JP5904294B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

Info

Publication number
JP5904294B2
JP5904294B2 JP2015032834A JP2015032834A JP5904294B2 JP 5904294 B2 JP5904294 B2 JP 5904294B2 JP 2015032834 A JP2015032834 A JP 2015032834A JP 2015032834 A JP2015032834 A JP 2015032834A JP 5904294 B2 JP5904294 B2 JP 5904294B2
Authority
JP
Japan
Prior art keywords
module
substrate
wafer
coating film
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015032834A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015111729A5 (enExample
JP2015111729A (ja
Inventor
宮田 亮
宮田  亮
健一郎 松山
健一郎 松山
久仁恵 緒方
久仁恵 緒方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2015032834A priority Critical patent/JP5904294B2/ja
Publication of JP2015111729A publication Critical patent/JP2015111729A/ja
Publication of JP2015111729A5 publication Critical patent/JP2015111729A5/ja
Application granted granted Critical
Publication of JP5904294B2 publication Critical patent/JP5904294B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2015032834A 2010-09-06 2015-02-23 基板処理装置及び基板処理方法 Active JP5904294B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015032834A JP5904294B2 (ja) 2010-09-06 2015-02-23 基板処理装置及び基板処理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010198888 2010-09-06
JP2010198888 2010-09-06
JP2015032834A JP5904294B2 (ja) 2010-09-06 2015-02-23 基板処理装置及び基板処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2011154043A Division JP2012080077A (ja) 2010-09-06 2011-07-12 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JP2015111729A JP2015111729A (ja) 2015-06-18
JP2015111729A5 JP2015111729A5 (enExample) 2015-07-30
JP5904294B2 true JP5904294B2 (ja) 2016-04-13

Family

ID=53526305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015032834A Active JP5904294B2 (ja) 2010-09-06 2015-02-23 基板処理装置及び基板処理方法

Country Status (1)

Country Link
JP (1) JP5904294B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024022025A (ja) * 2022-08-05 2024-02-16 株式会社荏原製作所 基板処理装置及びプログラム
KR20250140551A (ko) * 2023-01-27 2025-09-25 도쿄엘렉트론가부시키가이샤 기판 반송 방법, 기판 처리 장치 및 프로그램

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3273754B2 (ja) * 1997-12-15 2002-04-15 東京エレクトロン株式会社 塗布膜形成装置
JP2003318079A (ja) * 2002-04-19 2003-11-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP4812704B2 (ja) * 2007-07-10 2011-11-09 東京エレクトロン株式会社 基板処理装置
JP2008098670A (ja) * 2007-12-21 2008-04-24 Hitachi Kokusai Electric Inc 半導体製造装置の障害対処システム
JP5344734B2 (ja) * 2007-12-28 2013-11-20 株式会社Sokudo 基板処理装置
JP5059685B2 (ja) * 2008-05-20 2012-10-24 株式会社Sokudo 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2015111729A (ja) 2015-06-18

Similar Documents

Publication Publication Date Title
JP5168300B2 (ja) 基板処理装置及び基板処理方法
JP5392190B2 (ja) 基板処理システム及び基板処理方法
JP4356936B2 (ja) 塗布、現像装置及びその方法
US9417529B2 (en) Coating and developing apparatus and method
KR101010779B1 (ko) 도포, 현상 장치, 그 방법 및 기억 매체
CN102315090B (zh) 涂布、显影装置
JP6723110B2 (ja) 基板処理装置および基板処理方法
JP2012080077A (ja) 基板処理装置及び基板処理方法
JP4973675B2 (ja) 基板処理装置及び基板処理方法
JP2011176117A (ja) 基板処理装置、基板処理方法及び記憶媒体
JP4770938B2 (ja) 基板処理装置
JP6243784B2 (ja) 基板処理装置
JP5223778B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP2008141134A (ja) 塗布、現像装置及びその方法並びに記憶媒体
JP5904294B2 (ja) 基板処理装置及び基板処理方法
CN113675110A (zh) 基板处理装置
JP4640469B2 (ja) 塗布、現像装置、その方法及び記憶媒体
JP5565422B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
JP4307168B2 (ja) 基板処理装置およびその方法
JP7543473B1 (ja) 基板処理装置および基板処理方法
JP2014067910A (ja) 塗布膜形成装置、塗布膜形成方法、塗布、現像装置、塗布、現像方法及び記憶媒体
JP5267691B2 (ja) 塗布、現像装置、その方法及び記憶媒体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150529

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160216

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160229

R150 Certificate of patent or registration of utility model

Ref document number: 5904294

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250