JP2014082316A - Ｓｏｉウェーハの製造方法 - Google Patents

Ｓｏｉウェーハの製造方法 Download PDF

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Publication number
JP2014082316A
JP2014082316A JP2012229111A JP2012229111A JP2014082316A JP 2014082316 A JP2014082316 A JP 2014082316A JP 2012229111 A JP2012229111 A JP 2012229111A JP 2012229111 A JP2012229111 A JP 2012229111A JP 2014082316 A JP2014082316 A JP 2014082316A
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JP
Japan
Prior art keywords
wafer
soi
heat treatment
oxide film
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012229111A
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English (en)
Japanese (ja)
Other versions
JP2014082316A5 (https=
Inventor
Takemine Magari
偉峰 曲
Fumio Tawara
史夫 田原
Hiroyoshi Oi
裕喜 大井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to JP2012229111A priority Critical patent/JP2014082316A/ja
Priority to KR1020157005883A priority patent/KR20150070096A/ko
Priority to US14/426,582 priority patent/US20150287630A1/en
Priority to SG11201501678UA priority patent/SG11201501678UA/en
Priority to CN201380047651.XA priority patent/CN104620351A/zh
Priority to EP13846328.6A priority patent/EP2911183A1/en
Priority to PCT/JP2013/005396 priority patent/WO2014061196A1/ja
Publication of JP2014082316A publication Critical patent/JP2014082316A/ja
Publication of JP2014082316A5 publication Critical patent/JP2014082316A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/20—Doping by irradiation with electromagnetic waves or by particle radiation
    • C30B31/22—Doping by irradiation with electromagnetic waves or by particle radiation by ion-implantation
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/06—Joining of crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
    • H10P14/6309—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6322—Formation by thermal treatments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • H10P36/07—Gettering within semiconductor bodies within silicon bodies of silicon-on-insulator structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/16—Preparing bulk and homogeneous wafers by reclaiming or re-processing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Element Separation (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012229111A 2012-10-16 2012-10-16 Ｓｏｉウェーハの製造方法 Pending JP2014082316A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012229111A JP2014082316A (ja) 2012-10-16 2012-10-16 Ｓｏｉウェーハの製造方法
KR1020157005883A KR20150070096A (ko) 2012-10-16 2013-09-12 Soi 웨이퍼의 제조방법
US14/426,582 US20150287630A1 (en) 2012-10-16 2013-09-12 Method of manufacturing soi wafer
SG11201501678UA SG11201501678UA (en) 2012-10-16 2013-09-12 Method of manufacturing soi wafer
CN201380047651.XA CN104620351A (zh) 2012-10-16 2013-09-12 Soi晶圆的制造方法
EP13846328.6A EP2911183A1 (en) 2012-10-16 2013-09-12 Soi wafer manufacturing method
PCT/JP2013/005396 WO2014061196A1 (ja) 2012-10-16 2013-09-12 Ｓｏｉウェーハの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012229111A JP2014082316A (ja) 2012-10-16 2012-10-16 Ｓｏｉウェーハの製造方法

Publications (2)

Publication Number Publication Date
JP2014082316A true JP2014082316A (ja) 2014-05-08
JP2014082316A5 JP2014082316A5 (https=) 2015-05-14

Family

ID=50487777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012229111A Pending JP2014082316A (ja) 2012-10-16 2012-10-16 Ｓｏｉウェーハの製造方法

Country Status (7)

Country Link
US (1) US20150287630A1 (https=)
EP (1) EP2911183A1 (https=)
JP (1) JP2014082316A (https=)
KR (1) KR20150070096A (https=)
CN (1) CN104620351A (https=)
SG (1) SG11201501678UA (https=)
WO (1) WO2014061196A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7172747B2 (ja) * 2019-03-06 2022-11-16 信越半導体株式会社 シリコン単結晶の抵抗率測定方法
KR102810331B1 (ko) * 2019-05-23 2025-05-20 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 시스템
US12164126B2 (en) * 2021-06-30 2024-12-10 Openlight Photonics, Inc. High bandwidth photonic integrated circuit with etalon compensation
CN113655094B (zh) * 2021-08-06 2024-01-19 上海新昇半导体科技有限公司 一种确定硅片导电类型的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004073057A1 (ja) * 2003-02-14 2004-08-26 Sumitomo Mitsubishi Silicon Corporation シリコンウェーハの製造方法
WO2008007508A1 (en) * 2006-07-14 2008-01-17 Shin-Etsu Handotai Co., Ltd. Method for reusing removed wafer
JP2012153548A (ja) * 2011-01-24 2012-08-16 Shin Etsu Handotai Co Ltd シリコン単結晶ウェーハの製造方法及びアニールウェーハ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294737A (ja) * 2005-04-07 2006-10-26 Sumco Corp Ｓｏｉ基板の製造方法及びその製造における剥離ウェーハの再生処理方法。
JP4715470B2 (ja) 2005-11-28 2011-07-06 株式会社Sumco 剥離ウェーハの再生加工方法及びこの方法により再生加工された剥離ウェーハ
SG173283A1 (en) 2010-01-26 2011-08-29 Semiconductor Energy Lab Method for manufacturing soi substrate
JP5565079B2 (ja) 2010-05-10 2014-08-06 信越半導体株式会社 Ｓｏｉウェーハの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004073057A1 (ja) * 2003-02-14 2004-08-26 Sumitomo Mitsubishi Silicon Corporation シリコンウェーハの製造方法
WO2008007508A1 (en) * 2006-07-14 2008-01-17 Shin-Etsu Handotai Co., Ltd. Method for reusing removed wafer
JP2008021892A (ja) * 2006-07-14 2008-01-31 Shin Etsu Handotai Co Ltd 剥離ウェーハを再利用する方法
JP2012153548A (ja) * 2011-01-24 2012-08-16 Shin Etsu Handotai Co Ltd シリコン単結晶ウェーハの製造方法及びアニールウェーハ

Also Published As

Publication number Publication date
KR20150070096A (ko) 2015-06-24
SG11201501678UA (en) 2015-04-29
US20150287630A1 (en) 2015-10-08
CN104620351A (zh) 2015-05-13
WO2014061196A1 (ja) 2014-04-24
EP2911183A1 (en) 2015-08-26

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