JP2015111729A5 - - Google Patents

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Publication number
JP2015111729A5
JP2015111729A5 JP2015032834A JP2015032834A JP2015111729A5 JP 2015111729 A5 JP2015111729 A5 JP 2015111729A5 JP 2015032834 A JP2015032834 A JP 2015032834A JP 2015032834 A JP2015032834 A JP 2015032834A JP 2015111729 A5 JP2015111729 A5 JP 2015111729A5
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JP
Japan
Prior art keywords
module
substrate
coating film
unusable
film forming
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JP2015032834A
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English (en)
Japanese (ja)
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JP5904294B2 (ja
JP2015111729A (ja
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Priority to JP2015032834A priority Critical patent/JP5904294B2/ja
Priority claimed from JP2015032834A external-priority patent/JP5904294B2/ja
Publication of JP2015111729A publication Critical patent/JP2015111729A/ja
Publication of JP2015111729A5 publication Critical patent/JP2015111729A5/ja
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Publication of JP5904294B2 publication Critical patent/JP5904294B2/ja
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JP2015032834A 2010-09-06 2015-02-23 基板処理装置及び基板処理方法 Active JP5904294B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015032834A JP5904294B2 (ja) 2010-09-06 2015-02-23 基板処理装置及び基板処理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010198888 2010-09-06
JP2010198888 2010-09-06
JP2015032834A JP5904294B2 (ja) 2010-09-06 2015-02-23 基板処理装置及び基板処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2011154043A Division JP2012080077A (ja) 2010-09-06 2011-07-12 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2015111729A JP2015111729A (ja) 2015-06-18
JP2015111729A5 true JP2015111729A5 (enExample) 2015-07-30
JP5904294B2 JP5904294B2 (ja) 2016-04-13

Family

ID=53526305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015032834A Active JP5904294B2 (ja) 2010-09-06 2015-02-23 基板処理装置及び基板処理方法

Country Status (1)

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JP (1) JP5904294B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024022025A (ja) * 2022-08-05 2024-02-16 株式会社荏原製作所 基板処理装置及びプログラム
KR20250140551A (ko) * 2023-01-27 2025-09-25 도쿄엘렉트론가부시키가이샤 기판 반송 방법, 기판 처리 장치 및 프로그램

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3273754B2 (ja) * 1997-12-15 2002-04-15 東京エレクトロン株式会社 塗布膜形成装置
JP2003318079A (ja) * 2002-04-19 2003-11-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP4812704B2 (ja) * 2007-07-10 2011-11-09 東京エレクトロン株式会社 基板処理装置
JP2008098670A (ja) * 2007-12-21 2008-04-24 Hitachi Kokusai Electric Inc 半導体製造装置の障害対処システム
JP5344734B2 (ja) * 2007-12-28 2013-11-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5059685B2 (ja) * 2008-05-20 2012-10-24 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法

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