JP6591625B2 - 樹脂フィルムの剥離方法、フレキシブル基板を有する電子デバイスの製造方法および有機el表示装置の製造方法ならびに樹脂フィルムの剥離装置 - Google Patents
樹脂フィルムの剥離方法、フレキシブル基板を有する電子デバイスの製造方法および有機el表示装置の製造方法ならびに樹脂フィルムの剥離装置 Download PDFInfo
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Description
11 樹脂フィルム
11b 未剥離部分の端部
12 電子素子
2 支持基板(ガラス板)
21 第1部分
21a 第1部分の一面
22 第2部分
22a 第2部分の第1部分側の端縁
23 スクライブ線
3 把持具
33 支軸
51 平坦化膜
52 第1電極(陽極)
53 絶縁バンク
55 有機層
56 第2電極(陰極)
57 保護膜
6 スロットダイ
70 フィルムの剥離装置
73 第2部分の把持具
74 第1部分の保持具
75 第1駆動部
76 回転駆動部
77 第2駆動部
d 垂直方向の移動距離
Pa 平行方向
Ve 垂直方向
Claims (6)
- 支持基板の一面に密着して形成された樹脂フィルムを前記支持基板から剥離する方法であって、
前記支持基板を、第1部分と第2部分とに分離の準備をする工程、および
前記支持基板の前記第2部分の一面に前記樹脂フィルムが密着した状態で、前記支持基板の前記第1部分と、前記第2部分の少なくとも前記第1部分側の端縁とを前記第1部分の一面と垂直方向において離間するように相対移動させると共に、前記第1部分および第2部分の少なくとも一方を、前記第1部分の前記一面と平行方向に自由移動させ、または強制移動させる工程、
を含み、
前記第1部分と前記第2部分の前記端縁との前記垂直方向における離間を、前記第2部分の端縁が前記第1部分の前記一面と一定距離だけ離間した後、前記端縁と平行で、かつ、前記第1部分と反対側に設けられる支軸の周りに前記端縁を回転させることにより、徐々に行い、
前記樹脂フィルムの既に剥離した部分と前記第1部分の前記一面とのなす角が小さくなるように前記端縁を回転させることを特徴とする樹脂フィルムの剥離方法。 - 支持基板の一面に密着して形成された樹脂フィルムを前記支持基板から剥離する方法であって、
前記支持基板を、第1部分と第2部分とに分離の準備をする工程、および
前記支持基板の前記第2部分の一面に前記樹脂フィルムが密着した状態で、前記支持基板の前記第1部分と、前記第2部分の少なくとも前記第1部分側の端縁とを前記第1部分の一面と垂直方向において離間するように相対移動させると共に、前記第1部分および第2部分の少なくとも一方を、前記第1部分の前記一面と平行方向に自由移動させ、または強制移動させる工程、
を含み、
前記第1部分と前記第2部分の前記端縁との前記垂直方向における離間を、前記第2部分の前記端縁と前記第1部分の前記一面とを前記垂直方向に相対移動させることにより行い、
前記第1部分および第2部分の少なくとも一方の前記平行方向への移動が、前記第1部分と前記第2部分とが平面視で重なる方向への移動であり、
前記第1部分と前記第2部分の前記端縁とを前記垂直方向に離間させたときの、前記樹脂フィルムの前記第1部分との密着部分と前記第2部分の前記端縁とで緊張したときの前記樹脂フィルムと前記第1部分の前記一面とのなす角度をθとするとき、前記垂直方向への離間距離dごとに、前記平行方向にd×tan(θ/2)だけ移動させる、樹脂フィルムの剥離方法。 - 前記支持基板がガラス板またはセラミック基板からなり、前記第1部分と第2部分とに分離の準備をする工程を前記支持基板の前記樹脂フィルムが形成された面と反対面から入れられたスクライブ線に沿って前記支持基板を割断することにより行う請求項1または2記載の樹脂フィルムの剥離方法。
- 支持基板の一面に密着して形成された樹脂フィルムを前記支持基板から剥離する方法であって、
前記支持基板を、第1部分と第2部分とに分離の準備をする工程、および
前記支持基板の前記第2部分の一面に前記樹脂フィルムが密着した状態で、前記支持基板の前記第1部分と、前記第2部分の少なくとも前記第1部分側の端縁とを前記第1部分の一面と垂直方向において離間するように相対移動させると共に、前記第1部分および第2部分の少なくとも一方を、前記第1部分の前記一面と平行方向に自由移動させ、または強制移動させる工程、
を含み、
前記第1部分と前記第2部分とが着脱自在に接続され、前記分離の準備をする工程を、前記第1部分と前記第2部分とを離脱できるようにすることにより行う、樹脂フィルムの剥離方法。 - 第1部分と第2部分とを有する支持基板の一面に可撓性の樹脂フィルムを形成する工程、
前記樹脂フィルム上に電子素子を形成する工程、および
前記電子素子が形成された樹脂フィルムを前記支持基板から剥離する工程
を含む、フレキシブル基板を有する電子デバイスを製造する方法であって、
前記樹脂フィルムの剥離を請求項1〜4のいずれか1項に記載の方法で行うフレキシブル基板を有する電子デバイスの製造方法。 - 前記樹脂フィルムの形成を、前記支持基板上にポリイミドからなる液状樹脂を塗布し、前記樹脂フィルムと前記支持基板との密着力が、0.1N/10mm以上であって、1N/10mm以下になるように形成することにより行う請求項5記載の電子デバイスの製造方法。
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