JP2015109327A - 洗浄装置 - Google Patents
洗浄装置 Download PDFInfo
- Publication number
- JP2015109327A JP2015109327A JP2013250959A JP2013250959A JP2015109327A JP 2015109327 A JP2015109327 A JP 2015109327A JP 2013250959 A JP2013250959 A JP 2013250959A JP 2013250959 A JP2013250959 A JP 2013250959A JP 2015109327 A JP2015109327 A JP 2015109327A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- cleaned
- nozzle
- cleaning liquid
- chuck table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 166
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 238000002347 injection Methods 0.000 claims abstract description 8
- 239000007924 injection Substances 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 82
- 238000005507 spraying Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 abstract description 9
- 239000000243 solution Substances 0.000 abstract 1
- 239000003595 mist Substances 0.000 description 8
- 239000007921 spray Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02076—Cleaning after the substrates have been singulated
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
【解決手段】被洗浄物(11)を保持する保持面(8a)を有するチャックテーブル(8)と、チャックテーブルに保持された被洗浄物に対面し、洗浄液を噴射して被洗浄物を洗浄する洗浄手段(14)と、を備え、洗浄手段は、チャックテーブルに保持された被洗浄物に洗浄液を噴射する洗浄ノズル(20)と、洗浄ノズルの噴射口を囲繞する環状のスリット(22e)から洗浄液を噴出し、スリットからチャックテーブルに保持された被洗浄物まで続くスカート状の水膜(B)を形成する水膜形成ノズル(22)と、を有し、洗浄ノズルから噴射される洗浄液の液柱(A1)はスカート状の水膜で周囲を囲まれる構成とした。
【選択図】図2
Description
4 基台
6 チャンバー
8 チャックテーブル(スピンナテーブル)
8a 保持面
10 クランプ
12 排出口
14 洗浄ユニット(洗浄手段)
16 支持アーム
18 連結具
20 洗浄ノズル
20a 下端面
20b 外周面
22 水膜形成ノズル
22a 開口
22b 供給口
22c 環状流路
22d 噴射流路
22e スリット
22f 内壁面
24 連結具
26 配管
11 被洗浄物
13 デバイス
15 ダイシングテープ
17 フレーム
A1 洗浄液(液柱)
A2 洗浄液
A3 洗浄液
B 洗浄液(水膜)
C 洗浄液
M 洗浄液
Claims (2)
- 被洗浄物を洗浄し、被洗浄物に付着した異物を除去する洗浄装置であって、
被洗浄物を保持する保持面を有するチャックテーブルと、
該チャックテーブルに保持された被洗浄物に対面し、洗浄液を噴射して被洗浄物を洗浄する洗浄手段と、を備え、
該洗浄手段は、
該チャックテーブルに保持された被洗浄物に該洗浄液を噴射する洗浄ノズルと、
該洗浄ノズルの噴射口を囲繞する環状のスリットから該洗浄液を噴出し、該スリットから該チャックテーブルに保持された被洗浄物まで続くスカート状の水膜を形成する水膜形成ノズルと、を有し、
該洗浄ノズルから噴射される該洗浄液の液柱はスカート状の該水膜で周囲を囲まれることを特徴とする洗浄装置。 - 前記洗浄ノズルから噴射される前記洗浄液は、エアーと混合した状態で噴射されることを特徴とする請求項1記載の洗浄装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013250959A JP6305040B2 (ja) | 2013-12-04 | 2013-12-04 | 洗浄装置 |
TW103137396A TWI642491B (zh) | 2013-12-04 | 2014-10-29 | Cleaning device |
US14/556,849 US9901961B2 (en) | 2013-12-04 | 2014-12-01 | Cleaning apparatus |
CN201410737754.5A CN104701218B (zh) | 2013-12-04 | 2014-12-04 | 清洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013250959A JP6305040B2 (ja) | 2013-12-04 | 2013-12-04 | 洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015109327A true JP2015109327A (ja) | 2015-06-11 |
JP6305040B2 JP6305040B2 (ja) | 2018-04-04 |
Family
ID=53264233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013250959A Active JP6305040B2 (ja) | 2013-12-04 | 2013-12-04 | 洗浄装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9901961B2 (ja) |
JP (1) | JP6305040B2 (ja) |
CN (1) | CN104701218B (ja) |
TW (1) | TWI642491B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3566767B1 (en) * | 2017-01-06 | 2021-08-25 | Ohkawara Kakohki Co., Ltd. | Particle production apparatus and particle production method |
JP6955971B2 (ja) * | 2017-11-10 | 2021-10-27 | 株式会社ディスコ | 洗浄ノズル |
USD876525S1 (en) * | 2018-01-25 | 2020-02-25 | Tusimple, Inc. | Device of clearing sensor automatically |
JP7347986B2 (ja) * | 2019-08-06 | 2023-09-20 | 株式会社ディスコ | エッジトリミング装置 |
JP7218731B2 (ja) * | 2020-01-09 | 2023-02-07 | 信越半導体株式会社 | ラッピング装置の洗浄装置 |
CN115052712B (zh) * | 2020-02-17 | 2024-09-10 | 东京毅力科创株式会社 | 加工装置 |
CN111450720A (zh) * | 2020-04-15 | 2020-07-28 | 紫锐集团有限公司 | 水溶液的气体浓度提升装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2504216A (en) * | 1944-12-23 | 1950-04-18 | Walter N T Morton | Spray gun |
JPS61296724A (ja) * | 1985-06-26 | 1986-12-27 | Hitachi Ltd | 高圧ジエツトスクラバ洗浄装置 |
JPH0631207A (ja) * | 1992-07-22 | 1994-02-08 | Ebara Corp | 洗浄用ノズル |
JPH0724736A (ja) * | 1993-07-12 | 1995-01-27 | Nippon Steel Corp | 消音型ウォータージェット用ノズルアセンブリー |
US20080048056A1 (en) * | 2004-07-20 | 2008-02-28 | Sez Ag | Fluid Discharging Device |
JP2009111220A (ja) * | 2007-10-31 | 2009-05-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2012190868A (ja) * | 2011-03-09 | 2012-10-04 | Tokyo Electron Ltd | 2流体ノズル、基板液処理装置、基板液処理方法、及び基板液処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4526170B2 (ja) * | 2000-08-31 | 2010-08-18 | 本田技研工業株式会社 | 塗装設備 |
US20030217762A1 (en) * | 2002-02-18 | 2003-11-27 | Lam Research Corporation | Water supply apparatus and method thereof |
CN100462200C (zh) * | 2005-10-10 | 2009-02-18 | 广东科达机电股份有限公司 | 除屑砖体抛光机 |
JP5676143B2 (ja) | 2010-05-20 | 2015-02-25 | 株式会社ディスコ | 洗浄装置 |
-
2013
- 2013-12-04 JP JP2013250959A patent/JP6305040B2/ja active Active
-
2014
- 2014-10-29 TW TW103137396A patent/TWI642491B/zh active
- 2014-12-01 US US14/556,849 patent/US9901961B2/en active Active
- 2014-12-04 CN CN201410737754.5A patent/CN104701218B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2504216A (en) * | 1944-12-23 | 1950-04-18 | Walter N T Morton | Spray gun |
JPS61296724A (ja) * | 1985-06-26 | 1986-12-27 | Hitachi Ltd | 高圧ジエツトスクラバ洗浄装置 |
JPH0631207A (ja) * | 1992-07-22 | 1994-02-08 | Ebara Corp | 洗浄用ノズル |
JPH0724736A (ja) * | 1993-07-12 | 1995-01-27 | Nippon Steel Corp | 消音型ウォータージェット用ノズルアセンブリー |
US20080048056A1 (en) * | 2004-07-20 | 2008-02-28 | Sez Ag | Fluid Discharging Device |
JP2009111220A (ja) * | 2007-10-31 | 2009-05-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP2012190868A (ja) * | 2011-03-09 | 2012-10-04 | Tokyo Electron Ltd | 2流体ノズル、基板液処理装置、基板液処理方法、及び基板液処理プログラムを記録したコンピュータ読み取り可能な記録媒体 |
Also Published As
Publication number | Publication date |
---|---|
CN104701218B (zh) | 2019-04-19 |
US9901961B2 (en) | 2018-02-27 |
JP6305040B2 (ja) | 2018-04-04 |
TW201527002A (zh) | 2015-07-16 |
US20150151337A1 (en) | 2015-06-04 |
TWI642491B (zh) | 2018-12-01 |
CN104701218A (zh) | 2015-06-10 |
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