JP2014512693A5 - - Google Patents

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Publication number
JP2014512693A5
JP2014512693A5 JP2014506519A JP2014506519A JP2014512693A5 JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5 JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5
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JP
Japan
Prior art keywords
spectrum
spectra
different
instructions
transmission curves
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JP2014506519A
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English (en)
Japanese (ja)
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JP2014512693A (ja
JP6017538B2 (ja
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Priority claimed from US13/091,965 external-priority patent/US8547538B2/en
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Publication of JP2014512693A5 publication Critical patent/JP2014512693A5/ja
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JP2014506519A 2011-04-21 2012-04-18 環境の影響の変動を伴う基準スペクトルの構築 Active JP6017538B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/091,965 2011-04-21
US13/091,965 US8547538B2 (en) 2011-04-21 2011-04-21 Construction of reference spectra with variations in environmental effects
PCT/US2012/034109 WO2012145418A2 (en) 2011-04-21 2012-04-18 Construction of reference spectra with variations in environmental effects

Publications (3)

Publication Number Publication Date
JP2014512693A JP2014512693A (ja) 2014-05-22
JP2014512693A5 true JP2014512693A5 (enExample) 2015-06-11
JP6017538B2 JP6017538B2 (ja) 2016-11-02

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Family Applications (1)

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JP2014506519A Active JP6017538B2 (ja) 2011-04-21 2012-04-18 環境の影響の変動を伴う基準スペクトルの構築

Country Status (5)

Country Link
US (1) US8547538B2 (enExample)
JP (1) JP6017538B2 (enExample)
KR (1) KR101930111B1 (enExample)
TW (1) TWI465314B (enExample)
WO (1) WO2012145418A2 (enExample)

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US8747189B2 (en) * 2011-04-26 2014-06-10 Applied Materials, Inc. Method of controlling polishing
US10295329B2 (en) * 2011-08-01 2019-05-21 Nova Measuring Instruments Ltd. Monitoring system and method for verifying measurements in patterned structures
WO2013150290A1 (en) * 2012-04-05 2013-10-10 Renishaw Diagnostics Limited A method for calibrating spectroscopy apparatus and equipment for use in the method
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US9056383B2 (en) 2013-02-26 2015-06-16 Applied Materials, Inc. Path for probe of spectrographic metrology system
US20140242881A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Feed forward parameter values for use in theoretically generating spectra
TWI487888B (zh) * 2013-09-30 2015-06-11 Ind Tech Res Inst 掃描式光柵光譜儀
KR102497215B1 (ko) 2016-05-16 2023-02-07 삼성전자 주식회사 계측 설비의 스펙트럼 보정방법, 및 그 스펙트럼 보정방법을 기반으로 하는 소자의 계측방법과 제조방법
TWI733915B (zh) * 2016-10-10 2021-07-21 美商應用材料股份有限公司 控制基板的處理的方法,及其研磨系統和電腦程式產品
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
JP7532262B2 (ja) 2018-06-28 2024-08-13 アプライド マテリアルズ インコーポレイテッド 分光画像モニタリングのための機械学習システム向けのトレーニングスペクトルの生成
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
KR20220100046A (ko) * 2019-11-21 2022-07-14 램 리써치 코포레이션 제조 챔버들 내에서 이상 (anomalous) 플라즈마 이벤트들의 검출 및 위치 확인 (location)
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