JP2014525680A - プラスチック基板を処理する方法及び処理溶液を少なくとも部分的に再生する装置 - Google Patents
プラスチック基板を処理する方法及び処理溶液を少なくとも部分的に再生する装置 Download PDFInfo
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- JP2014525680A JP2014525680A JP2014527598A JP2014527598A JP2014525680A JP 2014525680 A JP2014525680 A JP 2014525680A JP 2014527598 A JP2014527598 A JP 2014527598A JP 2014527598 A JP2014527598 A JP 2014527598A JP 2014525680 A JP2014525680 A JP 2014525680A
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- treatment solution
- solution
- permanganate
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- filter
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000001172 regenerating effect Effects 0.000 title claims abstract description 4
- 239000000758 substrate Substances 0.000 title claims description 13
- 238000001816 cooling Methods 0.000 claims abstract description 49
- -1 carbonate compound Chemical class 0.000 claims abstract description 18
- 238000007710 freezing Methods 0.000 claims abstract description 16
- 230000008014 freezing Effects 0.000 claims abstract description 16
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims abstract description 7
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 28
- 238000005530 etching Methods 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 7
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 4
- LBSANEJBGMCTBH-UHFFFAOYSA-N manganate Chemical compound [O-][Mn]([O-])(=O)=O LBSANEJBGMCTBH-UHFFFAOYSA-N 0.000 claims description 3
- 238000001914 filtration Methods 0.000 abstract description 20
- 238000012544 monitoring process Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 78
- 239000013078 crystal Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000012065 filter cake Substances 0.000 description 9
- 230000008929 regeneration Effects 0.000 description 7
- 238000011069 regeneration method Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000000706 filtrate Substances 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000013019 agitation Methods 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000009089 cytolysis Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
- 239000008237 rinsing water Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Abstract
Description
プラスチック成形部品若しくは特にプリント回路基板又はプリント回路箔などのプラスチック基板を過マンガン酸塩を含む溶液によって処理又はエッチングすることは、しばしば基板の表面又はボアの金属化のための予備ステップとして行われる。したがって、基板は、水平の搬送方向で浸漬機又はトンネル機の処理タンク内の適切な処理溶液と接触させられ、溶液の温度は50℃からほぼ100℃であってよい。
11 電解質再生装置
12 処理溶液
14 処理タンク
16 冷却タンク
18 冷却装置
19 冷却ジャケット
20 フィルタ装置
21 供給ポンプ
22 予熱器
23 戻しポンプ
24 負圧ユニット
25 供給管
26 排水管、廃棄部
28 フラッシング装置
30 換気部
32 撹拌装置
34 フロア、漏斗状フロア
35 排水部
36 洗浄ユニット
37 移送ポンプ
38 移送ライン
40 すすぎ水ライン
42 ランク、フィルタタンク
44 戻し管
46 負圧管
52 ノズル
56 フィルタストレーナ
57 締切弁
58 負圧タンク
59 負圧ポンプ
64 戻し管
65 供給管
Claims (8)
- プラスチック部材、特にプリント回路基板及びプリント回路箔を、過マンガン酸塩を含む処理溶液によって処理、特にエッチングする方法であって、前記処理溶液における炭酸塩化合物の濃度を、凍結、及びその後のろ過により前記処理溶液から前記炭酸塩化合物を除去することによって、200g/l未満の値、好適には30〜150g/lの値、より好適には50〜100g/lの値に設定し、前記処理溶液は、過マンガン酸ナトリウムを含むことを特徴とする、方法。
- 前記処理溶液における前記過マンガン酸塩の割合は、50%を超える過マンガン酸ナトリウムから成る、請求項1記載の方法。
- 前記炭酸塩化合物の凍結は、処理溶液を−12℃〜+12℃、好適には−9℃〜+10℃、より好適には−7℃〜+5℃の凍結温度に冷却することによって行われる、請求項1又は2記載の方法。
- 前記処理溶液の複数の部分を冷却タンクへ移送すること、及び冷却されかつ凍結した炭酸塩を含む前記処理溶液を前記冷却タンクから下流のフィルタ装置へ移送することを、前記冷却タンクにおける前記処理溶液の温度が凍結温度を超えないように行う、請求項1から3までのいずれか1項記載の方法。
- プラスチック基板との処理タンク内の前記処理溶液の過マンガン酸塩の反応により生じるマンガン酸塩は、前記処理溶液を電解槽と接触させることにより過マンガン酸塩に変換される、請求項1から4までのいずれか1項記載の方法。
- 請求項1から5までのいずれか1項記載の方法を実施するために、処理溶液に含まれた炭酸塩化合物の濃度を減じることによって、プラスチック部材、特にプリント回路基板及びプリント回路箔を処理及び/又はエッチングするために使用される、過マンガン酸塩を含む処理溶液を少なくとも部分的に再生させるための装置であって、前記装置は、少なくとも1つの冷却タンクを備え、該冷却タンクは、再生される前記処理溶液を供給され、かつ該処理溶液から炭酸塩化合物を分離する下流のフィルタ装置を有することを特徴とする、装置。
- 前記フィルタ装置は、少なくとも1つのフィルタタンクと、1つのフィルタとを含み、前記フィルタタンクは、負圧ユニットと接続されている、請求項6記載の装置。
- 請求項1から5までのいずれか1項記載の方法を実施するための請求項6又は7記載の装置の使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011111294.8A DE102011111294B4 (de) | 2011-08-26 | 2011-08-26 | Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung |
DE102011111294.8 | 2011-08-26 | ||
PCT/EP2012/066475 WO2013030098A1 (en) | 2011-08-26 | 2012-08-24 | Method for treating of plastic substrates and a device for an at least partial regeneration of a treatment solution |
Publications (2)
Publication Number | Publication Date |
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JP2014525680A true JP2014525680A (ja) | 2014-09-29 |
JP5905101B2 JP5905101B2 (ja) | 2016-04-20 |
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JP2014527598A Active JP5905101B2 (ja) | 2011-08-26 | 2012-08-24 | プラスチック基板を処理する方法及び処理溶液を少なくとも部分的に再生する装置 |
Country Status (7)
Country | Link |
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JP (1) | JP5905101B2 (ja) |
KR (1) | KR101640693B1 (ja) |
CN (1) | CN103764871B (ja) |
AT (1) | AT515575B1 (ja) |
DE (1) | DE102011111294B4 (ja) |
TW (1) | TWI550129B (ja) |
WO (1) | WO2013030098A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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PL3168326T5 (pl) * | 2014-07-10 | 2024-02-05 | Okuno Chemical Industries Co., Ltd. | Sposób powlekania żywicy |
CN104357811A (zh) * | 2014-12-01 | 2015-02-18 | 中核(天津)科技发展有限公司 | 用于化学镀的装置 |
MX2019007128A (es) * | 2016-12-21 | 2019-09-19 | Hso Herbert Schmidt Gmbh & Co Kg | Solucion de decapado para decapar materiales sinteticos. |
MX2019015038A (es) * | 2017-07-10 | 2020-08-17 | Srg Global Llc | Sistema de recuperacion de manganeso de grabado libre de cromo hexavalente. |
CN110438506A (zh) * | 2019-07-08 | 2019-11-12 | 深圳市裕展精密科技有限公司 | 退镀液的再生制备方法 |
EP4105361A1 (en) | 2021-06-16 | 2022-12-21 | Atotech Deutschland GmbH & Co. KG | Method for oxidizing manganese species in a treatment device |
EP4105362A1 (en) | 2021-06-16 | 2022-12-21 | Atotech Deutschland GmbH & Co. KG | Method for oxidizing manganese species in a treatment device and treatment device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61279688A (ja) * | 1985-05-31 | 1986-12-10 | モ−トン サイオコ−ル,インコ−ポレイテイド | 過マンガン酸塩エツチング浴の再生方法 |
JPH0253967U (ja) * | 1988-10-11 | 1990-04-18 | ||
JP2001234368A (ja) * | 2000-02-18 | 2001-08-31 | Hitachi Ltd | 回路基板の製造方法、エッチング方法及びエッチング装置 |
JP2010138434A (ja) * | 2008-12-10 | 2010-06-24 | Okuno Chem Ind Co Ltd | エッチング液の電解処理方法 |
JP2012067380A (ja) * | 2010-08-27 | 2012-04-05 | C Uyemura & Co Ltd | 電解再生処理装置 |
Family Cites Families (11)
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US3843504A (en) | 1972-08-16 | 1974-10-22 | Western Electric Co | Method of continuously regenerating and recycling a spent etching solution |
US4042729A (en) * | 1972-12-13 | 1977-08-16 | Kollmorgen Technologies Corporation | Process for the activation of resinous bodies for adherent metallization |
US4054693A (en) * | 1974-11-07 | 1977-10-18 | Kollmorgen Technologies Corporation | Processes for the preparation of resinous bodies for adherent metallization comprising treatment with manganate/permanganate composition |
US4601784A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards |
US4859300A (en) * | 1987-07-13 | 1989-08-22 | Enthone, Incorporated | Process for treating plastics with alkaline permanganate solutions |
MXPA01004811A (es) * | 1998-11-13 | 2002-09-18 | Enthone Omi Inc | Proceso para metalizar una superficie de plastico. |
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DE10025551C2 (de) | 2000-05-19 | 2002-04-18 | Atotech Deutschland Gmbh | Kathode für die elektrochemische Regenerierung von Permanganat-Ätzlösungen, Verfahren zu deren Herstellung sowie elektrochemische Regeneriervorrichtung |
EP1657324B1 (en) | 2004-11-10 | 2007-10-31 | ATOTECH Deutschland GmbH | Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement |
JP4275157B2 (ja) * | 2006-07-27 | 2009-06-10 | 荏原ユージライト株式会社 | プラスチック表面の金属化方法 |
US7695638B2 (en) * | 2006-11-24 | 2010-04-13 | Shinko Electric Industries Co., Ltd. | Regeneration process of alkaline permanganate etching solution and unit therefor |
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2011
- 2011-08-26 DE DE102011111294.8A patent/DE102011111294B4/de active Active
-
2012
- 2012-08-24 WO PCT/EP2012/066475 patent/WO2013030098A1/en active Application Filing
- 2012-08-24 KR KR1020147004929A patent/KR101640693B1/ko active IP Right Grant
- 2012-08-24 TW TW101130875A patent/TWI550129B/zh active
- 2012-08-24 CN CN201280041619.6A patent/CN103764871B/zh active Active
- 2012-08-24 JP JP2014527598A patent/JP5905101B2/ja active Active
- 2012-08-24 AT ATA9312/2012A patent/AT515575B1/de active
Patent Citations (5)
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JPS61279688A (ja) * | 1985-05-31 | 1986-12-10 | モ−トン サイオコ−ル,インコ−ポレイテイド | 過マンガン酸塩エツチング浴の再生方法 |
JPH0253967U (ja) * | 1988-10-11 | 1990-04-18 | ||
JP2001234368A (ja) * | 2000-02-18 | 2001-08-31 | Hitachi Ltd | 回路基板の製造方法、エッチング方法及びエッチング装置 |
JP2010138434A (ja) * | 2008-12-10 | 2010-06-24 | Okuno Chem Ind Co Ltd | エッチング液の電解処理方法 |
JP2012067380A (ja) * | 2010-08-27 | 2012-04-05 | C Uyemura & Co Ltd | 電解再生処理装置 |
Also Published As
Publication number | Publication date |
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KR20140058577A (ko) | 2014-05-14 |
KR101640693B1 (ko) | 2016-07-18 |
DE102011111294B4 (de) | 2018-12-20 |
TWI550129B (zh) | 2016-09-21 |
CN103764871A (zh) | 2014-04-30 |
TW201323653A (zh) | 2013-06-16 |
AT515575A5 (de) | 2015-10-15 |
WO2013030098A1 (en) | 2013-03-07 |
AT515575B1 (de) | 2015-12-15 |
JP5905101B2 (ja) | 2016-04-20 |
DE102011111294A1 (de) | 2013-02-28 |
CN103764871B (zh) | 2016-08-17 |
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