JP2014062327A - 蒸着用マスク、その製造方法及び製造装置 - Google Patents
蒸着用マスク、その製造方法及び製造装置 Download PDFInfo
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000003466 welding Methods 0.000 claims abstract description 76
- 238000000151 deposition Methods 0.000 claims description 17
- 230000008021 deposition Effects 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 5
- 238000001704 evaporation Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 3
- 238000000427 thin-film deposition Methods 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Laser Beam Processing (AREA)
Abstract
【解決手段】第1分割マスク170a及び第2分割マスク170bを含む蒸着用マスクにおいて、第1分割マスク170a及び第2分割マスク170bは直接溶接され、各分割マスクの相互に対向する側面に溶接面が形成されることを特徴とする。本発明は補助フレームを用いず、分割マスクを直接溶接するため、従来のようなシャドー現象が発生せず、破断強度においても好適な溶接品質を確保することができる蒸着用マスクが提供される。
【選択図】図5B
Description
2 真空チャンバ
3 薄膜蒸着容器
4 フレーム
5 対象物
6 マグネットユニット
110 作業ステージ
120 マスター基板
130 クランプ
140 押圧板
150 CCDカメラ
160 レーザ溶接部
170a、170b 第1及び第2分割マスク
180a、180b 第1及び第2ローラ部
190 ガイドバー
191 支持部
Claims (14)
- 第1分割マスク及び第2分割マスクを含む蒸着用マスクにおいて、
前記第1分割マスク及び前記第2分割マスクは直接溶接され、各分割マスクの相互に対向する側面に溶接面が形成されていることを特徴とする蒸着用マスク。 - 前記第1分割マスク及び前記第2分割マスクは上面にバリを含み、前記バリの高さは10μm以下であることを特徴とする請求項1に記載の蒸着用マスク。
- 前記第1分割マスクと前記第2分割マスクとの間隔は、前記各分割マスクの厚さtの10%以下であることを特徴とする請求項1に記載の蒸着用マスク。
- 作業ステージ上部に第1分割マスク及び第2分割マスクをアラインメントする段階と、
クランプを移動させて前記第1分割マスク及び前記第2分割マスクを固定する段階と、
溶接部位の押圧板を移動させて前記第1分割マスク及び前記第2分割マスクの溶接予定領域周辺を密着する段階と、
レーザ溶接部を駆動させて前記溶接予定領域を溶接する段階と、
を含むことを特徴とする蒸着用マスクの製造方法。 - 前記作業ステージ上にはマスター基板が位置し、前記第1分割マスク及び前記第2分割マスクは、前記マスター基板上にアラインメントされることを特徴とする請求項4に記載の蒸着用マスクの製造方法。
- 前記第1分割マスクと前記第2分割マスクとの間隔は、前記各分割マスクの厚さtの10%以下であることを特徴とする請求項4に記載の蒸着用マスクの製造方法。
- 前記レーザ溶接部の前後にある第1ローラ部及び第2ローラ部のいずれか又は両方を用いて、溶接作業を行いながら分割マスクと作業ステージとを密着させることを特徴とする請求項4に記載の蒸着用マスクの製造方法。
- 前記レーザ溶接部の前後にある第1ローラ部及び第2ローラ部のいずれか又は両方を用いて、溶接によってそれぞれの分割マスクの上面に発生したバリを平坦化することを特徴とする請求項4に記載の蒸着用マスクの製造方法。
- 前記レーザ溶接部によって発生するレーザビームプロファイルには、レーザビーム強度の最高ピークである位置が複数個存在することを特徴とする請求項4に記載の蒸着用マスクの製造方法。
- 作業ステージと、
前記作業ステージ上部に位置する第1分割マスク及び第2分割マスクと、
前記作業ステージ上に位置し、前記第1分割マスク及び前記第2分割マスクを固定するためのクランプと、
前記作業ステージ上に位置し、前記第1分割マスク及び前記第2分割マスクを溶接予定領域に密着するための溶接部位の押圧板と、
前記作業ステージ上部に位置するレーザ溶接部と、
を含むことを特徴とする蒸着用マスクの製造装置。 - 前記作業ステージ上に位置するマスター基板をさらに含み、前記第1分割マスク及び前記第2分割マスクは、前記マスター基板上に位置することを特徴とする請求項10に記載の蒸着用マスクの製造装置。
- 前記レーザ溶接部の前後にそれぞれ第1ローラ部及び第2ローラ部をさらに含むことを特徴とする請求項10に記載の蒸着用マスクの製造装置。
- 前記レーザ溶接部によって発生したレーザビームプロファイルには、レーザビーム強度の最高ピークである位置が複数個存在することを特徴とする請求項10に記載の蒸着用マスクの製造装置。
- 前記レーザ溶接部を含む支持部をさらに含み、前記第1ローラ部及び前記第2ローラ部は、前記支持部に位置することを特徴とする請求項12に記載の蒸着用マスクの製造装置。
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KR10-2009-0124209 | 2009-12-14 | ||
KR1020090124209A KR101182235B1 (ko) | 2009-12-14 | 2009-12-14 | 증착용 마스크, 그의 제조 방법 및 제조 장치 |
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JP2014062327A true JP2014062327A (ja) | 2014-04-10 |
JP5770248B2 JP5770248B2 (ja) | 2015-08-26 |
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JP2013229759A Expired - Fee Related JP5770248B2 (ja) | 2009-12-14 | 2013-11-05 | 蒸着用マスクの製造方法及び製造装置 |
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US (1) | US9259805B2 (ja) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018146904A1 (ja) * | 2017-02-10 | 2018-08-16 | 株式会社ジャパンディスプレイ | 蒸着マスク、蒸着マスクの製造方法および蒸着マスクの製造装置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101309864B1 (ko) * | 2010-02-02 | 2013-09-16 | 엘지디스플레이 주식회사 | 마스크 어셈블리 |
JP2012017456A (ja) | 2010-06-11 | 2012-01-26 | Fujifilm Corp | ポリエステルフィルム及びその製造方法、太陽電池用バックシート、並びに太陽電池モジュール |
KR20130028165A (ko) * | 2011-06-21 | 2013-03-19 | 삼성디스플레이 주식회사 | 마스크 유닛 |
KR102162790B1 (ko) * | 2013-05-02 | 2020-10-08 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체용 용접기 |
JP6108544B2 (ja) * | 2013-06-17 | 2017-04-05 | 新東エスプレシジョン株式会社 | マスク製造装置 |
CN104916293B (zh) * | 2015-06-03 | 2017-08-08 | 深圳粤宝电子工业总公司 | 一种基于激光焊接的磁头制造装置及制造磁头的方法 |
KR102549358B1 (ko) | 2015-11-02 | 2023-06-29 | 삼성디스플레이 주식회사 | 증착 마스크 조립체 및 이를 이용한 표시 장치의 제조 방법 |
DE102016101620A1 (de) * | 2016-01-29 | 2017-08-03 | Biotronik Se & Co. Kg | Batteriebrücke und Verfahren zum Aktivieren einer elektronischen Vorrichtung |
JP6585669B2 (ja) * | 2017-07-25 | 2019-10-02 | 新東エスプレシジョン株式会社 | マスク製造装置 |
KR102411536B1 (ko) * | 2017-10-11 | 2022-06-22 | 삼성디스플레이 주식회사 | 증착 마스크 제조방법 및 제조장치 |
KR101962738B1 (ko) | 2018-04-23 | 2019-03-27 | (주)에이디엠 | 시트분리장치 및 이를 구비한 마스크 제조 시스템 |
CN108707862B (zh) * | 2018-06-26 | 2020-07-03 | 武汉华星光电半导体显示技术有限公司 | 压板及检测设备 |
GB202005541D0 (en) * | 2020-04-16 | 2020-06-03 | M Solv Ltd | Method and apparatus for performing laser ablation |
KR20220010687A (ko) | 2020-07-17 | 2022-01-26 | 삼성디스플레이 주식회사 | 마스크 및 마스크 제조방법 |
CN114179260B (zh) * | 2021-11-18 | 2023-03-24 | 扬昕科技(苏州)有限公司 | 导光板成型模具的制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6188989A (ja) * | 1984-10-05 | 1986-05-07 | Dowa Koei Kk | レ−ザ−ビ−ムによる突き合わせ溶接法 |
JP2004091830A (ja) * | 2002-08-30 | 2004-03-25 | Hirai Seimitsu Kogyo Corp | 金属マスクとその製造方法 |
KR20090034567A (ko) * | 2007-10-04 | 2009-04-08 | 주식회사 성우하이텍 | 알루미늄 블랭크의 전도 레이저 용접장치 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3816696A (en) * | 1971-12-20 | 1974-06-11 | Guild Metal Joining Equipment | Strip shearing and welding apparatus |
JPS59135886U (ja) * | 1983-02-28 | 1984-09-11 | 川崎製鉄株式会社 | レ−ザ−溶接機 |
DE3909620A1 (de) * | 1989-03-23 | 1990-09-27 | Bernd Buedenbender | Verfahren zum stumpfschweissen von blechen |
US4990741A (en) * | 1990-02-06 | 1991-02-05 | Rockwell International Corporation | Method of laser welding |
US5595670A (en) * | 1995-04-17 | 1997-01-21 | The Twentyfirst Century Corporation | Method of high speed high power welding |
US5674420A (en) * | 1995-06-12 | 1997-10-07 | Worthington Industries Incorporated | Clamping device for welding machine |
DE19724986C2 (de) * | 1997-06-13 | 1999-07-29 | Jurca Optoelektronik Gmbh | Verfahren zum Verschweißen von Werkstücken und Vorrichtung zu dessen Durchführung |
US5961859A (en) * | 1997-10-23 | 1999-10-05 | Trw Inc. | Method and apparatus for monitoring laser weld quality via plasma size measurements |
KR100655525B1 (ko) * | 1998-11-18 | 2006-12-07 | 엘파트로닉 아게 | 레이저에 의한 강판의 용접 장치 및 그 용접 장치의 용도 |
KR100315745B1 (ko) * | 1999-10-12 | 2001-12-13 | 이계안 | 시임용접용 용접위치 결정장치 |
EP1534495A1 (en) * | 2002-07-12 | 2005-06-01 | E. I. du Pont de Nemours and Company | A process for laser welding together articles of polyester resin compositions and related products |
JP4688423B2 (ja) * | 2004-02-27 | 2011-05-25 | 独立行政法人物質・材料研究機構 | レーザ溶接方法 |
CA2615093A1 (en) * | 2005-07-13 | 2007-01-18 | The Furukawa Electric Co., Ltd. | Light irradiating apparatus and welding method |
KR20070027300A (ko) | 2005-09-06 | 2007-03-09 | 오리온오엘이디 주식회사 | 새도우마스크 및 그 제조 방법 |
KR100830321B1 (ko) | 2006-11-22 | 2008-05-19 | 삼성에스디아이 주식회사 | 증착용 메탈 마스크 및 증착용 메탈 마스크를 이용한표시장치용 화소 증착 방법 |
US20080128053A1 (en) * | 2006-12-05 | 2008-06-05 | Noble Advanced Technologies | Method of manufacturing a welded metal panel having a high quality surface finish |
KR20080054741A (ko) | 2006-12-13 | 2008-06-19 | 엘지디스플레이 주식회사 | 유기전계발광소자용 프레임 마스크 조립체 및 이의제작방법 |
KR100873551B1 (ko) | 2006-12-20 | 2008-12-11 | 박근노 | 레이저 용접장치 |
KR101322130B1 (ko) | 2006-12-22 | 2013-10-25 | 엘지디스플레이 주식회사 | 대면적 증착용 마스크 및 대면적 증착용 마스크의 제조방법 |
JP2008183604A (ja) | 2007-01-31 | 2008-08-14 | Fuji Electric Device Technology Co Ltd | レーザ溶接装置およびレーザ溶接方法 |
US8728719B2 (en) * | 2009-08-19 | 2014-05-20 | Lawrence Livermore National Security, Llc | Diffractive laser beam homogenizer including a photo-active material and method of fabricating the same |
-
2009
- 2009-12-14 KR KR1020090124209A patent/KR101182235B1/ko active IP Right Grant
-
2010
- 2010-08-03 JP JP2010174407A patent/JP2011122235A/ja active Pending
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6188989A (ja) * | 1984-10-05 | 1986-05-07 | Dowa Koei Kk | レ−ザ−ビ−ムによる突き合わせ溶接法 |
JP2004091830A (ja) * | 2002-08-30 | 2004-03-25 | Hirai Seimitsu Kogyo Corp | 金属マスクとその製造方法 |
KR20090034567A (ko) * | 2007-10-04 | 2009-04-08 | 주식회사 성우하이텍 | 알루미늄 블랭크의 전도 레이저 용접장치 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018146904A1 (ja) * | 2017-02-10 | 2018-08-16 | 株式会社ジャパンディスプレイ | 蒸着マスク、蒸着マスクの製造方法および蒸着マスクの製造装置 |
JP2018127704A (ja) * | 2017-02-10 | 2018-08-16 | 株式会社ジャパンディスプレイ | 蒸着マスク、蒸着マスクの製造方法および蒸着マスクの製造装置 |
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KR20110067566A (ko) | 2011-06-22 |
CN102094167A (zh) | 2011-06-15 |
JP2011122235A (ja) | 2011-06-23 |
KR101182235B1 (ko) | 2012-09-12 |
US20110139365A1 (en) | 2011-06-16 |
US9259805B2 (en) | 2016-02-16 |
JP5770248B2 (ja) | 2015-08-26 |
CN102094167B (zh) | 2015-04-01 |
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