PL3168326T5 - Sposób powlekania żywicy - Google Patents

Sposób powlekania żywicy

Info

Publication number
PL3168326T5
PL3168326T5 PL15819437.3T PL15819437T PL3168326T5 PL 3168326 T5 PL3168326 T5 PL 3168326T5 PL 15819437 T PL15819437 T PL 15819437T PL 3168326 T5 PL3168326 T5 PL 3168326T5
Authority
PL
Poland
Prior art keywords
plating method
resin plating
resin
plating
Prior art date
Application number
PL15819437.3T
Other languages
English (en)
Other versions
PL3168326T3 (pl
Inventor
Shingo Nagamine
Koji Kita
Kuniaki Otsuka
Original Assignee
Okuno Chemical Industries Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=55063946&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL3168326(T5) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Okuno Chemical Industries Co., Ltd. filed Critical Okuno Chemical Industries Co., Ltd.
Publication of PL3168326T3 publication Critical patent/PL3168326T3/pl
Publication of PL3168326T5 publication Critical patent/PL3168326T5/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
PL15819437.3T 2014-07-10 2015-04-24 Sposób powlekania żywicy PL3168326T5 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014142468 2014-07-10
PCT/JP2015/062485 WO2016006301A1 (ja) 2014-07-10 2015-04-24 樹脂めっき方法
EP15819437.3A EP3168326B2 (en) 2014-07-10 2015-04-24 Resin plating method

Publications (2)

Publication Number Publication Date
PL3168326T3 PL3168326T3 (pl) 2020-12-28
PL3168326T5 true PL3168326T5 (pl) 2024-02-05

Family

ID=55063946

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15819437.3T PL3168326T5 (pl) 2014-07-10 2015-04-24 Sposób powlekania żywicy

Country Status (11)

Country Link
US (1) US11047052B2 (pl)
EP (1) EP3168326B2 (pl)
JP (1) JP6142407B2 (pl)
KR (3) KR101970970B1 (pl)
CN (2) CN106471156B (pl)
ES (1) ES2828459T3 (pl)
MX (1) MX2017000375A (pl)
MY (1) MY164826A (pl)
PL (1) PL3168326T5 (pl)
SG (1) SG11201610462WA (pl)
WO (1) WO2016006301A1 (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3228729A1 (en) 2016-04-04 2017-10-11 COVENTYA S.p.A. Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath
EP3323910B1 (en) * 2016-11-22 2018-11-14 MacDermid Enthone GmbH Chromium-free plating-on-plastic etch
US20200407854A1 (en) * 2017-05-23 2020-12-31 Okuno Chemical Industries Co., Ltd. Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method
FR3083624B1 (fr) * 2018-07-06 2021-02-12 Aml Systems Element optique destine a modifier la repartition d'un faisceau lumineux, pour projecteur de vehicule automobile.
KR20210054078A (ko) 2019-11-02 2021-05-13 성시우 캡슐을 이용한 소방용 드론
BR112023003111A2 (pt) 2020-08-25 2023-04-04 Atotech Deutschland Gmbh & Co Kg Método para metalizar um substrato não metálico e composição de pré-tratamento
CN114457325B (zh) * 2021-12-30 2023-12-08 安徽中科元贞科技有限责任公司 一种镀镍高分子微球的镍层厚度控制方法
CN114525557B (zh) * 2022-03-01 2024-01-02 九牧厨卫股份有限公司 一种杀菌环保复合镀层及其制备方法和杀菌环保产品

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2185858A (en) † 1936-06-27 1940-01-02 Western Electric Co Method of removing gold, silver, palladium, or the like
US2875040A (en) * 1958-02-04 1959-02-24 Canadian Copper Refiners Ltd Process of separating palladium from metals of the platinum group
FR1596450A (pl) * 1968-10-12 1970-06-15
US3672875A (en) * 1969-09-05 1972-06-27 Grace W R & Co Extraction of fission product noble metals from spent nuclear fuels
US3891741A (en) * 1972-11-24 1975-06-24 Ppg Industries Inc Recovery of fission products from acidic waste solutions thereof
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
SE426178B (sv) † 1981-05-21 1982-12-13 Ericsson Telefon Ab L M Sett att pa kemiskt veg avskala skikt innehallande palladium och atminstone en av metallerna koppar och nickel
US4448811A (en) * 1981-12-30 1984-05-15 Omi International Corporation Oxidizing agent for acidic accelerator in electroless metal plating process
DE3823137C2 (de) * 1988-07-05 1993-12-02 Schering Ag Verfahren zur Ätzung von Epoxid-Harz
US5286530A (en) * 1993-01-13 1994-02-15 General Electric Company Method for providing adherent metal coatings on cyanate ester polymer surfaces
DE69624846T2 (de) * 1996-06-03 2003-03-20 Ebara Udylite Kk Lösung für stromlose kupferplattierung und verfahren zur stromlosen kupferplattierung
US6132938A (en) * 1997-11-06 2000-10-17 Mitsubishi Paper Mills Limited Process for making lithographic printing plate
JP2001059195A (ja) * 1999-08-23 2001-03-06 Matsuda Sangyo Co Ltd 白金族金属含有液中からの白金族金属の回収方法
JP3454765B2 (ja) * 1999-12-07 2003-10-06 住友大阪セメント株式会社 貴金属系触媒除去液
JP2002080693A (ja) * 2000-06-28 2002-03-19 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JP4649817B2 (ja) † 2000-07-26 2011-03-16 三菱瓦斯化学株式会社 パラジウム除去液およびパジジウムの除去方法
JP2002363761A (ja) * 2001-06-07 2002-12-18 Naoki Toriyama めっき方法
JP2003013244A (ja) † 2001-07-03 2003-01-15 Okuno Chem Ind Co Ltd 樹脂基材表面への無電解めっき用触媒付与方法
DE10148632C1 (de) * 2001-09-26 2003-06-05 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum galvanotechnischen Behandeln von Werkstücken mit einer Edelmetalle enthaltenden Flüssigkeit
JP3964189B2 (ja) * 2001-11-22 2007-08-22 住友大阪セメント株式会社 無電解メッキ用触媒および金属メッキパターンの形成方法
US7285229B2 (en) 2003-11-07 2007-10-23 Mec Company, Ltd. Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
JP4740711B2 (ja) 2005-10-11 2011-08-03 荏原ユージライト株式会社 Ｐｄ／Ｓｎコロイド触媒吸着促進剤
JP2007109706A (ja) * 2005-10-11 2007-04-26 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
RU2008127327A (ru) * 2005-12-06 2010-01-20 Ибара-Удилайт Ко., Лтд. (Jp) Комплексное соединение палладия и раствор для обеспечения каталитических свойств, содержащий его
EP2009142B8 (en) 2006-04-18 2013-08-14 Okuno Chemical Industries Co., Ltd. Composition for etching treatment of resin molded article
JP4275157B2 (ja) 2006-07-27 2009-06-10 荏原ユージライト株式会社 プラスチック表面の金属化方法
JP2008078251A (ja) * 2006-09-20 2008-04-03 Sumitomo Metal Electronics Devices Inc 複数個取り配線基板の製造方法
JP2008106354A (ja) 2006-09-25 2008-05-08 Mec Kk 金属除去液及びこれを用いた金属除去方法
TW200831710A (en) 2006-09-25 2008-08-01 Mec Co Ltd Metal removing solution and metal removing method using the same
EP2149622A4 (en) † 2007-05-22 2010-07-28 Okuno Chem Ind Co PRE-TREATMENT METHOD FOR ELECTRICALLY PLATING A RESIN FORM BODY, METHOD FOR PLATING A RESIN MOLD BODY AND PRE-TREATMENT AGENT
JP5131683B2 (ja) 2007-07-04 2013-01-30 奥野製薬工業株式会社 樹脂成形体のめっき処理に用いるめっき用治具
PL2025708T3 (pl) 2007-08-10 2010-03-31 Enthone Roztwór trawiący do powierzchni tworzyw sztucznych nie zawierający chromu
JP2009228083A (ja) 2008-03-25 2009-10-08 Ebara-Udylite Co Ltd プラスチック表面への金属めっき方法
JP5403535B2 (ja) * 2008-12-10 2014-01-29 奥野製薬工業株式会社 エッチング液の電解処理方法
CN102105020A (zh) 2009-12-16 2011-06-22 北大方正集团有限公司 一种印制电路板的制作方法和用于印制电路板的除钯方法
EP2360294B1 (de) * 2010-02-12 2013-05-15 Atotech Deutschland GmbH Verfahren zum Metallisieren von an der Oberfläche mindestens zwei verschiedene Kunststoffe aufweisenden Gegenständen
CN101892470A (zh) * 2010-07-19 2010-11-24 复旦大学 一种柔性聚酯覆镍电极的制备方法
DE102011111294B4 (de) * 2011-08-26 2018-12-20 Atotech Deutschland Gmbh Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung
US20130084395A1 (en) 2011-09-29 2013-04-04 Roshan V. Chapaneri Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media
EP2602357A1 (en) † 2011-12-05 2013-06-12 Atotech Deutschland GmbH Novel adhesion promoting agents for metallization of substrate surfaces
US10260000B2 (en) † 2012-01-23 2019-04-16 Macdermid Acumen, Inc. Etching of plastic using acidic solutions containing trivalent manganese
US9534306B2 (en) † 2012-01-23 2017-01-03 Macdermid Acumen, Inc. Electrolytic generation of manganese (III) ions in strong sulfuric acid
EP2639334A1 (de) † 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639332A1 (de) † 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) † 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2657367B1 (en) 2012-04-24 2015-11-25 Enthone Inc. Pre-etching composition and etching process for plastic substrates
EP2847363B1 (en) * 2012-05-07 2016-09-07 Cuptronic Technology Ltd. A process for application of metal
JP6203586B2 (ja) † 2012-09-28 2017-09-27 関東化學株式会社 ヨウ素系エッチング液およびエッチング方法
US8603352B1 (en) 2012-10-25 2013-12-10 Rohm and Haas Electroncis Materials LLC Chrome-free methods of etching organic polymers
CN104838044B (zh) 2012-11-15 2017-12-05 麦克德米德尖端有限公司 在强硫酸中电解产生锰(iii)离子
EP2767614A1 (en) 2013-02-13 2014-08-20 ATOTECH Deutschland GmbH Method for depositing a first metallic layer onto non-conductive polymers
US9267077B2 (en) 2013-04-16 2016-02-23 Rohm And Haas Electronic Materials Llc Chrome-free methods of etching organic polymers with mixed acid solutions
US20140318983A1 (en) 2013-04-25 2014-10-30 Macdermid Acumen, Inc. Regeneration of Etch Solutions Containing Trivalent Manganese in Acid Media
JP6142408B2 (ja) * 2015-03-13 2017-06-07 奥野製薬工業株式会社 治具用電解剥離剤

Also Published As

Publication number Publication date
PL3168326T3 (pl) 2020-12-28
EP3168326A4 (en) 2018-04-04
KR20180017243A (ko) 2018-02-20
CN106471156A (zh) 2017-03-01
EP3168326A1 (en) 2017-05-17
KR20180059581A (ko) 2018-06-04
US20170159183A1 (en) 2017-06-08
JPWO2016006301A1 (ja) 2017-04-27
CN106471156B (zh) 2021-11-26
MY164826A (en) 2018-01-30
WO2016006301A1 (ja) 2016-01-14
ES2828459T3 (es) 2021-05-26
MX2017000375A (es) 2017-08-14
CN110344033A (zh) 2019-10-18
EP3168326B2 (en) 2023-09-20
EP3168326B1 (en) 2020-07-29
US11047052B2 (en) 2021-06-29
SG11201610462WA (en) 2017-02-27
KR20170008309A (ko) 2017-01-23
KR101970970B1 (ko) 2019-04-22
JP6142407B2 (ja) 2017-06-07

Similar Documents

Publication Publication Date Title
GB201406151D0 (en) Method
GB201409558D0 (en) Method
GB201406155D0 (en) Method
GB201408119D0 (en) Method
GB201414496D0 (en) Method
GB201413240D0 (en) Method
SG11201610462WA (en) Resin plating method
SG10201504959UA (en) Plating method
GB201403470D0 (en) Method
GB201410022D0 (en) Method
GB201410101D0 (en) Method
GB201416675D0 (en) Method
GB201412802D0 (en) Method
GB201411500D0 (en) Method
GB201409128D0 (en) Method
GB201412736D0 (en) Method
GB201412226D0 (en) Method
GB201409234D0 (en) Method
GB201409101D0 (en) Method
GB201414431D0 (en) Improved electrodeposition
GB201414181D0 (en) Method
GB201413929D0 (en) Method
GB201413612D0 (en) Method
GB201408649D0 (en) Method
GB201416197D0 (en) Method