JP2014130881A5 - - Google Patents

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Publication number
JP2014130881A5
JP2014130881A5 JP2012287119A JP2012287119A JP2014130881A5 JP 2014130881 A5 JP2014130881 A5 JP 2014130881A5 JP 2012287119 A JP2012287119 A JP 2012287119A JP 2012287119 A JP2012287119 A JP 2012287119A JP 2014130881 A5 JP2014130881 A5 JP 2014130881A5
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JP
Japan
Prior art keywords
polishing
unit
cleaning
gas
pure water
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Pending
Application number
JP2012287119A
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English (en)
Japanese (ja)
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JP2014130881A (ja
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Publication date
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Priority to JP2012287119A priority Critical patent/JP2014130881A/ja
Priority claimed from JP2012287119A external-priority patent/JP2014130881A/ja
Priority to KR1020130157709A priority patent/KR101604519B1/ko
Priority to US14/139,764 priority patent/US9162337B2/en
Priority to TW102147895A priority patent/TWI564112B/zh
Publication of JP2014130881A publication Critical patent/JP2014130881A/ja
Publication of JP2014130881A5 publication Critical patent/JP2014130881A5/ja
Pending legal-status Critical Current

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JP2012287119A 2012-12-28 2012-12-28 研磨装置 Pending JP2014130881A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012287119A JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置
KR1020130157709A KR101604519B1 (ko) 2012-12-28 2013-12-18 연마 장치
US14/139,764 US9162337B2 (en) 2012-12-28 2013-12-23 Polishing apparatus
TW102147895A TWI564112B (zh) 2012-12-28 2013-12-24 研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012287119A JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置

Publications (2)

Publication Number Publication Date
JP2014130881A JP2014130881A (ja) 2014-07-10
JP2014130881A5 true JP2014130881A5 (enExample) 2015-12-03

Family

ID=51017685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012287119A Pending JP2014130881A (ja) 2012-12-28 2012-12-28 研磨装置

Country Status (4)

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US (1) US9162337B2 (enExample)
JP (1) JP2014130881A (enExample)
KR (1) KR101604519B1 (enExample)
TW (1) TWI564112B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6587379B2 (ja) * 2014-09-01 2019-10-09 株式会社荏原製作所 研磨装置
WO2017139079A1 (en) * 2016-02-12 2017-08-17 Applied Materials, Inc. In-situ temperature control during chemical mechanical polishing with a condensed gas
US9962805B2 (en) * 2016-04-22 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
CN108818278B (zh) * 2018-06-25 2020-05-19 浙江铁流离合器股份有限公司 一种机械联动式的可调型离合器摩擦片抛光装置
KR20250004341A (ko) 2018-06-27 2025-01-07 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마의 온도 제어
TWI885783B (zh) 2019-02-20 2025-06-01 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
US11628478B2 (en) 2019-05-29 2023-04-18 Applied Materials, Inc. Steam cleaning of CMP components
US11633833B2 (en) 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
TWI859239B (zh) 2019-05-29 2024-10-21 美商應用材料股份有限公司 用於化學機械研磨系統的蒸氣處置站的設備及方法
TWI872101B (zh) 2019-08-13 2025-02-11 美商應用材料股份有限公司 Cmp溫度控制的裝置及方法
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
CN115103738A (zh) 2020-06-29 2022-09-23 应用材料公司 Cmp中的温度和浆体流动速率控制
CN115066316B (zh) 2020-06-29 2024-09-27 应用材料公司 控制化学机械抛光的蒸汽产生
KR20250004369A (ko) 2020-06-30 2025-01-07 어플라이드 머티어리얼스, 인코포레이티드 Cmp 온도 제어를 위한 장치 및 방법
US11577358B2 (en) 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
CN111975471A (zh) * 2020-08-19 2020-11-24 蚌埠知博自动化技术开发有限公司 一种金属材料表面处理的超声波表面强化处理设备

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