CN102094167A - 用于蒸发的掩模以及用于制造该掩模的方法和装置 - Google Patents
用于蒸发的掩模以及用于制造该掩模的方法和装置 Download PDFInfo
- Publication number
- CN102094167A CN102094167A CN2010105891945A CN201010589194A CN102094167A CN 102094167 A CN102094167 A CN 102094167A CN 2010105891945 A CN2010105891945 A CN 2010105891945A CN 201010589194 A CN201010589194 A CN 201010589194A CN 102094167 A CN102094167 A CN 102094167A
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- Prior art keywords
- separate masks
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- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000001704 evaporation Methods 0.000 title abstract description 31
- 230000008020 evaporation Effects 0.000 title abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 139
- 238000003825 pressing Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 2
- 239000012044 organic layer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0124209 | 2009-12-14 | ||
KR1020090124209A KR101182235B1 (ko) | 2009-12-14 | 2009-12-14 | 증착용 마스크, 그의 제조 방법 및 제조 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102094167A true CN102094167A (zh) | 2011-06-15 |
CN102094167B CN102094167B (zh) | 2015-04-01 |
Family
ID=44127433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010589194.5A Expired - Fee Related CN102094167B (zh) | 2009-12-14 | 2010-12-10 | 用于蒸发的掩模以及用于制造该掩模的方法和装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9259805B2 (zh) |
JP (2) | JP2011122235A (zh) |
KR (1) | KR101182235B1 (zh) |
CN (1) | CN102094167B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104128720A (zh) * | 2013-05-02 | 2014-11-05 | 三星显示有限公司 | 用于掩模框架组件的焊接装置和焊接掩模框架组件的方法 |
CN104233186A (zh) * | 2013-06-17 | 2014-12-24 | 新东超精密有限公司 | 掩模制造装置 |
CN104916293A (zh) * | 2015-06-03 | 2015-09-16 | 深圳粤宝电子工业总公司 | 一种基于激光焊接的磁头制造装置及制造磁头的方法 |
CN108707862A (zh) * | 2018-06-26 | 2018-10-26 | 武汉华星光电半导体显示技术有限公司 | 压板及检测设备 |
CN109302779A (zh) * | 2017-07-25 | 2019-02-01 | 新东超精密有限公司 | 掩模制造装置 |
CN109659449A (zh) * | 2017-10-11 | 2019-04-19 | 三星显示有限公司 | 沉积掩模制造方法 |
CN110268090A (zh) * | 2017-02-10 | 2019-09-20 | 株式会社日本显示器 | 蒸镀掩模、蒸镀掩模的制造方法及蒸镀掩模的制造装置 |
CN114179260A (zh) * | 2021-11-18 | 2022-03-15 | 扬昕科技(苏州)有限公司 | 导光板成型模具的制造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101309864B1 (ko) * | 2010-02-02 | 2013-09-16 | 엘지디스플레이 주식회사 | 마스크 어셈블리 |
JP2012017456A (ja) | 2010-06-11 | 2012-01-26 | Fujifilm Corp | ポリエステルフィルム及びその製造方法、太陽電池用バックシート、並びに太陽電池モジュール |
KR20130028165A (ko) * | 2011-06-21 | 2013-03-19 | 삼성디스플레이 주식회사 | 마스크 유닛 |
KR102549358B1 (ko) * | 2015-11-02 | 2023-06-29 | 삼성디스플레이 주식회사 | 증착 마스크 조립체 및 이를 이용한 표시 장치의 제조 방법 |
DE102016101620A1 (de) * | 2016-01-29 | 2017-08-03 | Biotronik Se & Co. Kg | Batteriebrücke und Verfahren zum Aktivieren einer elektronischen Vorrichtung |
KR101962738B1 (ko) | 2018-04-23 | 2019-03-27 | (주)에이디엠 | 시트분리장치 및 이를 구비한 마스크 제조 시스템 |
KR20220010687A (ko) | 2020-07-17 | 2022-01-26 | 삼성디스플레이 주식회사 | 마스크 및 마스크 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080054741A (ko) * | 2006-12-13 | 2008-06-19 | 엘지디스플레이 주식회사 | 유기전계발광소자용 프레임 마스크 조립체 및 이의제작방법 |
KR20090034567A (ko) * | 2007-10-04 | 2009-04-08 | 주식회사 성우하이텍 | 알루미늄 블랭크의 전도 레이저 용접장치 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3816696A (en) * | 1971-12-20 | 1974-06-11 | Guild Metal Joining Equipment | Strip shearing and welding apparatus |
JPS59135886U (ja) * | 1983-02-28 | 1984-09-11 | 川崎製鉄株式会社 | レ−ザ−溶接機 |
JPS6188989A (ja) | 1984-10-05 | 1986-05-07 | Dowa Koei Kk | レ−ザ−ビ−ムによる突き合わせ溶接法 |
DE3909620A1 (de) * | 1989-03-23 | 1990-09-27 | Bernd Buedenbender | Verfahren zum stumpfschweissen von blechen |
US4990741A (en) * | 1990-02-06 | 1991-02-05 | Rockwell International Corporation | Method of laser welding |
US5595670A (en) * | 1995-04-17 | 1997-01-21 | The Twentyfirst Century Corporation | Method of high speed high power welding |
US5674420A (en) * | 1995-06-12 | 1997-10-07 | Worthington Industries Incorporated | Clamping device for welding machine |
DE19724986C2 (de) * | 1997-06-13 | 1999-07-29 | Jurca Optoelektronik Gmbh | Verfahren zum Verschweißen von Werkstücken und Vorrichtung zu dessen Durchführung |
US5961859A (en) * | 1997-10-23 | 1999-10-05 | Trw Inc. | Method and apparatus for monitoring laser weld quality via plasma size measurements |
US6713712B1 (en) * | 1998-11-18 | 2004-03-30 | Elpatronic Ag | Method and device for laser welding metal sheets |
KR100315745B1 (ko) * | 1999-10-12 | 2001-12-13 | 이계안 | 시임용접용 용접위치 결정장치 |
AU2003251868A1 (en) * | 2002-07-12 | 2004-02-02 | E. I. Du Pont De Nemours And Company | A process for laser welding together articles of polyester resin compositions and related products |
JP3785509B2 (ja) * | 2002-08-30 | 2006-06-14 | 平井精密工業株式会社 | 金属マスクとその製造方法 |
JP4688423B2 (ja) * | 2004-02-27 | 2011-05-25 | 独立行政法人物質・材料研究機構 | レーザ溶接方法 |
EP1909366A4 (en) * | 2005-07-13 | 2009-07-08 | Furukawa Electric Co Ltd | LIGHT IRRADIATION DEVICE AND WELDING METHOD |
KR20070027300A (ko) | 2005-09-06 | 2007-03-09 | 오리온오엘이디 주식회사 | 새도우마스크 및 그 제조 방법 |
KR100830321B1 (ko) | 2006-11-22 | 2008-05-19 | 삼성에스디아이 주식회사 | 증착용 메탈 마스크 및 증착용 메탈 마스크를 이용한표시장치용 화소 증착 방법 |
WO2008070710A1 (en) * | 2006-12-05 | 2008-06-12 | Noble Advanced Technologies | Method of manufacturing a welded metal panel having a high quality surface finish |
KR100873551B1 (ko) | 2006-12-20 | 2008-12-11 | 박근노 | 레이저 용접장치 |
KR101322130B1 (ko) | 2006-12-22 | 2013-10-25 | 엘지디스플레이 주식회사 | 대면적 증착용 마스크 및 대면적 증착용 마스크의 제조방법 |
JP2008183604A (ja) | 2007-01-31 | 2008-08-14 | Fuji Electric Device Technology Co Ltd | レーザ溶接装置およびレーザ溶接方法 |
US8728719B2 (en) * | 2009-08-19 | 2014-05-20 | Lawrence Livermore National Security, Llc | Diffractive laser beam homogenizer including a photo-active material and method of fabricating the same |
-
2009
- 2009-12-14 KR KR1020090124209A patent/KR101182235B1/ko active IP Right Grant
-
2010
- 2010-08-03 JP JP2010174407A patent/JP2011122235A/ja active Pending
- 2010-12-09 US US12/964,706 patent/US9259805B2/en not_active Expired - Fee Related
- 2010-12-10 CN CN201010589194.5A patent/CN102094167B/zh not_active Expired - Fee Related
-
2013
- 2013-11-05 JP JP2013229759A patent/JP5770248B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080054741A (ko) * | 2006-12-13 | 2008-06-19 | 엘지디스플레이 주식회사 | 유기전계발광소자용 프레임 마스크 조립체 및 이의제작방법 |
KR20090034567A (ko) * | 2007-10-04 | 2009-04-08 | 주식회사 성우하이텍 | 알루미늄 블랭크의 전도 레이저 용접장치 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104128720A (zh) * | 2013-05-02 | 2014-11-05 | 三星显示有限公司 | 用于掩模框架组件的焊接装置和焊接掩模框架组件的方法 |
CN104233186A (zh) * | 2013-06-17 | 2014-12-24 | 新东超精密有限公司 | 掩模制造装置 |
CN104233186B (zh) * | 2013-06-17 | 2016-09-21 | 新东超精密有限公司 | 掩模制造装置 |
CN104916293A (zh) * | 2015-06-03 | 2015-09-16 | 深圳粤宝电子工业总公司 | 一种基于激光焊接的磁头制造装置及制造磁头的方法 |
CN104916293B (zh) * | 2015-06-03 | 2017-08-08 | 深圳粤宝电子工业总公司 | 一种基于激光焊接的磁头制造装置及制造磁头的方法 |
CN110268090A (zh) * | 2017-02-10 | 2019-09-20 | 株式会社日本显示器 | 蒸镀掩模、蒸镀掩模的制造方法及蒸镀掩模的制造装置 |
CN109302779A (zh) * | 2017-07-25 | 2019-02-01 | 新东超精密有限公司 | 掩模制造装置 |
CN109302779B (zh) * | 2017-07-25 | 2020-07-03 | 新东超精密有限公司 | 掩模制造装置 |
TWI729302B (zh) * | 2017-07-25 | 2021-06-01 | 日商新東超精密有限公司 | 遮罩製造裝置 |
CN109659449A (zh) * | 2017-10-11 | 2019-04-19 | 三星显示有限公司 | 沉积掩模制造方法 |
CN109659449B (zh) * | 2017-10-11 | 2024-01-09 | 三星显示有限公司 | 沉积掩模制造方法 |
CN108707862A (zh) * | 2018-06-26 | 2018-10-26 | 武汉华星光电半导体显示技术有限公司 | 压板及检测设备 |
CN114179260A (zh) * | 2021-11-18 | 2022-03-15 | 扬昕科技(苏州)有限公司 | 导光板成型模具的制造方法 |
CN114179260B (zh) * | 2021-11-18 | 2023-03-24 | 扬昕科技(苏州)有限公司 | 导光板成型模具的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2014062327A (ja) | 2014-04-10 |
US9259805B2 (en) | 2016-02-16 |
US20110139365A1 (en) | 2011-06-16 |
KR101182235B1 (ko) | 2012-09-12 |
JP5770248B2 (ja) | 2015-08-26 |
CN102094167B (zh) | 2015-04-01 |
JP2011122235A (ja) | 2011-06-23 |
KR20110067566A (ko) | 2011-06-22 |
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