JP2013524007A5 - - Google Patents
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- Publication number
- JP2013524007A5 JP2013524007A5 JP2013501631A JP2013501631A JP2013524007A5 JP 2013524007 A5 JP2013524007 A5 JP 2013524007A5 JP 2013501631 A JP2013501631 A JP 2013501631A JP 2013501631 A JP2013501631 A JP 2013501631A JP 2013524007 A5 JP2013524007 A5 JP 2013524007A5
- Authority
- JP
- Japan
- Prior art keywords
- spray nozzle
- substrate
- spacing
- fluid
- spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010013909A DE102010013909A1 (de) | 2010-04-01 | 2010-04-01 | Vorrichtung und Verfahren zum Besprühen einer Oberfläche eines Substrates |
| DE102010013909.2 | 2010-04-01 | ||
| PCT/DE2011/000350 WO2011120509A1 (de) | 2010-04-01 | 2011-03-31 | Vorrichtung und verfahren zum besprühen einer oberfläche eines substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013524007A JP2013524007A (ja) | 2013-06-17 |
| JP2013524007A5 true JP2013524007A5 (enExample) | 2013-09-05 |
Family
ID=44260390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013501631A Pending JP2013524007A (ja) | 2010-04-01 | 2011-03-31 | 基板の表面をスプレー処理する装置及び方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130011568A1 (enExample) |
| EP (1) | EP2553146A1 (enExample) |
| JP (1) | JP2013524007A (enExample) |
| KR (1) | KR20130018842A (enExample) |
| CN (1) | CN103097584A (enExample) |
| DE (1) | DE102010013909A1 (enExample) |
| WO (1) | WO2011120509A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5762915B2 (ja) * | 2011-10-11 | 2015-08-12 | 株式会社ケミトロン | エッチング方法及びエッチング装置 |
| KR101622211B1 (ko) * | 2013-04-11 | 2016-05-18 | 가부시키가이샤 케미토론 | 에칭방법 및 에칭장치 |
| DE102022203298A1 (de) | 2022-04-01 | 2023-10-05 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zur chemischen Bearbeitung einer Oberfläche |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8527578D0 (en) * | 1985-11-08 | 1985-12-11 | Finishing Services Ltd | Etching machines |
| JP2573396B2 (ja) * | 1990-06-15 | 1997-01-22 | 松下電工株式会社 | エッチング並びに現像方法 |
| JPH07231155A (ja) * | 1994-02-16 | 1995-08-29 | Fujitsu Ltd | プリント配線板のエッチング装置及びエッチング方法 |
| DE19513721C2 (de) * | 1995-04-11 | 1998-12-10 | Schweizer Electronic Ag | Vorrichtung und Verfahren zum präzisen Ätzen von Leiterplatten und Formatätzteilen |
| JP3079027B2 (ja) * | 1995-11-28 | 2000-08-21 | インターナショナル・ビジネス・マシーンズ・コーポレ−ション | ウエットエッチング方法、ウエットエッチング装置 |
| JP2004095616A (ja) * | 2002-08-29 | 2004-03-25 | Mitsui High Tec Inc | リードフレームのエッチング加工方法及びその装置 |
| JP2004158801A (ja) * | 2002-11-08 | 2004-06-03 | Shibaura Mechatronics Corp | エッチング方法及びエッチング装置 |
| JP4421956B2 (ja) * | 2003-07-18 | 2010-02-24 | 芝浦メカトロニクス株式会社 | 基板の処理装置及び処理方法 |
| FR2876863B1 (fr) * | 2004-10-19 | 2007-01-12 | Saint Gobain | Dispositif de gravure d'une couche conductrice et procede de gravure |
| CN101113522A (zh) * | 2006-07-28 | 2008-01-30 | 富葵精密组件(深圳)有限公司 | 用于印刷电路板蚀刻的喷蚀装置 |
| KR100960969B1 (ko) * | 2007-12-20 | 2010-06-03 | 주식회사 탑 엔지니어링 | 페이스트 디스펜서의 페이스트 도포 방법 |
-
2010
- 2010-04-01 DE DE102010013909A patent/DE102010013909A1/de not_active Ceased
-
2011
- 2011-03-31 EP EP11722992A patent/EP2553146A1/de not_active Withdrawn
- 2011-03-31 US US13/638,162 patent/US20130011568A1/en not_active Abandoned
- 2011-03-31 WO PCT/DE2011/000350 patent/WO2011120509A1/de not_active Ceased
- 2011-03-31 JP JP2013501631A patent/JP2013524007A/ja active Pending
- 2011-03-31 KR KR1020127028821A patent/KR20130018842A/ko not_active Withdrawn
- 2011-03-31 CN CN2011800177824A patent/CN103097584A/zh active Pending
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