JP2015079923A - 窒化物半導体装置、ダイオード、および電界効果トランジスタ - Google Patents
窒化物半導体装置、ダイオード、および電界効果トランジスタ Download PDFInfo
- Publication number
- JP2015079923A JP2015079923A JP2013217856A JP2013217856A JP2015079923A JP 2015079923 A JP2015079923 A JP 2015079923A JP 2013217856 A JP2013217856 A JP 2013217856A JP 2013217856 A JP2013217856 A JP 2013217856A JP 2015079923 A JP2015079923 A JP 2015079923A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- semiconductor device
- 2deg
- nitride semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 186
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 81
- 230000005669 field effect Effects 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 230000005533 two-dimensional electron gas Effects 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 230000003071 parasitic effect Effects 0.000 abstract description 11
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 488
- 239000000463 material Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 37
- 230000015572 biosynthetic process Effects 0.000 description 26
- 230000005684 electric field Effects 0.000 description 19
- 238000005530 etching Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 15
- 229910004298 SiO 2 Inorganic materials 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229910002601 GaN Inorganic materials 0.000 description 13
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 13
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- -1 nitride compound Chemical class 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 230000015556 catabolic process Effects 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052715 tantalum Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000002109 crystal growth method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 3
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/15—Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
- H01L29/151—Compositional structures
- H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66143—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66196—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices with an active layer made of a group 13/15 material
- H01L29/66204—Diodes
- H01L29/66212—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/404—Multiple field plate structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
- H01L29/513—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures the variation being perpendicular to the channel plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
次に、本発明の実施の形態1による窒化物半導体装置について説明する。図1は、この実施の形態1による窒化物半導体装置としてのショットキーバリアダイオード(SBD)1を上方から俯瞰した平面図である。また、図2は、図1のII−II線に沿ったSBD1の模式的な断面図である。
次に、本発明の実施の形態2による窒化物半導体装置について説明する。図7は、この実施の形態2による窒化物半導体装置であるSBD2を示す模式的な断面図である。
次に、本発明の実施の形態3による窒化物半導体装置について説明する。図8は、この実施の形態3による窒化物半導体装置であるSBD3を示す模式的な断面図である。
次に、本発明の実施の形態4による窒化物半導体装置について説明する。図9は、この実施の形態4による窒化物半導体装置であるSBD4を示す模式的な断面図である。
次に、本発明の実施の形態5による窒化物半導体装置としての高電子移動度トランジスタ(HEMT)について説明する。図10は、この窒化物半導体装置であるHEMT5を上方から俯瞰した平面図である。また、図11は、図10のXI−XI線に沿ったHEMT5の模式的な断面図である。
次に、本発明の実施の形態6による窒化物半導体装置について説明する。図12は、この実施の形態6による窒化物半導体装置であるHEMT6を示す模式的な断面図である。
次に、本発明の実施の形態7による窒化物半導体装置について説明する。図13は、この実施の形態7による窒化物半導体装置であるHEMT7を示す模式的な断面図である。
5,6,7 HEMT
11 基板
12 バッファ層
12a,13b,13c,13e,15a,51a リセス部
13 電子走行層
13a,13d,13f 2DEG非発生領域
14 電子供給層
15,51 フィールドプレート層
16 アノード電極
17 アノード配線
17a アノードパッド
18 カソード電極
19 カソード配線
19a カソードパッド
20,59 絶縁膜
21,22,23,24,58,61,62 誘電体層
21a,22a,58a,61a,62a コンタクト部
52 ゲート電極
52a ゲートパッド
54 ドレイン電極
55 ドレイン配線
55a ドレインパッド
56 ソース電極
57 ソース配線
57a ソースパッド
a 2DEG層
A アノード
C カソード
D ドレイン
G ゲート
S ソース
Claims (15)
- 少なくとも一部に導電部分を有する基体と、
前記基体上に設けられた窒化物半導体からなる複数の半導体層から構成される半導体積層体と、
前記半導体積層体を構成する半導体層のうちの少なくとも一部の半導体層の上に設けられる第1電極と、
前記半導体積層体を構成する半導体層のうちの少なくとも一部の半導体層の上に、前記第1電極と離間して設けられる第2電極と、
前記第1電極の上層に設けられる第1配線と、
前記第2電極の上層に設けられる第2配線と、を備え、
前記第1電極および前記第2電極の少なくとも一方の電極であって前記半導体積層体と電気的に接合した部分以外の電極の部分の下層に、前記半導体積層体を構成する窒化物半導体の誘電率よりも低い誘電率の誘電体からなる誘電体層が設けられる
ことを特徴とする窒化物半導体装置。 - 前記第1電極および前記第2電極において、下層に前記誘電体層が設けられた電極から所定の1つの電極を選択した場合に、他の電極を前記基体の導電性の部分と同電位にするように構成されていることを特徴とする請求項1に記載の窒化物半導体装置。
- 前記半導体積層体が、部分的に2次元電子ガスが発生する構成を有することを特徴とする請求項1または2に記載の窒化物半導体装置。
- 前記第1電極および前記第2電極の少なくとも一方の電極の前記半導体積層体と接合した部分以外の電極の部分の下層に、前記誘電体層と前記2次元電子ガスが発生しない2次元電子ガス非発生領域とが前記基体の主面に平行な面内で重なるように配置されていることを特徴とする請求項3に記載の窒化物半導体装置。
- 前記電極の幅方向に沿った前記誘電体層の外縁部が、前記半導体積層体における前記2次元電子ガス非発生領域の外縁部より外側になるように構成されていることを特徴とする請求項4に記載の窒化物半導体装置。
- 前記電極の幅方向に沿った前記誘電体層の外縁部が、前記2次元電子ガス非発生領域の外縁部より0.5μm以上3.0μm以下の範囲で外側になるように構成されていることを特徴とする請求項5に記載の窒化物半導体装置。
- 前記2次元電子ガス非発生領域が、前記半導体積層体の部分における不純物を含む領域から構成されていることを特徴とする請求項3〜6のいずれか1項に記載の窒化物半導体装置。
- 前記2次元電子ガス非発生領域が、前記半導体積層体の部分に設けたリセス部により構成されていることを特徴とする請求項3〜6のいずれか1項に記載の窒化物半導体装置。
- 前記誘電体層が、シリコン、酸素、窒素、炭素、フッ素、およびホウ素からなる群より選ばれた少なくとも1種類の元素を含有していることを特徴とする請求項1〜8のいずれか1項に記載の窒化物半導体装置。
- 前記第1電極および前記第2電極のうちの下層に前記誘電体層が設けられる電極がオーミック電極であることを特徴とする請求項1〜9のいずれか1項に記載の窒化物半導体装置。
- 前記半導体積層体が、窒化物系半導体からなる第1半導体層、および第1半導体層の上に形成され第1半導体層よりも平均的にバンドギャップが広い少なくとも1種類の窒化物系半導体からなる第2半導体層を含んで構成されることを特徴とする請求項1〜10のいずれか1項に記載の窒化物半導体装置。
- 前記半導体積層体は、さらに第2半導体層上に選択的に形成され第2半導体層よりも平均的にバンドギャップが狭い窒化物系半導体からなる第3半導体層を含むことを特徴とする請求項11に記載の窒化物半導体装置。
- 請求項1〜12のいずれか1項に記載の窒化物半導体装置の構成を有し、
前記第1電極がアノード電極、および前記第2電極がカソード電極である
ことを特徴とするダイオード。 - 前記半導体積層体を構成する半導体層のうちの少なくとも一部の半導体層の上に、前記第1電極と前記第2電極との間において前記第1電極および前記第2電極と離間するように設けられた第3電極を備えることを特徴とする請求項1〜12のいずれか1項に記載の窒化物半導体装置。
- 請求項14に記載の窒化物半導体装置の構成を有し、
前記第1電極がソース電極、前記第2電極がドレイン電極、および前記第3電極がゲート電極である
ことを特徴とする電界効果トランジスタ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013217856A JP6133191B2 (ja) | 2013-10-18 | 2013-10-18 | 窒化物半導体装置、ダイオード、および電界効果トランジスタ |
PCT/JP2014/077747 WO2015056797A1 (ja) | 2013-10-18 | 2014-10-17 | 窒化物半導体装置およびその製造方法、ならびにダイオードおよび電界効果トランジスタ |
US15/097,888 US9911842B2 (en) | 2013-10-18 | 2016-04-13 | Nitride semiconductor device, production method thereof, diode, and field effect transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013217856A JP6133191B2 (ja) | 2013-10-18 | 2013-10-18 | 窒化物半導体装置、ダイオード、および電界効果トランジスタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015079923A true JP2015079923A (ja) | 2015-04-23 |
JP6133191B2 JP6133191B2 (ja) | 2017-05-24 |
Family
ID=52828236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013217856A Active JP6133191B2 (ja) | 2013-10-18 | 2013-10-18 | 窒化物半導体装置、ダイオード、および電界効果トランジスタ |
Country Status (3)
Country | Link |
---|---|
US (1) | US9911842B2 (ja) |
JP (1) | JP6133191B2 (ja) |
WO (1) | WO2015056797A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190126913A (ko) | 2017-04-28 | 2019-11-12 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
CN111180528A (zh) * | 2020-02-14 | 2020-05-19 | 重庆邮电大学 | 一种SiC肖特基二极管三阶斜台面结终端结构 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016100471A (ja) * | 2014-11-21 | 2016-05-30 | 住友電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
WO2016147541A1 (ja) * | 2015-03-17 | 2016-09-22 | パナソニック株式会社 | 窒化物半導体装置 |
JP6510433B2 (ja) | 2016-01-26 | 2019-05-08 | 日本碍子株式会社 | 光源素子放熱構造体の製造方法 |
JP2017157589A (ja) * | 2016-02-29 | 2017-09-07 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
US10249725B2 (en) * | 2016-08-15 | 2019-04-02 | Delta Electronics, Inc. | Transistor with a gate metal layer having varying width |
US10672917B2 (en) * | 2016-12-05 | 2020-06-02 | Gpower Semiconductor, Inc. | Schottky barrier rectifier |
TWI735786B (zh) * | 2017-06-09 | 2021-08-11 | 日商Uacj股份有限公司 | 半導體層、振盪元件及半導體層的製造方法 |
US10103239B1 (en) * | 2017-12-28 | 2018-10-16 | Vanguard International Semiconductor Corporation | High electron mobility transistor structure |
WO2019139601A1 (en) * | 2018-01-12 | 2019-07-18 | Intel IP Corporation | Iii-n diodes with buried polarization layers underneath anodes |
US10903144B1 (en) * | 2020-02-16 | 2021-01-26 | Nanya Technology Corporation | Semiconductor package and manufacturing method thereof |
DE102020108777A1 (de) * | 2020-03-30 | 2021-09-30 | Otto-von-Guericke-Universität Magdeburg, Körperschaft des öffentlichen Rechts | Feldeffekttransistor |
US11049848B1 (en) * | 2020-05-21 | 2021-06-29 | Nanya Technology Corporation | Semiconductor device |
JP7476062B2 (ja) | 2020-09-15 | 2024-04-30 | 株式会社東芝 | 半導体装置 |
LT6909B (lt) * | 2020-09-29 | 2022-04-25 | Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras | Įgilintų elektronikos elementų formavimo būdas |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009038392A (ja) * | 2003-05-15 | 2009-02-19 | Panasonic Corp | 半導体装置 |
JP2009111204A (ja) * | 2007-10-31 | 2009-05-21 | Panasonic Corp | 電界効果トランジスタ及びその製造方法 |
JP2012023211A (ja) * | 2010-07-14 | 2012-02-02 | Panasonic Corp | 電界効果トランジスタ |
WO2012121952A2 (en) * | 2011-03-04 | 2012-09-13 | Transphorm Inc. | Electrode configurations for semiconductor devices |
JP2013207086A (ja) * | 2012-03-28 | 2013-10-07 | Sumitomo Electric Device Innovations Inc | 半導体装置及びその製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004200433A (ja) * | 2002-12-19 | 2004-07-15 | Toshiba Corp | 半導体装置 |
JP4417677B2 (ja) | 2003-09-19 | 2010-02-17 | 株式会社東芝 | 電力用半導体装置 |
JP4072858B2 (ja) | 2004-02-20 | 2008-04-09 | シャープ株式会社 | 窒化物系iii−v族化合物半導体装置 |
US20070164326A1 (en) | 2004-02-20 | 2007-07-19 | Yasuhiro Okamoto | Field effect transistor |
JP2005285870A (ja) * | 2004-03-26 | 2005-10-13 | Kyocera Corp | エピタキシャル基板 |
US7859014B2 (en) | 2004-06-24 | 2010-12-28 | Nec Corporation | Semiconductor device |
US7692298B2 (en) | 2004-09-30 | 2010-04-06 | Sanken Electric Co., Ltd. | III-V nitride semiconductor device comprising a concave shottky contact and an ohmic contact |
JP4517077B2 (ja) | 2005-08-01 | 2010-08-04 | 独立行政法人産業技術総合研究所 | 窒化物半導体材料を用いたヘテロ接合電界効果型トランジスタ |
JP2007329350A (ja) * | 2006-06-08 | 2007-12-20 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US9525052B2 (en) * | 2007-01-10 | 2016-12-20 | Infineon Technologies Americas Corp. | Active area shaping of III-nitride devices utilizing a field plate defined by a dielectric body |
JP4691060B2 (ja) | 2007-03-23 | 2011-06-01 | 古河電気工業株式会社 | GaN系半導体素子 |
JP4584293B2 (ja) | 2007-08-31 | 2010-11-17 | 富士通株式会社 | 窒化物半導体装置、ドハティ増幅器、ドレイン電圧制御増幅器 |
US7999288B2 (en) * | 2007-11-26 | 2011-08-16 | International Rectifier Corporation | High voltage durability III-nitride semiconductor device |
JP5487615B2 (ja) * | 2008-12-24 | 2014-05-07 | サンケン電気株式会社 | 電界効果半導体装置及びその製造方法 |
JP5658472B2 (ja) | 2010-03-26 | 2015-01-28 | ルネサスエレクトロニクス株式会社 | 電界効果トランジスタ |
US8816395B2 (en) * | 2010-05-02 | 2014-08-26 | Visic Technologies Ltd. | Field effect power transistors |
KR20130066396A (ko) | 2011-12-12 | 2013-06-20 | 삼성전기주식회사 | 질화물 반도체 소자 및 그 제조 방법 |
-
2013
- 2013-10-18 JP JP2013217856A patent/JP6133191B2/ja active Active
-
2014
- 2014-10-17 WO PCT/JP2014/077747 patent/WO2015056797A1/ja active Application Filing
-
2016
- 2016-04-13 US US15/097,888 patent/US9911842B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009038392A (ja) * | 2003-05-15 | 2009-02-19 | Panasonic Corp | 半導体装置 |
JP2009111204A (ja) * | 2007-10-31 | 2009-05-21 | Panasonic Corp | 電界効果トランジスタ及びその製造方法 |
JP2012023211A (ja) * | 2010-07-14 | 2012-02-02 | Panasonic Corp | 電界効果トランジスタ |
WO2012121952A2 (en) * | 2011-03-04 | 2012-09-13 | Transphorm Inc. | Electrode configurations for semiconductor devices |
JP2013207086A (ja) * | 2012-03-28 | 2013-10-07 | Sumitomo Electric Device Innovations Inc | 半導体装置及びその製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190126913A (ko) | 2017-04-28 | 2019-11-12 | 미쓰비시덴키 가부시키가이샤 | 반도체 장치 |
DE112017007491T5 (de) | 2017-04-28 | 2020-01-09 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
US10804369B2 (en) | 2017-04-28 | 2020-10-13 | Mitsubishi Electric Corporation | Semiconductor device |
DE112017007491B4 (de) | 2017-04-28 | 2023-04-27 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
CN111180528A (zh) * | 2020-02-14 | 2020-05-19 | 重庆邮电大学 | 一种SiC肖特基二极管三阶斜台面结终端结构 |
CN111180528B (zh) * | 2020-02-14 | 2023-06-13 | 重庆邮电大学 | 一种SiC肖特基二极管三阶斜台面结终端结构 |
Also Published As
Publication number | Publication date |
---|---|
JP6133191B2 (ja) | 2017-05-24 |
US20160225889A1 (en) | 2016-08-04 |
US9911842B2 (en) | 2018-03-06 |
WO2015056797A1 (ja) | 2015-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6133191B2 (ja) | 窒化物半導体装置、ダイオード、および電界効果トランジスタ | |
JP5487615B2 (ja) | 電界効果半導体装置及びその製造方法 | |
JP6251071B2 (ja) | 半導体装置 | |
JP5348364B2 (ja) | ヘテロ接合型電界効果半導体装置 | |
US8530937B2 (en) | Compound semiconductor device having insulation film with different film thicknesses beneath electrodes | |
JP5697456B2 (ja) | 電界効果トランジスタ及び電力制御装置 | |
US20110227132A1 (en) | Field-effect transistor | |
US10868164B2 (en) | Nitride semiconductor device | |
JP6083548B2 (ja) | 窒化物半導体装置 | |
JP2013235873A (ja) | 半導体装置およびその製造方法 | |
JPWO2014041731A1 (ja) | 半導体装置 | |
JP2008034438A (ja) | 半導体装置 | |
CN211578757U (zh) | 高电子迁移率晶体管 | |
JP2009117712A (ja) | 窒化物系化合物半導体装置 | |
JP2013105863A (ja) | 電界効果トランジスタおよびその製造方法 | |
JP5055737B2 (ja) | 2次元キャリアガス層を有する電界効果トランジスタ | |
JP6225584B2 (ja) | 半導体装置の評価方法、並びに半導体装置およびその製造方法 | |
JP6140050B2 (ja) | 窒化物半導体装置、ダイオード、および電界効果トランジスタ | |
CN107068748B (zh) | 半导体功率元件 | |
JP2015012177A (ja) | 半導体装置及びその製造方法 | |
JP2019134041A (ja) | 窒化物半導体装置 | |
JP5638846B2 (ja) | 電界効果トランジスタ | |
JP5494622B2 (ja) | 半導体装置 | |
JP2010245240A (ja) | ヘテロ接合型電界効果半導体装置及びその製造方法 | |
JP2015119028A (ja) | 半導体装置、電界効果トランジスタ、およびダイオード |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160721 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170110 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170120 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170321 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170419 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6133191 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |