted Critical
Publication of TWI625996B publication Critical patent/TWI625996B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Ceramic Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW103117893A 2013-05-22 2014-05-22 配線基板的製造方法 TWI625996B (zh)

Applications Claiming Priority (20)

Application Number Priority Date Filing Date Title
JP2013107932 2013-05-22
JP2013-107932 2013-05-22
JP2013-125178 2013-06-14
JP2013125178 2013-06-14
JP2013131839 2013-06-24
JP2013-131839 2013-06-24
JP2013139706 2013-07-03
JP2013-139706 2013-07-03
JP2013142482 2013-07-08
JP2013-142482 2013-07-08
JP2013-147430 2013-07-16
JP2013147430 2013-07-16
JP2013150825 2013-07-19
JP2013150824 2013-07-19
JP2013-150825 2013-07-19
JP2013-150824 2013-07-19
JP2014086392 2014-04-18
JP2014-086392 2014-04-18
JP2014090220 2014-04-24
JP2014-090220 2014-04-24

Publications (2)

Publication Number Publication Date
TW201509256A TW201509256A (zh) 2015-03-01
TWI625996B true TWI625996B (zh) 2018-06-01

Family

ID=51933504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103117893A TWI625996B (zh) 2013-05-22 2014-05-22 配線基板的製造方法

Country Status (5)

Country Link
JP (3) JP6224520B2 (enrdf_load_stackoverflow)
KR (1) KR102076479B1 (enrdf_load_stackoverflow)
CN (4) CN107969077B (enrdf_load_stackoverflow)
TW (1) TWI625996B (enrdf_load_stackoverflow)
WO (1) WO2014188945A1 (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
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JP6075643B2 (ja) * 2013-11-28 2017-02-08 京セラ株式会社 配線基板の製造方法
KR200491846Y1 (ko) 2014-12-10 2020-06-17 미쓰비시 세이시 가부시키가이샤 레지스트층의 박막화 장치
TWI675256B (zh) * 2015-03-13 2019-10-21 日商三菱製紙股份有限公司 阻焊劑圖型之形成方法
JP6656027B2 (ja) * 2015-03-13 2020-03-04 三菱製紙株式会社 ソルダーレジストパターンの形成方法
KR102814782B1 (ko) 2020-03-12 2025-05-30 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR20210131149A (ko) * 2020-04-23 2021-11-02 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR20210154454A (ko) * 2020-06-12 2021-12-21 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR20210154450A (ko) * 2020-06-12 2021-12-21 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
US11551939B2 (en) 2020-09-02 2023-01-10 Qualcomm Incorporated Substrate comprising interconnects embedded in a solder resist layer
US20240314937A1 (en) * 2021-04-26 2024-09-19 Lg Innotek Co., Ltd. Circuit board
CN113517202A (zh) * 2021-05-27 2021-10-19 日月光半导体(上海)有限公司 集成电路装置及其制造方法
CN113950193B (zh) * 2021-09-24 2024-09-10 上海富乐华半导体科技有限公司 Dbc覆铜陶瓷基板上圆形半腐蚀沉孔的设计方法

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TW200906245A (en) * 2007-07-26 2009-02-01 Samsung Electro Mech Printed circuit board and manufacturing method thereof
TW201026188A (en) * 2008-12-18 2010-07-01 Unimicron Technology Corp Surface plating process for circuit substrate
JP2011077191A (ja) * 2009-09-29 2011-04-14 Mitsubishi Paper Mills Ltd ソルダーレジストの形成方法
CN103109588A (zh) * 2010-09-28 2013-05-15 三菱制纸株式会社 阻焊图案的形成方法

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TW200906245A (en) * 2007-07-26 2009-02-01 Samsung Electro Mech Printed circuit board and manufacturing method thereof
TW201026188A (en) * 2008-12-18 2010-07-01 Unimicron Technology Corp Surface plating process for circuit substrate
JP2011077191A (ja) * 2009-09-29 2011-04-14 Mitsubishi Paper Mills Ltd ソルダーレジストの形成方法
CN103109588A (zh) * 2010-09-28 2013-05-15 三菱制纸株式会社 阻焊图案的形成方法

Also Published As

Publication number Publication date
WO2014188945A1 (ja) 2014-11-27
KR102076479B1 (ko) 2020-02-12
JP2017183744A (ja) 2017-10-05
CN107969076B (zh) 2020-04-28
CN107979919B (zh) 2020-07-10
CN107969077A (zh) 2018-04-27
CN105210460A (zh) 2015-12-30
JP2018139318A (ja) 2018-09-06
TW201509256A (zh) 2015-03-01
JP6514807B2 (ja) 2019-05-15
CN107969076A (zh) 2018-04-27
JP6416323B2 (ja) 2018-10-31
KR20160013007A (ko) 2016-02-03
CN105210460B (zh) 2019-01-11
CN107979919A (zh) 2018-05-01
CN107969077B (zh) 2020-02-18
JP6224520B2 (ja) 2017-11-01
JP2015216332A (ja) 2015-12-03

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