JP5904294B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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JP5904294B2
JP5904294B2 JP2015032834A JP2015032834A JP5904294B2 JP 5904294 B2 JP5904294 B2 JP 5904294B2 JP 2015032834 A JP2015032834 A JP 2015032834A JP 2015032834 A JP2015032834 A JP 2015032834A JP 5904294 B2 JP5904294 B2 JP 5904294B2
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substrate
wafer
coating film
layer
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JP2015111729A (ja
JP2015111729A5 (enExample
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宮田　亮
宮田　　亮
健一郎 松山
健一郎 松山
久仁恵 緒方
久仁恵 緒方
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Tokyo Electron Ltd
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JP2015032834A 2010-09-06 2015-02-23 基板処理装置及び基板処理方法 Active JP5904294B2 (ja)

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JP2015032834A JP5904294B2 (ja) 2010-09-06 2015-02-23 基板処理装置及び基板処理方法

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JP2015032834A JP5904294B2 (ja) 2010-09-06 2015-02-23 基板処理装置及び基板処理方法

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JP2015111729A5 JP2015111729A5 (enExample) 2015-07-30
JP5904294B2 true JP5904294B2 (ja) 2016-04-13

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7795983B2 (ja) * 2022-08-05 2026-01-08 株式会社荏原製作所 基板処理装置及びプログラム
WO2024157825A1 (ja) * 2023-01-27 2024-08-02 東京エレクトロン株式会社 基板搬送方法、基板処理装置及びプログラム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3273754B2 (ja) * 1997-12-15 2002-04-15 東京エレクトロン株式会社 塗布膜形成装置
JP2003318079A (ja) * 2002-04-19 2003-11-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理システム
JP4812704B2 (ja) * 2007-07-10 2011-11-09 東京エレクトロン株式会社 基板処理装置
JP2008098670A (ja) * 2007-12-21 2008-04-24 Hitachi Kokusai Electric Inc 半導体製造装置の障害対処システム
JP5344734B2 (ja) * 2007-12-28 2013-11-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5059685B2 (ja) * 2008-05-20 2012-10-24 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法

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