JP2014512690A5 - - Google Patents

Download PDF

Info

Publication number
JP2014512690A5
JP2014512690A5 JP2014506491A JP2014506491A JP2014512690A5 JP 2014512690 A5 JP2014512690 A5 JP 2014512690A5 JP 2014506491 A JP2014506491 A JP 2014506491A JP 2014506491 A JP2014506491 A JP 2014506491A JP 2014512690 A5 JP2014512690 A5 JP 2014512690A5
Authority
JP
Japan
Prior art keywords
sequence
polishing
values
substrate
spectrum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014506491A
Other languages
English (en)
Japanese (ja)
Other versions
JP6030122B2 (ja
JP2014512690A (ja
Filing date
Publication date
Priority claimed from US13/090,972 external-priority patent/US8751033B2/en
Application filed filed Critical
Publication of JP2014512690A publication Critical patent/JP2014512690A/ja
Publication of JP2014512690A5 publication Critical patent/JP2014512690A5/ja
Application granted granted Critical
Publication of JP6030122B2 publication Critical patent/JP6030122B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014506491A 2011-04-20 2012-04-17 終点検出のためのスペクトル特徴の適応的追跡 Active JP6030122B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/090,972 2011-04-20
US13/090,972 US8751033B2 (en) 2008-11-14 2011-04-20 Adaptive tracking spectrum features for endpoint detection
PCT/US2012/033969 WO2012145336A2 (en) 2011-04-20 2012-04-17 Adaptively tracking spectrum features for endpoint detection

Publications (3)

Publication Number Publication Date
JP2014512690A JP2014512690A (ja) 2014-05-22
JP2014512690A5 true JP2014512690A5 (enExample) 2015-06-11
JP6030122B2 JP6030122B2 (ja) 2016-11-24

Family

ID=47042130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014506491A Active JP6030122B2 (ja) 2011-04-20 2012-04-17 終点検出のためのスペクトル特徴の適応的追跡

Country Status (4)

Country Link
US (1) US8751033B2 (enExample)
JP (1) JP6030122B2 (enExample)
KR (1) KR101929072B1 (enExample)
WO (1) WO2012145336A2 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5583137B2 (ja) 2008-11-26 2014-09-03 アプライド マテリアルズ インコーポレイテッド フィードバックおよびフィードフォワードプロセス制御のために光計測学を使用すること
US20120034844A1 (en) * 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
US8694144B2 (en) 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US9358660B2 (en) * 2011-11-07 2016-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Grinding wheel design with elongated teeth arrangement
US9960088B2 (en) 2011-11-07 2018-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. End point detection in grinding
US9168630B2 (en) * 2012-04-23 2015-10-27 Applied Materials, Inc. User-input functions for data sequences in polishing endpoint detection
US8563335B1 (en) 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US9011202B2 (en) 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9289875B2 (en) 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control
US9296084B2 (en) * 2012-07-19 2016-03-29 Applied Materials, Inc. Polishing control using weighting with default sequence
US20140030956A1 (en) * 2012-07-25 2014-01-30 Jimin Zhang Control of polishing of multiple substrates on the same platen in chemical mechanical polishing
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
US9482610B2 (en) * 2012-11-12 2016-11-01 Applied Materials, Inc. Techniques for matching spectra
US9227293B2 (en) 2012-11-21 2016-01-05 Applied Materials, Inc. Multi-platen multi-head polishing architecture
US8992286B2 (en) 2013-02-26 2015-03-31 Applied Materials, Inc. Weighted regression of thickness maps from spectral data
US9056383B2 (en) * 2013-02-26 2015-06-16 Applied Materials, Inc. Path for probe of spectrographic metrology system
TWI635929B (zh) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
JP6275421B2 (ja) * 2013-09-06 2018-02-07 株式会社荏原製作所 研磨方法および研磨装置
US9375824B2 (en) 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9490186B2 (en) 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
CN106471606B (zh) * 2014-07-16 2021-07-27 应用材料公司 利用沉积前测量的研磨
TWI807987B (zh) 2016-11-30 2023-07-01 美商應用材料股份有限公司 使用神經網路的光譜監測
JP7023063B2 (ja) * 2017-08-08 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
TWI828706B (zh) * 2018-06-20 2024-01-11 美商應用材料股份有限公司 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
TWI848121B (zh) * 2019-06-10 2024-07-11 日商東京威力科創股份有限公司 基板處理裝置、基板檢查方法及記錄媒體
US12485516B2 (en) * 2019-12-13 2025-12-02 Ebara Corporation Substrate cleaning apparatus, polishing apparatus, buffing apparatus, substrate cleaning method, substrate processing apparatus, and machine learning apparatus
US11890715B2 (en) 2020-06-24 2024-02-06 Applied Materials, Inc. Polishing carrier head with piezoelectric pressure control
US11794302B2 (en) 2020-12-15 2023-10-24 Applied Materials, Inc. Compensation for slurry composition in in-situ electromagnetic inductive monitoring
US12504364B2 (en) * 2021-03-03 2025-12-23 Applied Materials, Inc. In-situ monitoring to label training spectra for machine learning system for spectrographic monitoring
EP4301549A4 (en) 2021-03-05 2025-02-26 Applied Materials, Inc. CONTROLLING PROCESSING PARAMETERS DURING POLISHING OF A SUBSTRATE USING A COST FUNCTION OR EXPECTED FUTURE PARAMETER CHANGES

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8511835D0 (en) * 1985-05-10 1985-06-19 British Telecomm Adaptive digital filter
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
US6361646B1 (en) 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6503767B2 (en) 2000-12-19 2003-01-07 Speedfam-Ipec Corporation Process for monitoring a process, planarizing a surface, and for quantifying the results of a planarization process
JP2002359217A (ja) * 2001-05-31 2002-12-13 Omron Corp 研磨終点検出方法およびその装置
US7160739B2 (en) * 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US6431953B1 (en) 2001-08-21 2002-08-13 Cabot Microelectronics Corporation CMP process involving frequency analysis-based monitoring
US6609086B1 (en) * 2002-02-12 2003-08-19 Timbre Technologies, Inc. Profile refinement for integrated circuit metrology
JP2005159203A (ja) * 2003-11-28 2005-06-16 Hitachi Ltd 膜厚計測方法及びその装置、研磨レート算出方法並びにｃｍｐ加工方法及びその装置
JP4581427B2 (ja) * 2004-02-27 2010-11-17 富士電機システムズ株式会社 膜厚評価方法、研磨終点検出方法
JP2006186131A (ja) * 2004-12-28 2006-07-13 Renesas Technology Corp 化学的機械的研磨方法
JP2006286766A (ja) * 2005-03-31 2006-10-19 Nec Electronics Corp 化学的機械的研磨方法及び化学的機械的研磨システム
US8392012B2 (en) 2008-10-27 2013-03-05 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing
KR101324644B1 (ko) * 2005-08-22 2013-11-01 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
US7409260B2 (en) 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
WO2007051117A2 (en) * 2005-10-25 2007-05-03 Waters Investments Limited Baseline modeling in chromatography
JP2007220842A (ja) * 2006-02-16 2007-08-30 Renesas Technology Corp 半導体装置の製造方法、ウェハの研磨方法、および電極間隔の設定方法
TWI422798B (zh) * 2006-10-06 2014-01-11 荏原製作所股份有限公司 加工終點檢測方法、研磨方法及研磨裝置
JP5367246B2 (ja) * 2007-09-28 2013-12-11 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの研磨装置及び研磨方法
US8369978B2 (en) * 2008-09-04 2013-02-05 Applied Materials Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
US20100103422A1 (en) * 2008-10-27 2010-04-29 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
KR101616024B1 (ko) * 2008-10-27 2016-04-28 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 동안에 기판의 분광 사진 모니터링에 있어서의 적합도
US8352061B2 (en) * 2008-11-14 2013-01-08 Applied Materials, Inc. Semi-quantitative thickness determination

Similar Documents

Publication Publication Date Title
JP2014512690A5 (enExample)
WO2012019044A3 (en) Techniques for matching measured spectra to reference spectra for in-situ optical monitoring
JP2016538728A5 (enExample)
WO2009111156A3 (en) Advanced process sensing and control using near infrared spectral reflectometry
JP2016126817A5 (enExample)
WO2015112335A1 (en) Measurement of film thickness on an arbitrary substrate
WO2014141116A9 (en) Apparatus, methods and systems for measuring and detecting electrical discharge
WO2012054263A3 (en) Multiple matching reference spectra for in-situ optical monitoring
JP2017111842A5 (enExample)
WO2012047428A3 (en) Etch-resistant coating on sensor wafers for in-situ measurement
WO2012145336A3 (en) Adaptively tracking spectrum features for endpoint detection
JP2010519771A5 (enExample)
WO2012015694A3 (en) Detection of layer clearing using spectral monitoring
UA115271C2 (uk) Спосіб визначення вологовмісту шару смоли на несучій плиті
JP2016510953A5 (enExample)
FR2985019B1 (fr) Fluxmetre auto-etalonne
JP2018505400A5 (enExample)
WO2012012530A3 (en) Tracking spectrum features in two dimensions for endpoint detection
TW200631672A (en) Thickness measuring method for organic coating film on metal surface
JP2017515307A5 (enExample)
JP2015138864A5 (enExample)
JP2013219248A5 (enExample)
MX364526B (es) Elementos informáticos integrados con una superficie selectiva en frecuencia.
IL281902B (en) Double-stranded ribonucleic acid inhibiting expression of complement c5
WO2015075173A3 (en) Determination of battery type