JP2014512690A5 - - Google Patents

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Publication number
JP2014512690A5
JP2014512690A5 JP2014506491A JP2014506491A JP2014512690A5 JP 2014512690 A5 JP2014512690 A5 JP 2014512690A5 JP 2014506491 A JP2014506491 A JP 2014506491A JP 2014506491 A JP2014506491 A JP 2014506491A JP 2014512690 A5 JP2014512690 A5 JP 2014512690A5
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JP
Japan
Prior art keywords
sequence
polishing
values
substrate
spectrum
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JP2014506491A
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English (en)
Japanese (ja)
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JP2014512690A (ja
JP6030122B2 (ja
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Priority claimed from US13/090,972 external-priority patent/US8751033B2/en
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Publication of JP2014512690A5 publication Critical patent/JP2014512690A5/ja
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Publication of JP6030122B2 publication Critical patent/JP6030122B2/ja
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JP2014506491A 2011-04-20 2012-04-17 終点検出のためのスペクトル特徴の適応的追跡 Active JP6030122B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/090,972 2011-04-20
US13/090,972 US8751033B2 (en) 2008-11-14 2011-04-20 Adaptive tracking spectrum features for endpoint detection
PCT/US2012/033969 WO2012145336A2 (en) 2011-04-20 2012-04-17 Adaptively tracking spectrum features for endpoint detection

Publications (3)

Publication Number Publication Date
JP2014512690A JP2014512690A (ja) 2014-05-22
JP2014512690A5 true JP2014512690A5 (enExample) 2015-06-11
JP6030122B2 JP6030122B2 (ja) 2016-11-24

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JP2014506491A Active JP6030122B2 (ja) 2011-04-20 2012-04-17 終点検出のためのスペクトル特徴の適応的追跡

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Country Link
US (1) US8751033B2 (enExample)
JP (1) JP6030122B2 (enExample)
KR (1) KR101929072B1 (enExample)
WO (1) WO2012145336A2 (enExample)

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US9296084B2 (en) * 2012-07-19 2016-03-29 Applied Materials, Inc. Polishing control using weighting with default sequence
US20140030956A1 (en) * 2012-07-25 2014-01-30 Jimin Zhang Control of polishing of multiple substrates on the same platen in chemical mechanical polishing
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
US9482610B2 (en) * 2012-11-12 2016-11-01 Applied Materials, Inc. Techniques for matching spectra
US20140141696A1 (en) 2012-11-21 2014-05-22 Applied Materials, Inc. Polishing System with In-Sequence Sensor
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TWI848121B (zh) * 2019-06-10 2024-07-11 日商東京威力科創股份有限公司 基板處理裝置、基板檢查方法及記錄媒體
KR20220113493A (ko) * 2019-12-13 2022-08-12 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치, 연마 장치, 버프 처리 장치, 기판 세정 방법, 기판 처리 장치, 및 기계 학습기
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