WO2012054263A3 - Multiple matching reference spectra for in-situ optical monitoring - Google Patents

Multiple matching reference spectra for in-situ optical monitoring Download PDF

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Publication number
WO2012054263A3
WO2012054263A3 PCT/US2011/055814 US2011055814W WO2012054263A3 WO 2012054263 A3 WO2012054263 A3 WO 2012054263A3 US 2011055814 W US2011055814 W US 2011055814W WO 2012054263 A3 WO2012054263 A3 WO 2012054263A3
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WO
Grant status
Application
Patent type
Prior art keywords
value
polishing
sequence
plurality
best matching
Prior art date
Application number
PCT/US2011/055814
Other languages
French (fr)
Other versions
WO2012054263A2 (en )
Inventor
Harry Q. Lee
Wen-Chiang Tu
Zhihong Wang
Jimin Zhang
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Abstract

A method of controlling polishing includes storing a plurality libraries, each library including a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching first reference spectrum from a first library from the plurality of libraries and finding a best matching second reference spectrum from a different second library from the plurality of libraries, determining a first value associated with the best matching first reference spectrum and determining a second value from the best matching second reference spectrum, and calculating a third value from the first value and the second value to generate a sequence of calculated third values. At least one of a polishing endpoint or an adjustment for a polishing rate can be determined based on the sequence of calculated third values.
PCT/US2011/055814 2010-10-20 2011-10-11 Multiple matching reference spectra for in-situ optical monitoring WO2012054263A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US40511010 true 2010-10-20 2010-10-20
US61/405,110 2010-10-20

Publications (2)

Publication Number Publication Date
WO2012054263A2 true WO2012054263A2 (en) 2012-04-26
WO2012054263A3 true true WO2012054263A3 (en) 2012-06-28

Family

ID=45973416

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/055814 WO2012054263A3 (en) 2010-10-20 2011-10-11 Multiple matching reference spectra for in-situ optical monitoring

Country Status (2)

Country Link
US (1) US20120100781A1 (en)
WO (1) WO2012054263A3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8755928B2 (en) * 2011-04-27 2014-06-17 Applied Materials, Inc. Automatic selection of reference spectra library
US20140242877A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Spectrographic metrology with multiple measurements
US9679823B2 (en) * 2013-03-15 2017-06-13 Applied Materials, Inc. Metric for recognizing correct library spectrum

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030184732A1 (en) * 2002-03-29 2003-10-02 Lam Research System and method of broad band optical end point detection for film change indication
US20080206993A1 (en) * 2007-02-23 2008-08-28 Lee Harry Q Using Spectra to Determine Polishing Endpoints
US20100105288A1 (en) * 2008-10-27 2010-04-29 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing
US20100261413A1 (en) * 2006-12-15 2010-10-14 Applied Materials, Inc. Determining Physical Property of Substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000060650A1 (en) * 1999-03-31 2000-10-12 Nikon Corporation Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device
US7840375B2 (en) * 2007-04-02 2010-11-23 Applied Materials, Inc. Methods and apparatus for generating a library of spectra
KR101668675B1 (en) * 2008-09-04 2016-10-24 어플라이드 머티어리얼스, 인코포레이티드 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
US20100120331A1 (en) * 2008-11-07 2010-05-13 Applied Materials, Inc. Endpoint control of multiple-wafer chemical mechanical polishing
US8666665B2 (en) * 2010-06-07 2014-03-04 Applied Materials, Inc. Automatic initiation of reference spectra library generation for optical monitoring
US8942842B2 (en) * 2011-04-28 2015-01-27 Applied Materials, Inc. Varying optical coefficients to generate spectra for polishing control
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
US20140024293A1 (en) * 2012-07-19 2014-01-23 Jimin Zhang Control Of Overpolishing Of Multiple Substrates On the Same Platen In Chemical Mechanical Polishing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030184732A1 (en) * 2002-03-29 2003-10-02 Lam Research System and method of broad band optical end point detection for film change indication
US20100261413A1 (en) * 2006-12-15 2010-10-14 Applied Materials, Inc. Determining Physical Property of Substrate
US20080206993A1 (en) * 2007-02-23 2008-08-28 Lee Harry Q Using Spectra to Determine Polishing Endpoints
US20100105288A1 (en) * 2008-10-27 2010-04-29 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing

Also Published As

Publication number Publication date Type
WO2012054263A2 (en) 2012-04-26 application
US20120100781A1 (en) 2012-04-26 application

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