JP6955971B2 - 洗浄ノズル - Google Patents
洗浄ノズル Download PDFInfo
- Publication number
- JP6955971B2 JP6955971B2 JP2017217259A JP2017217259A JP6955971B2 JP 6955971 B2 JP6955971 B2 JP 6955971B2 JP 2017217259 A JP2017217259 A JP 2017217259A JP 2017217259 A JP2017217259 A JP 2017217259A JP 6955971 B2 JP6955971 B2 JP 6955971B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- axis direction
- straightening vane
- cleaning
- tube pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Seal Device For Vehicle (AREA)
- Fuel-Injection Apparatus (AREA)
Description
11 :第1チャックテーブル
12 :第2チャックテーブル
13 :ウォーターケース
15 :底部
19 :第1移動板
20 :第2移動板
23 :第1カバー
24 :第2カバー
31 :切削屑案内板
32 :切削屑回収ボックス
40 :洗浄ノズル
41 :洗浄液供給源
42 :チューブ配管
42a :噴射口
43 :第1の整流板
44 :第2の整流板
45 :取り付けブラケット
46 :スペーサネジ
46a :ネジ部
46b :頭部(スペーサ)
47 :ネジ孔
48 :ネジ孔
49 :貫通孔
50 :固定ネジ(固定部材)
50a :ネジ部
50b :頭部
W :洗浄液
Claims (1)
- 加工時に加工屑を洗浄するための洗浄ノズルであって、
洗浄液供給源に連通するチューブ配管と、該チューブ配管の噴射口側を上下から平行に所定長さ挟んで該チューブ配管先端を圧潰する2枚の整流板と、該チューブ配管先端を圧潰した状態で2枚の該整流板を固定する固定部材とから構成され、
該整流板の間を所定間隔に維持するスペーサを該2枚の整流板の間に挿入し、該チューブ配管先端の絞り量を調整すること、を特徴とする洗浄ノズル。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017217259A JP6955971B2 (ja) | 2017-11-10 | 2017-11-10 | 洗浄ノズル |
KR1020180134998A KR102544888B1 (ko) | 2017-11-10 | 2018-11-06 | 세정 노즐 |
CN201811316455.9A CN109759375B (zh) | 2017-11-10 | 2018-11-07 | 清洗喷嘴 |
TW107139770A TWI770308B (zh) | 2017-11-10 | 2018-11-09 | 洗淨噴嘴 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017217259A JP6955971B2 (ja) | 2017-11-10 | 2017-11-10 | 洗浄ノズル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019087705A JP2019087705A (ja) | 2019-06-06 |
JP6955971B2 true JP6955971B2 (ja) | 2021-10-27 |
Family
ID=66449648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017217259A Active JP6955971B2 (ja) | 2017-11-10 | 2017-11-10 | 洗浄ノズル |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6955971B2 (ja) |
KR (1) | KR102544888B1 (ja) |
CN (1) | CN109759375B (ja) |
TW (1) | TWI770308B (ja) |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1490377A (en) * | 1976-09-21 | 1977-11-02 | Barnes Eng Co | Spray nozzle |
JP2000051760A (ja) * | 1998-08-10 | 2000-02-22 | Dainippon Screen Mfg Co Ltd | 流体供給装置 |
JP2000093713A (ja) * | 1998-09-21 | 2000-04-04 | Shisuto:Kk | 吸引式濾過装置 |
JP2003168659A (ja) * | 2001-12-04 | 2003-06-13 | Tokyo Seimitsu Co Ltd | 高圧洗浄ノズルを有するシンギュレーション装置 |
KR100782539B1 (ko) * | 2006-06-15 | 2007-12-06 | 세메스 주식회사 | 슬릿 노즐 및 이를 포함하는 약액 도포 장치 |
JP5585076B2 (ja) * | 2009-12-24 | 2014-09-10 | 栗田工業株式会社 | 洗浄方法 |
CN201760360U (zh) * | 2010-02-09 | 2011-03-16 | 金裕工业有限公司 | 喷嘴构造 |
JP5496966B2 (ja) * | 2011-08-05 | 2014-05-21 | 東京エレクトロン株式会社 | 液処理装置 |
CN202823667U (zh) * | 2012-08-31 | 2013-03-27 | 烟台中集来福士海洋工程有限公司 | 一种挤压式喷嘴芯结构及具有该结构的挤压式喷嘴 |
JP2014108463A (ja) * | 2012-11-30 | 2014-06-12 | Disco Abrasive Syst Ltd | 切削装置 |
JP6118653B2 (ja) | 2013-06-19 | 2017-04-19 | 株式会社ディスコ | 切削装置 |
JP6305040B2 (ja) * | 2013-12-04 | 2018-04-04 | 株式会社ディスコ | 洗浄装置 |
JP6255238B2 (ja) * | 2013-12-27 | 2017-12-27 | 株式会社ディスコ | 切削装置 |
JP2015185813A (ja) * | 2014-03-26 | 2015-10-22 | 株式会社Screenホールディングス | 基板洗浄方法および基板洗浄装置 |
JP6333650B2 (ja) * | 2014-07-18 | 2018-05-30 | Towa株式会社 | 切断装置及び切断方法 |
JP2016159376A (ja) * | 2015-02-27 | 2016-09-05 | 株式会社ディスコ | 切削装置 |
JP6475071B2 (ja) * | 2015-04-24 | 2019-02-27 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
CN205324022U (zh) * | 2016-01-22 | 2016-06-22 | 沈苗苗 | 一种新型高效雾化喷嘴 |
JP6929652B2 (ja) * | 2016-02-17 | 2021-09-01 | 株式会社Screenホールディングス | 基板処理装置および間隙洗浄方法 |
CN205966238U (zh) * | 2016-08-11 | 2017-02-22 | 浙江景华建设有限公司 | 一种建筑场地用喷雾器 |
-
2017
- 2017-11-10 JP JP2017217259A patent/JP6955971B2/ja active Active
-
2018
- 2018-11-06 KR KR1020180134998A patent/KR102544888B1/ko active IP Right Grant
- 2018-11-07 CN CN201811316455.9A patent/CN109759375B/zh active Active
- 2018-11-09 TW TW107139770A patent/TWI770308B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI770308B (zh) | 2022-07-11 |
TW201918324A (zh) | 2019-05-16 |
CN109759375A (zh) | 2019-05-17 |
KR20190053786A (ko) | 2019-05-20 |
KR102544888B1 (ko) | 2023-06-16 |
JP2019087705A (ja) | 2019-06-06 |
CN109759375B (zh) | 2022-07-12 |
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