JP6185986B2 - 金属を塗布するための方法 - Google Patents
金属を塗布するための方法 Download PDFInfo
- Publication number
- JP6185986B2 JP6185986B2 JP2015510794A JP2015510794A JP6185986B2 JP 6185986 B2 JP6185986 B2 JP 6185986B2 JP 2015510794 A JP2015510794 A JP 2015510794A JP 2015510794 A JP2015510794 A JP 2015510794A JP 6185986 B2 JP6185986 B2 JP 6185986B2
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- JP
- Japan
- Prior art keywords
- photoinitiator
- metal
- substrate surface
- group
- polymerizable monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 title claims description 48
- 239000002184 metal Substances 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 43
- 239000000758 substrate Substances 0.000 claims description 59
- 229920000642 polymer Polymers 0.000 claims description 30
- 239000000178 monomer Substances 0.000 claims description 29
- 239000002904 solvent Substances 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 25
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 24
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 23
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 8
- 239000002105 nanoparticle Substances 0.000 claims description 8
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 8
- 150000002500 ions Chemical class 0.000 claims description 7
- 229910021645 metal ion Inorganic materials 0.000 claims description 7
- YNSNJGRCQCDRDM-UHFFFAOYSA-N 1-chlorothioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl YNSNJGRCQCDRDM-UHFFFAOYSA-N 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 150000003254 radicals Chemical class 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 claims description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 4
- 239000011976 maleic acid Substances 0.000 claims description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 4
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 2
- 150000004056 anthraquinones Chemical class 0.000 claims description 2
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 2
- 230000001939 inductive effect Effects 0.000 claims description 2
- 230000005764 inhibitory process Effects 0.000 claims description 2
- 239000002923 metal particle Substances 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 239000007870 radical polymerization initiator Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
- 229910052802 copper Inorganic materials 0.000 description 23
- 239000010949 copper Substances 0.000 description 23
- 239000008367 deionised water Substances 0.000 description 18
- 229910021641 deionized water Inorganic materials 0.000 description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
- 238000007747 plating Methods 0.000 description 14
- 239000010410 layer Substances 0.000 description 13
- 229910052763 palladium Inorganic materials 0.000 description 12
- -1 palladium (II) ions Chemical class 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000001035 drying Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 6
- 239000007921 spray Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 1
- 229940008309 acetone / ethanol Drugs 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FDXJPPBZXILFHH-UHFFFAOYSA-N ethanol;2-methylprop-2-enoic acid Chemical compound CCO.CC(=C)C(O)=O FDXJPPBZXILFHH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- LWJWQVZMJJTWAN-UHFFFAOYSA-N methanol;2-methylprop-2-enoic acid Chemical compound OC.CC(=C)C(O)=O LWJWQVZMJJTWAN-UHFFFAOYSA-N 0.000 description 1
- FSSWLSLBJRLZJE-UHFFFAOYSA-N methanol;prop-2-enoic acid Chemical compound OC.OC(=O)C=C FSSWLSLBJRLZJE-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002304 perfume Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
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- B05D7/54—No clear coat specified
- B05D7/548—No curing step for the last layer
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J2433/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
さらなる態様及び実施形態が、添付されている従属請求項中に規定されており、それらは参照することによりここに具体的に組み込まれる。
a)少なくとも1つの溶媒、少なくとも1つの重合可能なモノマー、及び少なくとも1つの光開始剤を含む混合物であって、前記少なくとも1つの光開始剤、前記少なくとも1つの重合可能なモノマー、及び前記少なくとも1つの溶媒が、結晶を全く含まない非晶質混合物を形成し、前記少なくとも1つの重合可能なモノマーが、重合して少なくとも1つのカルボキシル基を含むポリマーに重合化することができ、前記少なくとも1つの重合可能なモノマーが、前記混合物中でモノマーの形態をしている混合物を用意するステップと、
b)共有結合した水素原子を含む前記基材表面に、前記混合物を少なくとも部分的に塗布するステップと、
c)前記少なくとも1つの溶媒の少なくとも一部を蒸発させるステップと、
d)前記少なくとも1つの光開始剤が分解して少なくとも1つのフリーラジカルになるように、前記少なくとも1つのフリーラジカルが、前記少なくとも1つの重合可能なモノマーとの間で重合反応を開始し、前記基材表面上での前記共有結合した水素原子と前記少なくとも1つの重合可能なモノマーの一部分との間の反応を誘発して、前記基材表面にポリマーを調達し、前記ポリマーが少なくとも1つのカルボキシル基を含み、形成された前記ポリマーの少なくとも一部分が前記表面に共有結合するように、前記少なくとも1つの光開始剤に適合する波長の光を照射することによって、前記少なくとも1つの光開始剤を活性化させるステップと、
e)少なくとも1つの第2の金属のイオン及び少なくとも1つの第2の金属を含むナノ粒子であって、1から100nmまでの範囲の平均直径を有するナノ粒子からなる群から選択される少なくとも1つを塗布するステップと、
f)少なくとも1つの第2の金属のイオンが塗布されている場合、前記少なくとも1つの第2の金属のイオンを金属に少なくとも部分的に還元するステップと、
g)第1の金属を、前記少なくとも1つの第2の金属の還元されたイオン及び少なくとも1つの第2の金属を含むナノ粒子からなる群から選択される少なくとも1つの上に堆積させるステップと
を含む上記方法が提供される。
メタクリル酸+チオキサントン+メタノール
アクリル酸+チオキサントン+メタノール
メタクリル酸+クロロチオキサントン+エタノール
メタクリル酸+クロロチオキサントン+メタノール/エタノール(重量で1:1)
メタクリル酸+イソプロピルチオキサントン+アセトン/エタノール(重量で1:1)
アクリル酸+フルオレノン+メタノール/エタノール(重量で1:1)
マレイン酸+ベンゾフェノン+酢酸エチル
が挙げられるがこれらに限定されない。
メタクリル酸(1重量%)、チオキサントン(0.01重量%)及びメタノールからなるグラフト溶液が用意された。
アクリル酸(1.2重量%)、チオキサントン(0.01重量%)及びエタノールからなるグラフト溶液が用意された。
様々な時間−レーザー照射、マルチスキャンの後
様々な膜厚−銅浴中の時間
様々なパターンが、5μmから3cmまで範囲の線幅で作られた。
様々な材料:
主成分は、PA6(Rz<0.5μm)の高光沢表面上のメタクリル酸、アセトン、エタノール及びイソプロピルチオキサントンである。接着力において14N/cmを与える。
主成分は、30%のガラス繊維を充填したPA6(Rz<10μm)の表面上のアクリル酸、メタノール、エタノール、及びフルオレノンである。接着力において17N/cmを与える。
主成分は、30%のガラス繊維を充填したPA6(谷とピークの間が<2.0μm)の光沢表面上のマレイン酸、酢酸エチル、及びベンゾフェノン誘導体である。接着力において16N/cmを与える。
Claims (14)
- 基材表面に第1の金属を塗布するための方法であって、
a)少なくとも1つの溶媒、少なくとも1つの重合可能なモノマー、及び少なくとも1つの光開始剤を含む混合物であって、前記少なくとも1つの光開始剤、前記少なくとも1つの重合可能なモノマー、及び前記少なくとも1つの溶媒が、結晶を全く含まない非晶質混合物を形成し、前記少なくとも1つの重合可能なモノマーが、重合して少なくとも1つのカルボキシル基を含むポリマーに重合化することができ、前記少なくとも1つの重合可能なモノマーが、前記混合物中でモノマーの形態をしている混合物を用意するステップと、
b)共有結合した水素原子を含む前記基材表面に、前記混合物を少なくとも部分的に塗布するステップと、
c)前記少なくとも1つの溶媒の少なくとも一部を蒸発させるステップと、
d)前記少なくとも1つの光開始剤が分解して少なくとも1つのフリーラジカルになり、前記少なくとも1つのフリーラジカルが、前記少なくとも1つの重合可能なモノマーとの間で重合反応を開始し、前記基材表面上での前記共有結合した水素原子と前記少なくとも1つの重合可能なモノマーの一部分との間の反応を誘発して、前記基材表面にポリマーを調達し、前記ポリマーが少なくとも1つのカルボキシル基を含み、形成された前記ポリマーの少なくとも一部分が前記表面に共有結合するように、前記少なくとも1つの光開始剤に適合する波長の光を照射することによって、前記少なくとも1つの光開始剤を活性化させるステップと、
e)少なくとも1つの第2の金属のイオン及び少なくとも1つの第2の金属を含むナノ粒子であって、1から100nmまでの範囲の平均直径を有するナノ粒子からなる群から選択される少なくとも1つを塗布するステップと、
f)少なくとも1つの第2の金属のイオンが塗布されている場合、前記少なくとも1つの第2の金属のイオンを金属に少なくとも部分的に還元するステップと、
g)第1の金属を、前記少なくとも1つの第2の金属の還元されたイオン及び少なくとも1つの第2の金属を含むナノ粒子からなる群から選択される少なくとも1つの上に堆積させるステップと
を含む上記方法。 - ステップc)において、前記少なくとも1つの溶媒を、重量で計算して80%を超えるまで蒸発させる請求項1に記載の方法。
- 前記少なくとも1つの溶媒が、メタノール、エタノール、アセトン、酢酸エチル及びエチレングリコールからなる群から選択される少なくとも1つの溶媒である請求項1又は2に記載の方法。
- 前記少なくとも1つの重合可能なモノマーが、少なくとも1つのカルボン酸基を含む請求項1から3までのいずれか一項に記載の方法。
- 前記少なくとも1つの重合可能なモノマーが、メタクリル酸、アクリル酸、及びマレイン酸からなる群から選択される少なくとも1つである請求項1から4までのいずれか一項に記載の方法。
- 前記少なくとも1つの光開始剤が、アントラキノン、チオキサントン、イソプロピルチオキサントン、クロロチオキサントン、キサントン、ベンゾフェノン、及びフルオレノンからなる群から選択される少なくとも1つの光開始剤である請求項1から5までのいずれか一項に記載の方法。
- 前記少なくとも1つの光開始剤が、ステップd)において、前記基材表面上で所望のパターンでの光の照射によって活性化される請求項1から6までのいずれか一項に記載の方法。
- 前記少なくとも1つの光開始剤が、ステップd)において、レーザー光、集束レーザー光、及び集束光からなる群から選択される少なくとも1つのタイプの光の照射によって活性化される請求項1から7までのいずれか一項に記載の方法。
- 前記少なくとも1つの光開始剤が、ステップd)において、レーザー光、及び少なくとも1つのマスクと組み合わされている光から選択される少なくとも1つの照射によって活性化される請求項1から8までのいずれか一項に記載の方法。
- 請求項1におけるステップb、c、及びdの少なくとも1つが、ラジカル重合開始剤の酸素阻害を減らすために通常の大気と比較して低減された酸素濃度の環境中で実施される請求項1から9までのいずれか一項に記載の方法。
- 前記基材表面が、二次元の平面である請求項1から10までのいずれか一項に記載の方法。
- 前記基材表面が、三次元の表面である請求項1から10までのいずれか一項に記載の方法。
- 基材表面が、ステップb)の前にプラズマにより処理される請求項1から12までのいずれか一項に記載の方法。
- 表面に共有結合されていないポリマーの少なくとも一部分が、ステップd)の後に前記基材表面から洗い流される請求項1から13までのいずれか一項に記載の方法。
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