JP6224520B2 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP6224520B2
JP6224520B2 JP2014105400A JP2014105400A JP6224520B2 JP 6224520 B2 JP6224520 B2 JP 6224520B2 JP 2014105400 A JP2014105400 A JP 2014105400A JP 2014105400 A JP2014105400 A JP 2014105400A JP 6224520 B2 JP6224520 B2 JP 6224520B2
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JP
Japan
Prior art keywords
resist layer
solder resist
thickness
exposed
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014105400A
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English (en)
Japanese (ja)
Other versions
JP2015216332A5 (enrdf_load_stackoverflow
JP2015216332A (ja
Inventor
豊田　裕二
裕二 豊田
寛彦 後閑
寛彦 後閑
川合　宣行
宣行 川合
中川　邦弘
邦弘 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Paper Mills Ltd
Original Assignee
Mitsubishi Paper Mills Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Mitsubishi Paper Mills Ltd filed Critical Mitsubishi Paper Mills Ltd
Priority to JP2014105400A priority Critical patent/JP6224520B2/ja
Publication of JP2015216332A publication Critical patent/JP2015216332A/ja
Publication of JP2015216332A5 publication Critical patent/JP2015216332A5/ja
Application granted granted Critical
Publication of JP6224520B2 publication Critical patent/JP6224520B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Ceramic Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2014105400A 2013-05-22 2014-05-21 配線基板の製造方法 Active JP6224520B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014105400A JP6224520B2 (ja) 2013-05-22 2014-05-21 配線基板の製造方法

Applications Claiming Priority (21)

Application Number Priority Date Filing Date Title
JP2013107932 2013-05-22
JP2013107932 2013-05-22
JP2013125178 2013-06-14
JP2013125178 2013-06-14
JP2013131839 2013-06-24
JP2013131839 2013-06-24
JP2013139706 2013-07-03
JP2013139706 2013-07-03
JP2013142482 2013-07-08
JP2013142482 2013-07-08
JP2013147430 2013-07-16
JP2013147430 2013-07-16
JP2013150824 2013-07-19
JP2013150825 2013-07-19
JP2013150824 2013-07-19
JP2013150825 2013-07-19
JP2014086392 2014-04-18
JP2014086392 2014-04-18
JP2014090220 2014-04-24
JP2014090220 2014-04-24
JP2014105400A JP6224520B2 (ja) 2013-05-22 2014-05-21 配線基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017102666A Division JP6416323B2 (ja) 2013-05-22 2017-05-24 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2015216332A JP2015216332A (ja) 2015-12-03
JP2015216332A5 JP2015216332A5 (enrdf_load_stackoverflow) 2016-05-26
JP6224520B2 true JP6224520B2 (ja) 2017-11-01

Family

ID=51933504

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2014105400A Active JP6224520B2 (ja) 2013-05-22 2014-05-21 配線基板の製造方法
JP2017102666A Active JP6416323B2 (ja) 2013-05-22 2017-05-24 配線基板の製造方法
JP2018093701A Active JP6514807B2 (ja) 2013-05-22 2018-05-15 配線基板の製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2017102666A Active JP6416323B2 (ja) 2013-05-22 2017-05-24 配線基板の製造方法
JP2018093701A Active JP6514807B2 (ja) 2013-05-22 2018-05-15 配線基板の製造方法

Country Status (5)

Country Link
JP (3) JP6224520B2 (enrdf_load_stackoverflow)
KR (1) KR102076479B1 (enrdf_load_stackoverflow)
CN (4) CN107969077B (enrdf_load_stackoverflow)
TW (1) TWI625996B (enrdf_load_stackoverflow)
WO (1) WO2014188945A1 (enrdf_load_stackoverflow)

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TWI675256B (zh) * 2015-03-13 2019-10-21 日商三菱製紙股份有限公司 阻焊劑圖型之形成方法
JP6656027B2 (ja) * 2015-03-13 2020-03-04 三菱製紙株式会社 ソルダーレジストパターンの形成方法
KR102814782B1 (ko) 2020-03-12 2025-05-30 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR20210131149A (ko) * 2020-04-23 2021-11-02 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR20210154454A (ko) * 2020-06-12 2021-12-21 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR20210154450A (ko) * 2020-06-12 2021-12-21 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
US11551939B2 (en) 2020-09-02 2023-01-10 Qualcomm Incorporated Substrate comprising interconnects embedded in a solder resist layer
US20240314937A1 (en) * 2021-04-26 2024-09-19 Lg Innotek Co., Ltd. Circuit board
CN113517202A (zh) * 2021-05-27 2021-10-19 日月光半导体(上海)有限公司 集成电路装置及其制造方法
CN113950193B (zh) * 2021-09-24 2024-09-10 上海富乐华半导体科技有限公司 Dbc覆铜陶瓷基板上圆形半腐蚀沉孔的设计方法

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JP5830925B2 (ja) 2011-05-10 2015-12-09 日立化成株式会社 プリント配線板の製造方法
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Also Published As

Publication number Publication date
WO2014188945A1 (ja) 2014-11-27
KR102076479B1 (ko) 2020-02-12
JP2017183744A (ja) 2017-10-05
CN107969076B (zh) 2020-04-28
CN107979919B (zh) 2020-07-10
CN107969077A (zh) 2018-04-27
CN105210460A (zh) 2015-12-30
JP2018139318A (ja) 2018-09-06
TW201509256A (zh) 2015-03-01
JP6514807B2 (ja) 2019-05-15
CN107969076A (zh) 2018-04-27
JP6416323B2 (ja) 2018-10-31
KR20160013007A (ko) 2016-02-03
CN105210460B (zh) 2019-01-11
CN107979919A (zh) 2018-05-01
TWI625996B (zh) 2018-06-01
CN107969077B (zh) 2020-02-18
JP2015216332A (ja) 2015-12-03

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