JP2014130881A5 - - Google Patents

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Publication number
JP2014130881A5
JP2014130881A5 JP2012287119A JP2012287119A JP2014130881A5 JP 2014130881 A5 JP2014130881 A5 JP 2014130881A5 JP 2012287119 A JP2012287119 A JP 2012287119A JP 2012287119 A JP2012287119 A JP 2012287119A JP 2014130881 A5 JP2014130881 A5 JP 2014130881A5
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JP
Japan
Prior art keywords
polishing
unit
cleaning
gas
pure water
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Pending
Application number
JP2012287119A
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English (en)
Japanese (ja)
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JP2014130881A (ja
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Publication date
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Priority to JP2012287119A priority Critical patent/JP2014130881A/ja
Priority claimed from JP2012287119A external-priority patent/JP2014130881A/ja
Priority to KR1020130157709A priority patent/KR101604519B1/ko
Priority to US14/139,764 priority patent/US9162337B2/en
Priority to TW102147895A priority patent/TWI564112B/zh
Publication of JP2014130881A publication Critical patent/JP2014130881A/ja
Publication of JP2014130881A5 publication Critical patent/JP2014130881A5/ja
Pending legal-status Critical Current

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JP2012287119A 2012-12-28 2012-12-28 研磨装置 Pending JP2014130881A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012287119A JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置
KR1020130157709A KR101604519B1 (ko) 2012-12-28 2013-12-18 연마 장치
US14/139,764 US9162337B2 (en) 2012-12-28 2013-12-23 Polishing apparatus
TW102147895A TWI564112B (zh) 2012-12-28 2013-12-24 研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012287119A JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置

Publications (2)

Publication Number Publication Date
JP2014130881A JP2014130881A (ja) 2014-07-10
JP2014130881A5 true JP2014130881A5 (enExample) 2015-12-03

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ID=51017685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012287119A Pending JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置

Country Status (4)

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US (1) US9162337B2 (enExample)
JP (1) JP2014130881A (enExample)
KR (1) KR101604519B1 (enExample)
TW (1) TWI564112B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6587379B2 (ja) * 2014-09-01 2019-10-09 株式会社荏原製作所 研磨装置
WO2017139079A1 (en) * 2016-02-12 2017-08-17 Applied Materials, Inc. In-situ temperature control during chemical mechanical polishing with a condensed gas
US9962805B2 (en) * 2016-04-22 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
CN108818278B (zh) * 2018-06-25 2020-05-19 浙江铁流离合器股份有限公司 一种机械联动式的可调型离合器摩擦片抛光装置
JP7287987B2 (ja) 2018-06-27 2023-06-06 アプライド マテリアルズ インコーポレイテッド 化学機械研磨の温度制御
TWI885783B (zh) 2019-02-20 2025-06-01 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
US11628478B2 (en) 2019-05-29 2023-04-18 Applied Materials, Inc. Steam cleaning of CMP components
TWI859239B (zh) 2019-05-29 2024-10-21 美商應用材料股份有限公司 用於化學機械研磨系統的蒸氣處置站的設備及方法
US11633833B2 (en) 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
TWI872101B (zh) 2019-08-13 2025-02-11 美商應用材料股份有限公司 Cmp溫度控制的裝置及方法
KR20240165485A (ko) 2020-06-29 2024-11-22 어플라이드 머티어리얼스, 인코포레이티드 Cmp에서의 온도 및 슬러리 유량 제어
WO2022006008A1 (en) 2020-06-29 2022-01-06 Applied Materials, Inc. Control of steam generation for chemical mechanical polishing
US11577358B2 (en) 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
WO2022006160A1 (en) 2020-06-30 2022-01-06 Applied Materials, Inc. Apparatus and method for cmp temperature control
CN111975471A (zh) * 2020-08-19 2020-11-24 蚌埠知博自动化技术开发有限公司 一种金属材料表面处理的超声波表面强化处理设备

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5607718A (en) 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
US5384989A (en) 1993-04-12 1995-01-31 Shibano; Yoshihide Method of ultrasonically grinding workpiece
JP3438388B2 (ja) * 1995-03-16 2003-08-18 ソニー株式会社 化学的機械研磨方法および化学的機械研磨装置
US5885134A (en) * 1996-04-18 1999-03-23 Ebara Corporation Polishing apparatus
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
JPH10323631A (ja) * 1997-05-23 1998-12-08 Ebara Corp 洗浄部材のセルフクリーニング装置
US5888124A (en) * 1997-09-26 1999-03-30 Vanguard International Semiconductor Corporation Apparatus for polishing and cleaning a wafer
JP3452471B2 (ja) * 1997-09-29 2003-09-29 アルプス電気株式会社 純水供給システム、洗浄装置及びガス溶解装置
US6227944B1 (en) * 1999-03-25 2001-05-08 Memc Electronics Materials, Inc. Method for processing a semiconductor wafer
JP4440237B2 (ja) * 1999-05-17 2010-03-24 株式会社荏原製作所 ドレッシング装置
KR100304706B1 (ko) * 1999-06-16 2001-11-01 윤종용 화학기계적 연마장치 및 연마 헤드 내부의 오염 물질 세척방법
US6358119B1 (en) * 1999-06-21 2002-03-19 Taiwan Semiconductor Manufacturing Company Way to remove CU line damage after CU CMP
JP2001038614A (ja) * 1999-07-26 2001-02-13 Ebara Corp 研磨装置
JP2001113455A (ja) * 1999-10-14 2001-04-24 Sony Corp 化学的機械研磨装置及び方法
JP2002052370A (ja) * 2000-08-09 2002-02-19 Ebara Corp 基板洗浄装置
US6811805B2 (en) * 2001-05-30 2004-11-02 Novatis Ag Method for applying a coating
JP2004273961A (ja) * 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP2004296463A (ja) * 2003-03-25 2004-10-21 Mitsubishi Electric Corp 洗浄方法および洗浄装置
EP1635960A2 (en) * 2003-06-06 2006-03-22 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
JP4643582B2 (ja) * 2003-06-11 2011-03-02 アクリオン テクノロジーズ インク 過飽和の洗浄溶液を使用したメガソニック洗浄
TWI340060B (en) * 2003-11-20 2011-04-11 Doi Toshiro Polishing apparatus and method of polishing work piece
TWI352645B (en) * 2004-05-28 2011-11-21 Ebara Corp Apparatus for inspecting and polishing substrate r
JP2005012238A (ja) * 2004-09-02 2005-01-13 Ebara Corp 基板洗浄方法及び装置
JP2007290111A (ja) * 2006-03-29 2007-11-08 Ebara Corp 研磨方法および研磨装置
US7913705B2 (en) * 2007-02-07 2011-03-29 Tbw Industries, Inc. Cleaning cup system for chemical mechanical planarization apparatus
JP2008302478A (ja) * 2007-06-08 2008-12-18 Tokyo Seimitsu Co Ltd 研磨ヘッドの洗浄装置及び洗浄方法
SG148960A1 (en) * 2007-06-15 2009-01-29 Tokyo Electron Ltd Substrate cleaning method and substrate cleaning apparatus
JP5365522B2 (ja) * 2008-07-03 2013-12-11 旭硝子株式会社 ガラス基板の研磨方法及び製造方法
JP4532580B2 (ja) * 2008-08-20 2010-08-25 株式会社カイジョー 超音波洗浄装置
JP2010234298A (ja) * 2009-03-31 2010-10-21 Kurita Water Ind Ltd ガス溶解水供給装置及びガス溶解水の製造方法
US20100291841A1 (en) * 2009-05-14 2010-11-18 Chien-Min Sung Methods and Systems for Water Jet Assisted CMP Processing
JP5585076B2 (ja) * 2009-12-24 2014-09-10 栗田工業株式会社 洗浄方法
JP5866227B2 (ja) * 2012-02-23 2016-02-17 株式会社荏原製作所 基板洗浄方法

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