JP2014512693A5 - - Google Patents

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Publication number
JP2014512693A5
JP2014512693A5 JP2014506519A JP2014506519A JP2014512693A5 JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5 JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5
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JP
Japan
Prior art keywords
spectrum
spectra
different
instructions
transmission curves
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JP2014506519A
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English (en)
Japanese (ja)
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JP6017538B2 (ja
JP2014512693A (ja
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Priority claimed from US13/091,965 external-priority patent/US8547538B2/en
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Publication of JP2014512693A5 publication Critical patent/JP2014512693A5/ja
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Publication of JP6017538B2 publication Critical patent/JP6017538B2/ja
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JP2014506519A 2011-04-21 2012-04-18 環境の影響の変動を伴う基準スペクトルの構築 Active JP6017538B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/091,965 2011-04-21
US13/091,965 US8547538B2 (en) 2011-04-21 2011-04-21 Construction of reference spectra with variations in environmental effects
PCT/US2012/034109 WO2012145418A2 (en) 2011-04-21 2012-04-18 Construction of reference spectra with variations in environmental effects

Publications (3)

Publication Number Publication Date
JP2014512693A JP2014512693A (ja) 2014-05-22
JP2014512693A5 true JP2014512693A5 (enExample) 2015-06-11
JP6017538B2 JP6017538B2 (ja) 2016-11-02

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ID=47021106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014506519A Active JP6017538B2 (ja) 2011-04-21 2012-04-18 環境の影響の変動を伴う基準スペクトルの構築

Country Status (5)

Country Link
US (1) US8547538B2 (enExample)
JP (1) JP6017538B2 (enExample)
KR (1) KR101930111B1 (enExample)
TW (1) TWI465314B (enExample)
WO (1) WO2012145418A2 (enExample)

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US8747189B2 (en) * 2011-04-26 2014-06-10 Applied Materials, Inc. Method of controlling polishing
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WO2013150290A1 (en) * 2012-04-05 2013-10-10 Renishaw Diagnostics Limited A method for calibrating spectroscopy apparatus and equipment for use in the method
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US9056383B2 (en) 2013-02-26 2015-06-16 Applied Materials, Inc. Path for probe of spectrographic metrology system
US20140242881A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Feed forward parameter values for use in theoretically generating spectra
TWI487888B (zh) * 2013-09-30 2015-06-11 Ind Tech Res Inst 掃描式光柵光譜儀
KR102497215B1 (ko) 2016-05-16 2023-02-07 삼성전자 주식회사 계측 설비의 스펙트럼 보정방법, 및 그 스펙트럼 보정방법을 기반으로 하는 소자의 계측방법과 제조방법
JP7044774B2 (ja) * 2016-10-10 2022-03-30 アプライド マテリアルズ インコーポレイテッド 化学機械研磨のためのリアルタイム・プロファイル制御
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
WO2020005770A1 (en) 2018-06-28 2020-01-02 Applied Materials, Inc. Training spectrum generation for machine learning system for spectrographic monitoring
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US11544838B2 (en) * 2020-03-21 2023-01-03 Kla Corporation Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging
EP4215312A4 (en) * 2020-09-15 2024-10-16 National University Corporation Nagaoka University of Technology Polishing state analysis prediction program, storage device, cathode luminescence device, and polishing state analysis prediction method

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JP5367246B2 (ja) * 2007-09-28 2013-12-11 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの研磨装置及び研磨方法
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra
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