JP2015135484A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2015135484A JP2015135484A JP2014255803A JP2014255803A JP2015135484A JP 2015135484 A JP2015135484 A JP 2015135484A JP 2014255803 A JP2014255803 A JP 2014255803A JP 2014255803 A JP2014255803 A JP 2014255803A JP 2015135484 A JP2015135484 A JP 2015135484A
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Images
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- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1675—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
- G06F1/1677—Miscellaneous details related to the relative movement between the different enclosures or enclosure parts for detecting open or closed state or particular intermediate positions assumed by movable parts of the enclosure, e.g. detection of display lid position with respect to main body in a laptop, detection of opening of the cover of battery compartment
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
- H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K50/80—Constructional details
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- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
【解決手段】可撓性を有する表示パネルと、表示パネルの第1の領域を支持する第1の筐体と、表示パネルの第2の領域を支持する第2の筐体と、第1の筐体に固着された可撓性を有する基材とを有し、表示パネルは、第1の領域と第2の領域とが略同一平面に位置する展開状態と、第1の領域と第2の領域とが重なって位置する折り畳み状態とに変形可能であり、第2の筐体は、可撓性を有する基材の一部が摺動可能な溝部を有し、展開状態において、可撓性を有する基材の一部は溝部に挿入され、折り畳み状態への変形動作において、溝部に挿入された可撓性を有する基材の少なくとも一部が引き出される半導体装置を提供する。
【選択図】図1
Description
本実施の形態では、本発明の一態様の半導体装置について図1乃至図5を用いて説明する。本発明の一態様の半導体装置は、複数の筐体に支持された可撓性を有する表示パネルを有する。また、該表示パネルは、異なる筐体に支持された領域同士が略同一平面に位置する展開状態と、異なる筐体に支持された領域が互いに重なるように位置する折り畳み状態と、に変形することができる。以下では、2つの筐体に支持された可撓性の表示パネルを備え、該2つの筐体の間で表示パネルを湾曲させることにより、展開された状態(展開状態)と2つ折りに折りたたんだ状態(折り畳み状態)とに変形可能な半導体装置を例に挙げて説明する。
本実施の形態では、本発明の一態様の半導体装置に適用可能な可撓性を有する表示パネルの一例としてEL素子を用いたアクティブマトリクス型の表示パネルを図7乃至図12を用いて説明する。なお、表示パネルとしては、EL素子を有する表示パネルのみならず、液晶素子、電気泳動素子などの表示素子を含む表示パネルを適用してもよい。
図7(A)に可撓性を有する表示パネルの平面図を示し、図7(A)における一点鎖線A4−B4間の断面図の一例を図7(B)に示す。
図8(A)に表示パネルにおける光取り出し部1104の別の例を示す。図8(A)の表示パネルは、タッチ操作が可能な表示パネルである。
図8(B)に表示パネルにおける光取り出し部1104の別の例を示す。図8(B)の表示パネルは、タッチ操作が可能な表示パネルである。
図9(A)に表示パネルの別の例を示す。図9(A)の表示パネルは、タッチ操作が可能な表示パネルである。
図9(B)に表示パネルの別の例を示す。図9(B)の表示パネルは、タッチ操作が可能な表示パネルである。
図10(A)に表示パネルにおける光取り出し部1104の別の例を示す。
図10(B)に表示パネルの別の例を示す。
次に、表示パネルに用いることができる材料等を説明する。なお、本実施の形態で先に説明した構成については説明を省略する。
表示パネルの作製方法を図11及び図12を用いて例示する。ここでは、具体例1(図7(B))の構成の表示パネルを例に挙げて説明する。
本実施の形態では、本発明の一態様の表示装置が適用された電子機器の例について、図面を参照して説明する。
102 表示パネル
103 筐体
104 筐体
104a 筐体
104b 筐体
105 溝部
105a 溝部
105b 溝部
105c 溝部
106 筐体
106a 筐体
106b 筐体
107 アンカー部
108a 基材
108b 基材
109a 基材
110 領域
111 接着層
111a 接着層
112 領域
113 接着層
114 接着層
117a 基材
117b 基材
118a 基材
118b 基材
120 半導体装置
130a 弾性体
130b 弾性体
130c 弾性体
130d 弾性体
132 FPC
140 半導体装置
160 領域
170 領域
172 領域
174 領域
176 領域
178 領域
180 半導体装置
182 領域
184 領域
1101 素子層
1103 基板
1104 光取り出し部
1105 接着層
1106 駆動回路部
1108 FPC
1108a FPC
1108b FPC
1156 導電層
1157 導電層
1201 基板
1202 基板
1203 接着層
1205 絶縁層
1207 絶縁層
1208 導電層
1209 絶縁層
1209a 絶縁層
1209b 絶縁層
1211 絶縁層
1212 導電層
1213 封止層
1215 接続体
1215a 接続体
1215b 接続体
1217 スペーサー
1230 発光素子
1231 下部電極
1233 EL層
1235 上部電極
1240 トランジスタ
1250 受光素子
1255 絶縁層
1257 遮光層
1259 着色層
1261 絶縁層
1270 導電層
1271 p型半導体層
1272 導電層
1273 i型半導体層
1274 導電層
1275 n型半導体層
1276 絶縁層
1278 絶縁層
1280 導電層
1281 導電層
1283 導電層
1291 絶縁層
1292 導電性粒子
1293 絶縁層
1294 導電層
1295 絶縁層
1296 導電層
1301 作製基板
1303 剥離層
1305 作製基板
1307 剥離層
1310a 導電層
1310b 導電層
9600 タブレット型端末
9625 スイッチ
9626 スイッチ
9627 電源スイッチ
9628 操作スイッチ
9629 留め具
9630 筐体
9630a 筐体
9630b 筐体
9631 表示部
9632 タッチセンサ領域
9633 太陽電池
9634 充放電制御回路
9635 バッテリー
9636 DCDCコンバータ
9637 コンバータ
9638 操作キー
9639 基材
Claims (5)
- 可撓性を有する表示パネルと、
前記表示パネルの第1の領域を支持する第1の筐体と、
前記表示パネルの第2の領域を支持する第2の筐体と、
前記第1の筐体に固着された可撓性を有する基材とを有し、
前記表示パネルは、前記第1の領域と前記第2の領域とが略同一平面に位置する展開状態と、前記第1の領域と前記第2の領域とが重なって位置する折り畳み状態とに変形可能であり、
前記第2の筐体は、前記可撓性を有する基材の一部が摺動可能な溝部を有し、
前記展開状態では、前記可撓性を有する基材の一部が前記溝部に挿入され、
前記折り畳み状態への変形動作において、前記溝部に挿入された前記可撓性を有する基材の少なくとも一部が引き出されることを特徴とする半導体装置。 - 請求項1において、
前記折り畳み状態において、前記可撓性を有する基材は、曲面を有するように折り曲げられることを特徴とする半導体装置。 - 可撓性を有する表示パネルと、
前記表示パネルの第1の領域を支持する第1の筐体と、
前記表示パネルの第2の領域を支持する第2の筐体と、
前記第1の筐体に固着された第1の可撓性を有する基材と、
前記第1の筐体に固着された第2の可撓性を有する基材とを有し、
前記表示パネルは、前記第1の領域と前記第2の領域とが略同一平面に位置する展開状態と、前記第1の領域と前記第2の領域とが重なって位置する折り畳み状態とに変形可能であり、
前記第1の可撓性を有する基材は、前記表示パネルの表示面側に設けられ、
前記第2の可撓性を有する基材は、前記表示パネルの表示面と逆側に設けられ、
前記第2の筐体は、前記第1の可撓性を有する基材の一部が摺動可能な第1の溝部と、前記第2の可撓性を有する基材の一部が摺動可能な第2の溝部とを有し、
前記展開状態において、前記第1の可撓性を有する基材の一部は前記第1の溝部に挿入され、且つ、前記第2の可撓性を有する基材の一部は前記第2の溝部に挿入され、
前記折り畳み状態への変形動作において、前記第1の溝部に挿入された前記第1の可撓性を有する基材の少なくとも一部が引き出され、且つ、前記第2の溝部に挿入された前記第2の可撓性を有する基材の少なくとも一部が引き出されることを特徴とする半導体装置。 - 可撓性を有する表示パネルと、
前記表示パネルの第1の領域を支持する第1の筐体と、
前記表示パネルの第2の領域を支持する第2の筐体と、
前記第1の筐体に固着された第1の可撓性を有する基材と、
前記第2の筐体に固着された第2の可撓性を有する基材とを有し、
前記表示パネルは、前記第1の領域と前記第2の領域とが略同一平面に位置する展開状態と、前記第1の領域と前記第2の領域とが重なって位置する折り畳み状態とに変形可能であり、
前記第1の可撓性を有する基材は、前記表示パネルの表示面側に設けられ、
前記第2の可撓性を有する基材は、前記表示パネルの表示面と逆側に設けられ、
前記第1の筐体は、前記第2の可撓性を有する基材の一部が摺動可能な第1の溝部を有し、
前記第2の筐体は、前記第1の可撓性を有する基材の一部が摺動可能な第2の溝部を有し、
前記展開状態において、前記第1の可撓性を有する基材の一部は前記第2の溝部に挿入され、且つ、前記第2の可撓性を有する基材の一部は前記第1の溝部に挿入され、
前記折り畳み状態への変形動作において、前記第2の溝部に挿入された前記第1の可撓性を有する基材の少なくとも一部が引き出され、且つ、前記第1の溝部に挿入された前記第2の可撓性を有する基材の少なくとも一部が引き出されることを特徴とする半導体装置。 - 請求項3又は4において、
前記折り畳み状態において、前記第1の可撓性を有する基材及び前記第2の可撓性を有する基材は、それぞれ曲面を有するように折り曲げられることを特徴とする半導体装置。
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2017142375A (ja) * | 2016-02-10 | 2017-08-17 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
WO2018016446A1 (ja) * | 2016-07-21 | 2018-01-25 | シャープ株式会社 | 有機el表示装置 |
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JP2021177254A (ja) * | 2016-04-28 | 2021-11-11 | 株式会社半導体エネルギー研究所 | 情報処理装置 |
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Families Citing this family (76)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI676125B (zh) * | 2013-11-28 | 2019-11-01 | 日商半導體能源研究所股份有限公司 | 電子裝置以及其驅動方法 |
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US9588549B2 (en) | 2014-02-28 | 2017-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
US10073571B2 (en) | 2014-05-02 | 2018-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Touch sensor and touch panel including capacitor |
JP6425114B2 (ja) | 2014-07-02 | 2018-11-21 | Tianma Japan株式会社 | 折り畳み式表示装置及び電気機器 |
KR20160025830A (ko) * | 2014-08-28 | 2016-03-09 | 삼성전자주식회사 | 전자 장치 |
KR20170075006A (ko) | 2014-10-28 | 2017-06-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 전자 장치 |
US10185363B2 (en) * | 2014-11-28 | 2019-01-22 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
KR20160064978A (ko) | 2014-11-28 | 2016-06-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치, 모듈, 표시 시스템, 및 전자 기기 |
US9933870B2 (en) * | 2015-03-17 | 2018-04-03 | Lg Display Co., Ltd. | Back plate member for flexible display, display apparatus including the same, and method of manufacturing the same |
KR102288846B1 (ko) * | 2015-04-07 | 2021-08-11 | 삼성디스플레이 주식회사 | 접이식 표시 장치 |
CN106790821B (zh) | 2015-07-13 | 2020-06-30 | Oppo广东移动通信有限公司 | 一种可分离滑动的柔性屏移动终端 |
CN104994192B (zh) * | 2015-07-13 | 2017-10-13 | 广东欧珀移动通信有限公司 | 柔性屏移动终端 |
CN104980544B (zh) | 2015-07-13 | 2016-10-26 | 广东欧珀移动通信有限公司 | 一种两端可折弯的柔性屏移动终端 |
US10485100B2 (en) | 2015-09-30 | 2019-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Circuit board and display system |
JP6446349B2 (ja) * | 2015-10-06 | 2018-12-26 | 株式会社ジャパンディスプレイ | 表示装置及び表示システム |
US9823093B2 (en) | 2015-11-06 | 2017-11-21 | Microsoft Technology Licensing, Llc | Folding angle sensing of a foldable device |
US10558265B2 (en) | 2015-12-11 | 2020-02-11 | Semiconductor Energy Laboratory Co., Ltd. | Input device and system of input device |
JP6625933B2 (ja) * | 2016-06-06 | 2019-12-25 | 株式会社ジャパンディスプレイ | 表示装置 |
US11243567B2 (en) * | 2016-07-13 | 2022-02-08 | Motorola Mobility Llc | Deformable electronic device and methods and systems for reconfiguring presentation data and actuation elements |
US10251056B2 (en) | 2016-07-13 | 2019-04-02 | Motorola Mobility Llc | Electronic device with gesture actuation of companion devices, and corresponding systems and methods |
US10878771B2 (en) | 2016-07-13 | 2020-12-29 | Motorola Mobility Llc | Deformable electronic device and methods and systems for display remediation to compensate performance degradation |
US10372892B2 (en) | 2016-07-13 | 2019-08-06 | Motorola Mobility Llc | Electronic device with gesture actuation of companion devices, and corresponding systems and methods |
KR102589751B1 (ko) * | 2016-07-26 | 2023-10-17 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102479081B1 (ko) * | 2016-07-28 | 2022-12-20 | 삼성전자주식회사 | 플랙시블 하우징 및 이를 포함하는 전자 장치 |
TWI729030B (zh) * | 2016-08-29 | 2021-06-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置及控制程式 |
JP2018049193A (ja) * | 2016-09-23 | 2018-03-29 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102568386B1 (ko) * | 2016-09-30 | 2023-08-21 | 삼성디스플레이 주식회사 | 터치 센서를 포함하는 표시 장치 |
KR102631840B1 (ko) | 2016-10-06 | 2024-01-31 | 삼성디스플레이 주식회사 | 확장형 표시 장치 |
KR20180079016A (ko) * | 2016-12-30 | 2018-07-10 | 엘지디스플레이 주식회사 | 폴더블 표시 장치 |
USD871397S1 (en) | 2017-01-03 | 2019-12-31 | Samsung Display Co., Ltd. | Display device |
CN106652798B (zh) * | 2017-01-16 | 2019-01-15 | 武汉华星光电技术有限公司 | 一种显示装置及其承载组件 |
CN106910427B (zh) * | 2017-02-23 | 2019-11-22 | 武汉华星光电技术有限公司 | 一种显示器及其柔性显示屏的平展方法 |
CN106847094B (zh) * | 2017-03-31 | 2019-09-17 | 上海天马微电子有限公司 | 一种柔性显示装置 |
WO2018214092A1 (zh) * | 2017-05-25 | 2018-11-29 | 深圳金立翔视效科技有限公司 | Led面罩、led弯折屏、led弯折屏的设计方法 |
CN107424519B (zh) * | 2017-06-26 | 2019-09-24 | 武汉天马微电子有限公司 | 柔性显示面板及柔性显示装置 |
CN107195253B (zh) * | 2017-07-26 | 2020-08-25 | 武汉天马微电子有限公司 | 可折叠柔性显示装置 |
KR102385727B1 (ko) * | 2017-09-14 | 2022-04-13 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6556812B2 (ja) * | 2017-11-28 | 2019-08-07 | Nissha株式会社 | ハードコート付フィルムタイプタッチセンサとこれを用いたフレキシブルディバイス |
CN108172127A (zh) * | 2017-12-15 | 2018-06-15 | 武汉华星光电半导体显示技术有限公司 | 柔性显示面板 |
CN108520701B (zh) * | 2018-01-22 | 2020-03-17 | 努比亚技术有限公司 | 一种可折叠屏的支撑保护机构及移动终端 |
US10916734B2 (en) * | 2018-02-07 | 2021-02-09 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing curved display, curved display and display |
KR102524340B1 (ko) * | 2018-02-22 | 2023-04-25 | 삼성디스플레이 주식회사 | 플렉서블 표시 장치 및 이의 제조 방법 |
CN108682302B (zh) * | 2018-04-28 | 2020-05-12 | 上海天马微电子有限公司 | 一种显示装置 |
CN108766249B (zh) * | 2018-08-09 | 2020-12-29 | 武汉天马微电子有限公司 | 一种可折叠的显示面板及可折叠显示装置 |
US11075347B2 (en) * | 2018-10-22 | 2021-07-27 | Lg Display Co., Ltd. | Flexible display device |
CN109545087A (zh) * | 2018-12-03 | 2019-03-29 | 武汉华星光电半导体显示技术有限公司 | 可折叠背板结构及其显示装置 |
US10642313B1 (en) * | 2018-12-13 | 2020-05-05 | Innolux Corporation | Foldable display device and operation method of electronic device |
CN109686267A (zh) * | 2019-02-26 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | Oled显示装置 |
KR20200110494A (ko) * | 2019-03-13 | 2020-09-24 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치 제조 방법 |
CN110010007B (zh) * | 2019-04-25 | 2024-03-08 | 武汉华星光电半导体显示技术有限公司 | 柔性显示装置及显示设备 |
WO2020242036A1 (en) | 2019-05-31 | 2020-12-03 | Samsung Electronics Co., Ltd. | Foldable electronic device including display protection structure |
CN110265440A (zh) * | 2019-06-06 | 2019-09-20 | 惠州市华星光电技术有限公司 | 显示面板及其制作方法 |
CN113366927A (zh) * | 2019-07-15 | 2021-09-07 | 深圳市柔宇科技股份有限公司 | 折叠装置及电子设备 |
US11093262B2 (en) | 2019-07-29 | 2021-08-17 | Motorola Mobility Llc | Electronic devices and corresponding methods for switching between normal and privacy modes of operation |
US11243578B2 (en) | 2019-08-02 | 2022-02-08 | Dell Products L.P. | Gear synchronized dual axis pivot hinge |
US11024224B2 (en) | 2019-08-02 | 2021-06-01 | Dell Products L.P. | Information handling system flexible display operating condition monitoring and management |
US11586243B2 (en) | 2019-08-02 | 2023-02-21 | Dell Products L.P. | Information handling system flexible display rotational orientation monitoring and management |
US11294431B2 (en) | 2019-08-02 | 2022-04-05 | Dell Products L.P. | Synchronized dual axis pivot hinge |
US11113375B2 (en) | 2019-09-09 | 2021-09-07 | Motorola Mobility Llc | Electronic devices with proximity authentication and gaze actuation of companion electronic devices and corresponding methods |
CN111064829B (zh) * | 2019-10-29 | 2021-12-28 | 华为技术有限公司 | 一种显示装置及终端设备 |
CN111128026A (zh) * | 2019-12-30 | 2020-05-08 | 业成科技(成都)有限公司 | 耐弯折结构及显示面板 |
KR20210109086A (ko) * | 2020-02-26 | 2021-09-06 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20210116018A (ko) | 2020-03-17 | 2021-09-27 | 삼성전자주식회사 | 플렉서블 디스플레이를 보호하기 위한 보호 구조물을 포함하는 전자 장치 |
CN111524940A (zh) | 2020-04-26 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Oled显示屏及其制备方法 |
KR20210158462A (ko) * | 2020-06-23 | 2021-12-31 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
CN111911763B (zh) * | 2020-08-13 | 2022-05-24 | 京东方科技集团股份有限公司 | 柔性屏支撑结构及显示装置 |
KR20220088603A (ko) * | 2020-12-18 | 2022-06-28 | 삼성디스플레이 주식회사 | 전자 장치 |
KR20230091123A (ko) * | 2020-12-21 | 2023-06-22 | 엘지전자 주식회사 | 이동 단말기 |
KR20220093958A (ko) * | 2020-12-28 | 2022-07-05 | 엘지디스플레이 주식회사 | 표시 장치 |
JP7365490B2 (ja) * | 2021-01-27 | 2023-10-19 | サムスン エレクトロニクス カンパニー リミテッド | シーリング部材を含む電子装置 |
CN113053242B (zh) * | 2021-02-24 | 2022-07-12 | 合肥维信诺科技有限公司 | 一种柔性显示组件 |
CN113393772B (zh) * | 2021-06-28 | 2023-03-10 | 合肥维信诺科技有限公司 | 柔性屏支撑结构和柔性显示装置 |
KR20230097253A (ko) * | 2021-12-23 | 2023-07-03 | 삼성디스플레이 주식회사 | 폴더블 표시 장치 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10207389A (ja) * | 1997-01-20 | 1998-08-07 | Sony Corp | 画像表示端末 |
JP2001255514A (ja) * | 2000-03-13 | 2001-09-21 | Minolta Co Ltd | 液晶表示装置 |
JP2001255513A (ja) * | 2000-03-13 | 2001-09-21 | Minolta Co Ltd | 液晶表示装置 |
JP2006072115A (ja) * | 2004-09-03 | 2006-03-16 | Fuji Photo Film Co Ltd | 画像表示装置 |
JP2011018097A (ja) * | 2009-07-07 | 2011-01-27 | Seiko Epson Corp | 電子機器 |
JP2011022528A (ja) * | 2009-07-21 | 2011-02-03 | Seiko Epson Corp | 電気光学装置 |
JP2013174692A (ja) * | 2012-02-24 | 2013-09-05 | Sony Corp | 表示装置 |
JP2013242904A (ja) * | 2013-07-25 | 2013-12-05 | Seiko Epson Corp | 電子機器 |
Family Cites Families (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2001272828A2 (en) * | 2000-08-09 | 2002-03-04 | Si Han Kim | Case for portable display devices |
US7030551B2 (en) | 2000-08-10 | 2006-04-18 | Semiconductor Energy Laboratory Co., Ltd. | Area sensor and display apparatus provided with an area sensor |
JP2003109773A (ja) | 2001-07-27 | 2003-04-11 | Semiconductor Energy Lab Co Ltd | 発光装置、半導体装置およびそれらの作製方法 |
KR101033797B1 (ko) | 2003-01-15 | 2011-05-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박리 방법 및 그 박리 방법을 사용한 표시 장치의 제작 방법 |
KR101221428B1 (ko) * | 2004-07-20 | 2013-01-11 | 김시환 | 휴대용 표시장치 |
WO2006090434A1 (ja) | 2005-02-22 | 2006-08-31 | Fujifilm Corporation | 塑性変形を抑制する可撓性基材及び可撓性画像表示装置 |
TWI413152B (zh) | 2005-03-01 | 2013-10-21 | Semiconductor Energy Lab | 半導體裝置製造方法 |
JP2006287982A (ja) * | 2005-07-13 | 2006-10-19 | Columbus No Tamagotachi:Kk | フレキシブルディスプレイを備えた携帯型通信端末 |
JP5371341B2 (ja) | 2007-09-21 | 2013-12-18 | 株式会社半導体エネルギー研究所 | 電気泳動方式の表示装置 |
KR101588576B1 (ko) | 2008-07-10 | 2016-01-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 전자 기기 |
US8860632B2 (en) | 2008-09-08 | 2014-10-14 | Qualcomm Incorporated | Multi-panel device with configurable interface |
US8933874B2 (en) | 2008-09-08 | 2015-01-13 | Patrik N. Lundqvist | Multi-panel electronic device |
US9009984B2 (en) | 2008-09-08 | 2015-04-21 | Qualcomm Incorporated | Multi-panel electronic device |
US8866840B2 (en) | 2008-09-08 | 2014-10-21 | Qualcomm Incorporated | Sending a parameter based on screen size or screen resolution of a multi-panel electronic device to a server |
US8860765B2 (en) | 2008-09-08 | 2014-10-14 | Qualcomm Incorporated | Mobile device with an inclinometer |
US8947320B2 (en) | 2008-09-08 | 2015-02-03 | Qualcomm Incorporated | Method for indicating location and direction of a graphical user interface element |
US8803816B2 (en) | 2008-09-08 | 2014-08-12 | Qualcomm Incorporated | Multi-fold mobile device with configurable interface |
US8836611B2 (en) | 2008-09-08 | 2014-09-16 | Qualcomm Incorporated | Multi-panel device with configurable interface |
US8863038B2 (en) | 2008-09-08 | 2014-10-14 | Qualcomm Incorporated | Multi-panel electronic device |
KR101457563B1 (ko) * | 2008-11-11 | 2014-11-04 | 삼성전자주식회사 | 멀티 디스플레이 장치 |
KR101702329B1 (ko) | 2008-12-17 | 2017-02-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 전자 기기 |
CN102422338B (zh) | 2009-05-02 | 2015-04-01 | 株式会社半导体能源研究所 | 显示设备 |
KR20230133393A (ko) | 2009-05-02 | 2023-09-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
JP5584103B2 (ja) | 2009-12-04 | 2014-09-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9000442B2 (en) | 2010-01-20 | 2015-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device |
JP5852810B2 (ja) | 2010-08-26 | 2016-02-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US8558960B2 (en) | 2010-09-13 | 2013-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method for manufacturing the same |
US8647919B2 (en) | 2010-09-13 | 2014-02-11 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting display device and method for manufacturing the same |
KR102109009B1 (ko) | 2011-02-25 | 2020-05-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치를 사용한 전자 기기 |
KR101839615B1 (ko) * | 2011-04-14 | 2018-03-19 | 삼성전자주식회사 | 연성 표시부를 구비한 휴대용 통신 장치 |
US20120314399A1 (en) * | 2011-06-07 | 2012-12-13 | Microsoft Corporation | Flexible display foldable assembly |
US8787016B2 (en) * | 2011-07-06 | 2014-07-22 | Apple Inc. | Flexible display devices |
JP6181948B2 (ja) | 2012-03-21 | 2017-08-16 | 株式会社半導体エネルギー研究所 | 蓄電装置及び電気機器 |
JP2013251255A (ja) | 2012-05-04 | 2013-12-12 | Semiconductor Energy Lab Co Ltd | 発光装置の作製方法 |
KR102090062B1 (ko) | 2012-05-11 | 2020-03-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 전자 기기, 기억 매체, 프로그램, 및 표시 방법 |
KR101989940B1 (ko) | 2012-05-11 | 2019-06-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치의 제작 방법 |
US20130321373A1 (en) | 2012-05-31 | 2013-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, program, and recording medium |
TWI645578B (zh) | 2012-07-05 | 2018-12-21 | 半導體能源研究所股份有限公司 | 發光裝置及發光裝置的製造方法 |
KR102296378B1 (ko) | 2012-08-10 | 2021-09-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 전자 장치 |
KR102161078B1 (ko) | 2012-08-28 | 2020-09-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 그 제작 방법 |
TWI681233B (zh) | 2012-10-12 | 2020-01-01 | 日商半導體能源研究所股份有限公司 | 液晶顯示裝置、觸控面板及液晶顯示裝置的製造方法 |
WO2014129519A1 (en) | 2013-02-20 | 2014-08-28 | Semiconductor Energy Laboratory Co., Ltd. | Peeling method, semiconductor device, and peeling apparatus |
CN110364083B (zh) | 2013-03-07 | 2022-08-23 | 株式会社半导体能源研究所 | 显示装置和电子设备 |
JP6490901B2 (ja) | 2013-03-14 | 2019-03-27 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
TWI611582B (zh) | 2013-04-10 | 2018-01-11 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
KR102250061B1 (ko) | 2013-04-15 | 2021-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 |
KR102249715B1 (ko) | 2013-04-24 | 2021-05-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
WO2014175296A1 (en) | 2013-04-24 | 2014-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
KR102187752B1 (ko) | 2013-05-07 | 2020-12-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박리 방법 및 박리 장치 |
KR102020659B1 (ko) | 2013-06-03 | 2019-09-11 | 삼성디스플레이 주식회사 | 접이식 표시 장치 |
US10628103B2 (en) | 2013-06-07 | 2020-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Information processor and program |
US9927840B2 (en) | 2013-06-21 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Information processor for processing and displaying image data on a bendable display unit |
KR20230159623A (ko) | 2013-07-02 | 2023-11-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 데이터 처리 장치 |
US9818763B2 (en) | 2013-07-12 | 2017-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing display device |
WO2015005230A1 (en) | 2013-07-12 | 2015-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
TWI630595B (zh) | 2013-07-19 | 2018-07-21 | 半導體能源研究所股份有限公司 | 資料處理裝置 |
KR20160032099A (ko) | 2013-07-19 | 2016-03-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 정보 처리 장치 |
US9395070B2 (en) | 2013-07-19 | 2016-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Support of flexible component and light-emitting device |
TWI643056B (zh) | 2013-07-22 | 2018-12-01 | 日商半導體能源研究所股份有限公司 | 發光裝置 |
US9356049B2 (en) | 2013-07-26 | 2016-05-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device with a transistor on an outer side of a bent portion |
US9269914B2 (en) | 2013-08-01 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, electronic device, and lighting device |
CN113851093B (zh) | 2013-08-02 | 2023-10-10 | 株式会社半导体能源研究所 | 显示装置 |
CN109273622B (zh) | 2013-08-06 | 2021-03-12 | 株式会社半导体能源研究所 | 剥离方法 |
KR20150021000A (ko) | 2013-08-19 | 2015-02-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
US9377817B2 (en) | 2013-08-20 | 2016-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
CN105493169B (zh) | 2013-08-30 | 2020-11-10 | 株式会社半导体能源研究所 | 显示装置 |
KR102285804B1 (ko) | 2013-08-30 | 2021-08-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 적층의 가공 장치 및 가공 방법 |
KR102288238B1 (ko) | 2013-09-03 | 2021-08-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 |
TWI794098B (zh) | 2013-09-06 | 2023-02-21 | 日商半導體能源研究所股份有限公司 | 發光裝置以及發光裝置的製造方法 |
US9925749B2 (en) | 2013-09-06 | 2018-03-27 | Semiconductor Energy Laboratory Co., Ltd. | Bonding apparatus and stack body manufacturing apparatus |
TWI723271B (zh) | 2013-09-18 | 2021-04-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置、顯示裝置的驅動方法、程式以及儲存介質 |
US9981457B2 (en) | 2013-09-18 | 2018-05-29 | Semiconductor Emergy Laboratory Co., Ltd. | Manufacturing apparatus of stack |
US9269915B2 (en) | 2013-09-18 | 2016-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
TWI679575B (zh) | 2013-10-11 | 2019-12-11 | 日商半導體能源研究所股份有限公司 | 驅動可攜式資料處理裝置的方法 |
US9818325B2 (en) | 2013-11-01 | 2017-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Data processor and method for displaying data thereby |
JP6513929B2 (ja) | 2013-11-06 | 2019-05-15 | 株式会社半導体エネルギー研究所 | 剥離方法 |
US9430180B2 (en) | 2013-11-15 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd | Display panel and electronic device |
KR20210109668A (ko) | 2013-11-15 | 2021-09-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 데이터 처리 장치 |
US20150138699A1 (en) | 2013-11-15 | 2015-05-21 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
US9804405B2 (en) | 2013-11-27 | 2017-10-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and display device frame |
KR102315659B1 (ko) | 2013-11-27 | 2021-10-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
KR102239367B1 (ko) | 2013-11-27 | 2021-04-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 터치 패널 |
TWI676125B (zh) | 2013-11-28 | 2019-11-01 | 日商半導體能源研究所股份有限公司 | 電子裝置以及其驅動方法 |
TWI772144B (zh) | 2013-11-29 | 2022-07-21 | 日商半導體能源研究所股份有限公司 | 資料處理裝置及資料處理裝置的驅動方法 |
CN110134271A (zh) | 2013-12-02 | 2019-08-16 | 株式会社半导体能源研究所 | 电子装置 |
JP2015129917A (ja) | 2013-12-02 | 2015-07-16 | 株式会社半導体エネルギー研究所 | 情報処理装置 |
KR20150075367A (ko) | 2013-12-25 | 2015-07-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
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- 2014-12-15 US US14/570,471 patent/US9229481B2/en active Active
- 2014-12-18 JP JP2014255803A patent/JP6525577B2/ja active Active
-
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-
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-
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- 2022-05-25 JP JP2022084990A patent/JP2022113719A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10207389A (ja) * | 1997-01-20 | 1998-08-07 | Sony Corp | 画像表示端末 |
JP2001255514A (ja) * | 2000-03-13 | 2001-09-21 | Minolta Co Ltd | 液晶表示装置 |
JP2001255513A (ja) * | 2000-03-13 | 2001-09-21 | Minolta Co Ltd | 液晶表示装置 |
JP2006072115A (ja) * | 2004-09-03 | 2006-03-16 | Fuji Photo Film Co Ltd | 画像表示装置 |
JP2011018097A (ja) * | 2009-07-07 | 2011-01-27 | Seiko Epson Corp | 電子機器 |
JP2011022528A (ja) * | 2009-07-21 | 2011-02-03 | Seiko Epson Corp | 電気光学装置 |
JP2013174692A (ja) * | 2012-02-24 | 2013-09-05 | Sony Corp | 表示装置 |
JP2013242904A (ja) * | 2013-07-25 | 2013-12-05 | Seiko Epson Corp | 電子機器 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10652376B2 (en) | 2015-12-29 | 2020-05-12 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Mobile terminal |
JP2018538626A (ja) * | 2015-12-29 | 2018-12-27 | クワントン オーピーピーオー モバイル テレコミュニケーションズ コーポレイション リミテッド | モバイル端末 |
JP2017142375A (ja) * | 2016-02-10 | 2017-08-17 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
JP2021177254A (ja) * | 2016-04-28 | 2021-11-11 | 株式会社半導体エネルギー研究所 | 情報処理装置 |
WO2018016446A1 (ja) * | 2016-07-21 | 2018-01-25 | シャープ株式会社 | 有機el表示装置 |
US10726748B2 (en) | 2016-07-21 | 2020-07-28 | Sharp Kabushiki Kaisha | Organic EL display device |
KR20190067798A (ko) * | 2016-10-27 | 2019-06-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 정보 처리 장치, 표시 장치, 및 전자 기기 |
JPWO2018078487A1 (ja) * | 2016-10-27 | 2019-09-05 | 株式会社半導体エネルギー研究所 | 情報処理装置、表示装置および電子機器 |
KR102543857B1 (ko) * | 2016-10-27 | 2023-06-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 정보 처리 장치, 표시 장치, 및 전자 기기 |
JP2022003557A (ja) * | 2016-10-27 | 2022-01-11 | 株式会社半導体エネルギー研究所 | 情報処理装置 |
US11113995B2 (en) | 2016-10-27 | 2021-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Information processing device, display device, and electronic device |
WO2018078487A1 (ja) * | 2016-10-27 | 2018-05-03 | 株式会社半導体エネルギー研究所 | 情報処理装置、表示装置および電子機器 |
JP2018081186A (ja) * | 2016-11-16 | 2018-05-24 | 株式会社半導体エネルギー研究所 | 情報処理装置、表示装置および電子機器 |
WO2018179213A1 (ja) * | 2017-03-30 | 2018-10-04 | シャープ株式会社 | 表示装置およびその製造方法 |
KR102480254B1 (ko) | 2018-07-13 | 2022-12-21 | 엘지디스플레이 주식회사 | 폴더블 표시 장치 |
KR20200007504A (ko) * | 2018-07-13 | 2020-01-22 | 엘지디스플레이 주식회사 | 폴더블 표시 장치 |
WO2024014214A1 (ja) * | 2022-07-12 | 2024-01-18 | ソニーセミコンダクタソリューションズ株式会社 | 表示装置及び電子機器 |
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US20150177789A1 (en) | 2015-06-25 |
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US9952626B2 (en) | 2018-04-24 |
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