JP2014107489A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2014107489A JP2014107489A JP2012261126A JP2012261126A JP2014107489A JP 2014107489 A JP2014107489 A JP 2014107489A JP 2012261126 A JP2012261126 A JP 2012261126A JP 2012261126 A JP2012261126 A JP 2012261126A JP 2014107489 A JP2014107489 A JP 2014107489A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
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- 241000933095 Neotragus moschatus Species 0.000 description 3
- 229910020935 Sn-Sb Inorganic materials 0.000 description 3
- 229910008433 SnCU Inorganic materials 0.000 description 3
- 229910008757 Sn—Sb Inorganic materials 0.000 description 3
- 229910007570 Zn-Al Inorganic materials 0.000 description 3
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Abstract
【解決手段】半導体装置10は、半導体素子20と、低強度層40と、接合層50と、導電板60を備える。半導体素子20は、半導体基板22と、半導体基板22の表裏面のそれぞれに設けられた電極層30を有している。低強度層40は、電極層30の表面に設けられている。接合層50は、低強度層40の表面に設けられている。導電板60は、接合層50の表面に設けられている。接合層50の強度は、電極層30の強度よりも高く、低強度層40の強度は、電極層30の強度よりも低い。
【選択図】図1
Description
続いて、本発明者が、本実施例の半導体装置10の作用効果を確認するために、半導体装置10について行った実験について説明する。この例では、以下の実施例1〜6に示すように、様々な接合層50を有する半導体装置10を準備し、それぞれについて、200℃〜−40℃の冷熱サイクルを3000サイクル繰り返し、破損箇所を検証した。また、比較のため、以下の比較例1〜6に示すように、様々な接合層50を有するとともに、低強度層40を省略した半導体装置を準備し、それぞれについて、同じ実験を行った。
(実施例1)Sn13〜6SbCu(Sn−Sb系はんだ)による層
(実施例2)Zn6〜4Al(Zn−Al系はんだ)による層
(実施例3)Niナノ粒子焼結体による層
(実施例4)Agナノ粒子焼結体による層
(実施例5)TLP接合層(SnCuをインサート材として利用)
(実施例6)TLP接合層(SuNiをインサート材として利用)
(比較例1)Sn13〜6SbCu(Sn−Sb系はんだ)による層
(比較例2)Zn6〜4Al(Zn−Al系はんだ)による層
(比較例3)Niナノ粒子焼結体による層
(比較例4)Agナノ粒子焼結体による層
(比較例5)TLP接合層(SnCuをインサート材として利用)
(比較例6)TLP接合層(SuNiをインサート材として利用)
20:半導体素子
22:半導体基板
30:電極層
40:低強度層
50:接合層
60:導電板
Claims (2)
- 半導体装置であって、
その表面に電極層を備える半導体素子と、
電極層の表面に備えられた低強度層と、
低強度層の表面に備えられた接合層と、
接合層の表面に備えられた導電板と、を有しており、
接合層の強度は、電極層の強度よりも高く、
低強度層の強度は、電極層の強度よりも低い、
ことを特徴とする半導体装置。 - 電極層がAlSiによって形成されており、
低強度層がAlによって形成されている、
ことを特徴とする請求項1に記載の半導体装置。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016219479A (ja) * | 2015-05-15 | 2016-12-22 | トヨタ自動車株式会社 | 半導体装置の製造方法及び半導体装置 |
JP2017011129A (ja) * | 2015-06-23 | 2017-01-12 | 三菱電機株式会社 | 半導体装置 |
JP2017168792A (ja) * | 2016-03-18 | 2017-09-21 | 富士電機株式会社 | 電力用半導体モジュール |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112016006717T5 (de) * | 2016-04-06 | 2019-01-03 | Mitsubishi Electric Corporation | Leistungs-halbleitereinheit |
US20190157235A1 (en) * | 2016-07-28 | 2019-05-23 | Mitsubishi Electric Corporation | Semiconductor device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02308539A (ja) * | 1989-05-23 | 1990-12-21 | Hitachi Ltd | 半導体装置及びその製造方法 |
JPH0964258A (ja) * | 1995-08-25 | 1997-03-07 | Hitachi Ltd | 大電力半導体デバイス |
JP2001110957A (ja) * | 1999-10-07 | 2001-04-20 | Fuji Electric Co Ltd | パワー半導体モジュールの製造方法 |
JP2002231934A (ja) * | 2001-02-07 | 2002-08-16 | Matsushita Electric Ind Co Ltd | チップ型半導体素子及びその製造方法及び接着治具組立構造 |
JP2003059951A (ja) * | 2001-08-08 | 2003-02-28 | Nissan Motor Co Ltd | 半導体実装構造 |
JP2003243585A (ja) * | 2002-02-15 | 2003-08-29 | Matsushita Electric Ind Co Ltd | チップ型半導体素子およびその製造方法 |
JP2007142138A (ja) * | 2005-11-18 | 2007-06-07 | Mitsubishi Electric Corp | 半導体装置 |
JP2009111187A (ja) * | 2007-10-30 | 2009-05-21 | Denso Corp | 半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4077045A (en) * | 1974-01-03 | 1978-02-28 | Motorola, Inc. | Metallization system for semiconductive devices, devices utilizing such metallization system and method for making devices and metallization system |
JP2002203932A (ja) * | 2000-10-31 | 2002-07-19 | Hitachi Ltd | 半導体パワー素子用放熱基板とその導体板及びヒートシンク材並びにロー材 |
JP4363324B2 (ja) | 2004-12-22 | 2009-11-11 | トヨタ自動車株式会社 | 半導体モジュール |
JP2011129619A (ja) | 2009-12-16 | 2011-06-30 | Toyota Motor Corp | 半導体装置の製造方法 |
JP5672719B2 (ja) | 2010-03-03 | 2015-02-18 | 株式会社デンソー | パワー素子を備えた半導体装置の製造方法 |
US8946890B2 (en) * | 2010-10-20 | 2015-02-03 | Marvell World Trade Ltd. | Power/ground layout for chips |
US9142743B2 (en) * | 2011-08-02 | 2015-09-22 | Kabushiki Kaisha Toshiba | High temperature gold-free wafer bonding for light emitting diodes |
JP2014097529A (ja) * | 2012-10-18 | 2014-05-29 | Fuji Electric Co Ltd | 発泡金属による接合方法、半導体装置の製造方法、半導体装置 |
-
2012
- 2012-11-29 JP JP2012261126A patent/JP5686128B2/ja active Active
-
2013
- 2013-11-06 US US14/073,059 patent/US9153525B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02308539A (ja) * | 1989-05-23 | 1990-12-21 | Hitachi Ltd | 半導体装置及びその製造方法 |
JPH0964258A (ja) * | 1995-08-25 | 1997-03-07 | Hitachi Ltd | 大電力半導体デバイス |
JP2001110957A (ja) * | 1999-10-07 | 2001-04-20 | Fuji Electric Co Ltd | パワー半導体モジュールの製造方法 |
JP2002231934A (ja) * | 2001-02-07 | 2002-08-16 | Matsushita Electric Ind Co Ltd | チップ型半導体素子及びその製造方法及び接着治具組立構造 |
JP2003059951A (ja) * | 2001-08-08 | 2003-02-28 | Nissan Motor Co Ltd | 半導体実装構造 |
JP2003243585A (ja) * | 2002-02-15 | 2003-08-29 | Matsushita Electric Ind Co Ltd | チップ型半導体素子およびその製造方法 |
JP2007142138A (ja) * | 2005-11-18 | 2007-06-07 | Mitsubishi Electric Corp | 半導体装置 |
JP2009111187A (ja) * | 2007-10-30 | 2009-05-21 | Denso Corp | 半導体装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016219479A (ja) * | 2015-05-15 | 2016-12-22 | トヨタ自動車株式会社 | 半導体装置の製造方法及び半導体装置 |
JP2017011129A (ja) * | 2015-06-23 | 2017-01-12 | 三菱電機株式会社 | 半導体装置 |
US10347725B2 (en) | 2015-06-23 | 2019-07-09 | Mitsubishi Electric Corporation | Semiconductor device that facilitates a reduction in the occurrences of cracking in a semiconductor layer accompanying thermal stress |
JP2017168792A (ja) * | 2016-03-18 | 2017-09-21 | 富士電機株式会社 | 電力用半導体モジュール |
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