JP2014512693A5 - - Google Patents

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Publication number
JP2014512693A5
JP2014512693A5 JP2014506519A JP2014506519A JP2014512693A5 JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5 JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5
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JP
Japan
Prior art keywords
spectrum
spectra
different
instructions
transmission curves
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JP2014506519A
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English (en)
Japanese (ja)
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JP2014512693A (ja
JP6017538B2 (ja
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Priority claimed from US13/091,965 external-priority patent/US8547538B2/en
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Publication of JP2014512693A5 publication Critical patent/JP2014512693A5/ja
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JP2014506519A 2011-04-21 2012-04-18 環境の影響の変動を伴う基準スペクトルの構築 Active JP6017538B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/091,965 US8547538B2 (en) 2011-04-21 2011-04-21 Construction of reference spectra with variations in environmental effects
US13/091,965 2011-04-21
PCT/US2012/034109 WO2012145418A2 (en) 2011-04-21 2012-04-18 Construction of reference spectra with variations in environmental effects

Publications (3)

Publication Number Publication Date
JP2014512693A JP2014512693A (ja) 2014-05-22
JP2014512693A5 true JP2014512693A5 (enExample) 2015-06-11
JP6017538B2 JP6017538B2 (ja) 2016-11-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014506519A Active JP6017538B2 (ja) 2011-04-21 2012-04-18 環境の影響の変動を伴う基準スペクトルの構築

Country Status (5)

Country Link
US (1) US8547538B2 (enExample)
JP (1) JP6017538B2 (enExample)
KR (1) KR101930111B1 (enExample)
TW (1) TWI465314B (enExample)
WO (1) WO2012145418A2 (enExample)

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WO2013150290A1 (en) * 2012-04-05 2013-10-10 Renishaw Diagnostics Limited A method for calibrating spectroscopy apparatus and equipment for use in the method
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US9056383B2 (en) 2013-02-26 2015-06-16 Applied Materials, Inc. Path for probe of spectrographic metrology system
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US10562148B2 (en) * 2016-10-10 2020-02-18 Applied Materials, Inc. Real time profile control for chemical mechanical polishing
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
US11507824B2 (en) 2018-06-28 2022-11-22 Applied Materials, Inc. Training spectrum generation for machine learning system for spectrographic monitoring
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
US12340992B2 (en) * 2019-11-21 2025-06-24 Lam Research Corporation Detection and location of anomalous plasma events in fabrication chambers
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US11544838B2 (en) * 2020-03-21 2023-01-03 Kla Corporation Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging
CN116490321B (zh) * 2020-09-15 2026-07-03 国立大学法人长冈技术科学大学 研磨状态解析预测程序、存储装置、阴极荧光装置以及研磨状态解析预测方法
CN121468390B (zh) * 2026-01-08 2026-04-28 华海清科(北京)科技有限公司 抛光终点检测方法、化学机械抛光设备及存储介质

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JP5654753B2 (ja) * 2007-02-23 2015-01-14 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ スペクトルを使用した研磨終了点の決定
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