JP2009542450A5 - - Google Patents

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Publication number
JP2009542450A5
JP2009542450A5 JP2009518460A JP2009518460A JP2009542450A5 JP 2009542450 A5 JP2009542450 A5 JP 2009542450A5 JP 2009518460 A JP2009518460 A JP 2009518460A JP 2009518460 A JP2009518460 A JP 2009518460A JP 2009542450 A5 JP2009542450 A5 JP 2009542450A5
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JP
Japan
Prior art keywords
polishing pad
fluid
upstream
director
disposed
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JP2009518460A
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English (en)
Japanese (ja)
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JP2009542450A (ja
JP5020317B2 (ja
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Priority claimed from US11/475,639 external-priority patent/US7452264B2/en
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Publication of JP2009542450A publication Critical patent/JP2009542450A/ja
Publication of JP2009542450A5 publication Critical patent/JP2009542450A5/ja
Application granted granted Critical
Publication of JP5020317B2 publication Critical patent/JP5020317B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009518460A 2006-06-27 2007-06-20 パッドクリーニング方法 Expired - Fee Related JP5020317B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/475,639 2006-06-27
US11/475,639 US7452264B2 (en) 2006-06-27 2006-06-27 Pad cleaning method
PCT/US2007/071701 WO2008002811A2 (en) 2006-06-27 2007-06-20 Pad cleaning method

Publications (3)

Publication Number Publication Date
JP2009542450A JP2009542450A (ja) 2009-12-03
JP2009542450A5 true JP2009542450A5 (enExample) 2011-08-18
JP5020317B2 JP5020317B2 (ja) 2012-09-05

Family

ID=38846417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009518460A Expired - Fee Related JP5020317B2 (ja) 2006-06-27 2007-06-20 パッドクリーニング方法

Country Status (4)

Country Link
US (1) US7452264B2 (enExample)
JP (1) JP5020317B2 (enExample)
TW (1) TWI354584B (enExample)
WO (1) WO2008002811A2 (enExample)

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US11717936B2 (en) * 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
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US12138741B2 (en) 2019-04-04 2024-11-12 Applied Materials, Inc. Polishing fluid collection apparatus and methods related thereto
US11712778B2 (en) 2019-08-23 2023-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization tool
US12240078B2 (en) 2020-06-24 2025-03-04 Applied Materials, Inc. Cleaning system for polishing liquid delivery arm
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
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CN112588682B (zh) * 2020-12-16 2024-07-02 无锡先导智能装备股份有限公司 清洗装置
CN116000816A (zh) * 2022-11-21 2023-04-25 北京晶亦精微科技股份有限公司 适于清洗研磨垫沟槽内废弃物的腔室结构及清洗方法
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