JP5020317B2 - パッドクリーニング方法 - Google Patents

パッドクリーニング方法 Download PDF

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Publication number
JP5020317B2
JP5020317B2 JP2009518460A JP2009518460A JP5020317B2 JP 5020317 B2 JP5020317 B2 JP 5020317B2 JP 2009518460 A JP2009518460 A JP 2009518460A JP 2009518460 A JP2009518460 A JP 2009518460A JP 5020317 B2 JP5020317 B2 JP 5020317B2
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Japan
Prior art keywords
pad
fluid
polishing pad
polishing
cleaning
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Expired - Fee Related
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JP2009518460A
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Japanese (ja)
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JP2009542450A (ja
JP2009542450A5 (enExample
Inventor
ラシッド エー． マヴリーヴ，
ハン チー チェン，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2009518460A 2006-06-27 2007-06-20 パッドクリーニング方法 Expired - Fee Related JP5020317B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/475,639 2006-06-27
US11/475,639 US7452264B2 (en) 2006-06-27 2006-06-27 Pad cleaning method
PCT/US2007/071701 WO2008002811A2 (en) 2006-06-27 2007-06-20 Pad cleaning method

Publications (3)

Publication Number Publication Date
JP2009542450A JP2009542450A (ja) 2009-12-03
JP2009542450A5 JP2009542450A5 (enExample) 2011-08-18
JP5020317B2 true JP5020317B2 (ja) 2012-09-05

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ID=38846417

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JP2009518460A Expired - Fee Related JP5020317B2 (ja) 2006-06-27 2007-06-20 パッドクリーニング方法

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US (1) US7452264B2 (enExample)
JP (1) JP5020317B2 (enExample)
TW (1) TWI354584B (enExample)
WO (1) WO2008002811A2 (enExample)

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CN108284383B (zh) * 2017-01-09 2021-02-26 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨装置及化学机械研磨方法
CN110352115A (zh) * 2017-03-06 2019-10-18 应用材料公司 为cmp位置特定研磨(lsp)设计的螺旋及同心圆移动
US10593603B2 (en) 2018-03-16 2020-03-17 Sandisk Technologies Llc Chemical mechanical polishing apparatus containing hydraulic multi-chamber bladder and method of using thereof
JP7083722B2 (ja) * 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7162465B2 (ja) 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
US11717936B2 (en) * 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
CN109333337A (zh) * 2018-11-19 2019-02-15 深圳市华星光电技术有限公司 研磨装置及研磨方法
US12138741B2 (en) 2019-04-04 2024-11-12 Applied Materials, Inc. Polishing fluid collection apparatus and methods related thereto
US11712778B2 (en) 2019-08-23 2023-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization tool
US12240078B2 (en) 2020-06-24 2025-03-04 Applied Materials, Inc. Cleaning system for polishing liquid delivery arm
US11794305B2 (en) 2020-09-28 2023-10-24 Applied Materials, Inc. Platen surface modification and high-performance pad conditioning to improve CMP performance
KR20220073192A (ko) 2020-11-26 2022-06-03 에스케이실트론 주식회사 연마 패드 세정 장치 및 연마 장치
CN112588682B (zh) * 2020-12-16 2024-07-02 无锡先导智能装备股份有限公司 清洗装置
CN116000816A (zh) * 2022-11-21 2023-04-25 北京晶亦精微科技股份有限公司 适于清洗研磨垫沟槽内废弃物的腔室结构及清洗方法
CN118073239B (zh) * 2024-02-27 2024-12-20 无锡海浥半导体科技有限公司 利用多喷嘴递进式硅片清洗装置的清洗硅片的方法

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Also Published As

Publication number Publication date
US7452264B2 (en) 2008-11-18
TW200817103A (en) 2008-04-16
WO2008002811B1 (en) 2008-12-24
TWI354584B (en) 2011-12-21
JP2009542450A (ja) 2009-12-03
WO2008002811A3 (en) 2008-11-06
WO2008002811A2 (en) 2008-01-03
US20070298692A1 (en) 2007-12-27

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